Semiconductor system including semiconductor device for performing defective analysis

    公开(公告)号:US12131791B2

    公开(公告)日:2024-10-29

    申请号:US18070606

    申请日:2022-11-29

    申请人: SK hynix Inc.

    发明人: Byung Goo Cho

    IPC分类号: G11C29/44 G11C29/18 G11C29/52

    摘要: A semiconductor system includes a controller configured to: select a plurality of fail points based on defect analysis information collected in a process stage, and provide an address designating at least one of the fail points together with a partial reset command; and a semiconductor device including a plurality of functional regions each including one or more of the fail points, the semiconductor device configured to reset, in response to the partial reset command, a sequential circuit disposed in a target functional region corresponding to the address among the functional regions.

    DATA PATH SIGNAL AMPLIFICATION IN COUPLED SEMICONDUCTOR SYSTEMS

    公开(公告)号:US20240355371A1

    公开(公告)日:2024-10-24

    申请号:US18607033

    申请日:2024-03-15

    IPC分类号: G11C7/10 G11C7/22 G11C29/52

    摘要: Methods, systems, and devices for data path signal amplification in coupled semiconductor systems are described. A semiconductor system may implement a first die including memory arrays and a second die including a host interface. The first die may include a first portion of a data path between the memory arrays and the host interface, including a first portion of data path signal amplification circuitry. The second die may include a second portion of the data path, including a second portion of data path signal amplification circuitry. The semiconductor system may implement fine-pitch interconnection between dies to support a relatively greater quantity of signal paths of the data path which, in some examples, may support reducing or eliminating serialization/deserialization circuitry associated with coarser interconnection. In some implementations, a semiconductor system may implement a switching component operable to switch between data paths having different amplification configurations of the dies.

    ADAPTIVE BLOCK FAMILY ERROR AVOIDANCE SCAN BASED ON DYNAMIC PAGE ERROR STATISTICS

    公开(公告)号:US20240339172A1

    公开(公告)日:2024-10-10

    申请号:US18624720

    申请日:2024-04-02

    IPC分类号: G11C29/52 G11C29/02

    摘要: Aspects of the present disclosure are directed to a memory sub-system using a block family error avoidance (BFEA) scan to adjust read voltages. Three-level cell (TLC) memory stores three bits per cell. Due to variances in manufacturing and degradation over time, the actual voltages stored in the memory cells deviate from the target voltages. As a result, the comparisons between the read voltages and the stored voltages may generate erroneous results. A BFEA scan may be based on a single wordline and single page type. However, determining a single threshold voltage shift to apply to all read voltages may not compensate for all causes of voltage shifting. Accordingly, a BFEA scan may use multiple wordlines (e.g., one for each page) and determine different voltage offset values for each page. As a result, the accuracy of the read voltage applied is increased and the bit error rate (BER) is reduced.