摘要:
A temperature sensor has a sensing element (13) consisting of a thermistor (11) and leads (12) and a sheath pin (15) containing core wires (14), to accurately detect temperature. A method of manufacturing such a temperature sensor includes the steps of connecting the leads to the core wires, arranging an insulator (130) around the sensing element, filling the insulator with an inorganic adhesive (135) to fix the sensing element in the insulator, arranging a metal cover (16) around the insulator, and joining an end of the metal cover to an end of the sheath pin.
摘要:
For manufacturing of sensors, especially temperature sensors, respectively two connection bridges spaced in the grid of a continuous carrier strip with contact pads for later electrical and mechanical connection with respectively one sensor element in the continuous carrier strip are at least partially injection molded around with plastic, such that on the connection bridges at least two plastic bodies arise arranged at a distance to each other. Between plastic bodies of respectively adjacent connection bridges, spacer elements made of plastic are formed in the same injection operation, while contact pads and ends of the connection bridges remain free of plastic. In connection with the injection operation, the edges of the carrier strip are separated from the connection bridges by punching. On the respective connection areas of two connection bridges, held together in pairs by means of plastic bodies, the actual sensor elements are installed and connected electrically and mechanically firmly with the contact pads by soldering. Subsequently, there follows a separation of sensors by detaching the spacer elements from the respective plastic bodies. A comparatively simple manufacturing process, as well as a function test, in the form of a multi-unit preform proves to be advantageous. Furthermore, by bending along the connection bridges, an adaptation to a customer-specific housing shape can be brought about.
摘要:
A plastic thermistor comprising a polyamide composition which comprises 100 wt. parts of a polyamide and 5.3 to 30 wt. parts of zinc iodide, or a polyamide composition which comprises a polyamide, an iodine-containing compound, and a metal oxide such as zinc oxide. Ion carrier properties of a metal iodide greatly increases temperature dependence of impedance, and the metal oxide such as zinc iodide functions as a receptor for iodide ions and prevents the formation of a metal iodide on the surfaces of metal electrodes. Furthermore, a linked cycle can be established that zinc oxide forms zinc iodide and then formed zinc iodide functions to increase the stability of half-wave current passage. Accordingly, the thermal stability of the plastic thermistor is improved for a long time, and the heat resistance stability of temperature sensors or thermosensitive heaters comprising the plastic thermistor is improved greatly.
摘要:
An integratable fluid flow and property microsensor assembly is configured to be operably embedded in a microfluidic cartridge of the type used in lab-on-a-chip systems. The assembly is a robust package having a microstructure flow sensor contained within a housing in order to achieve a robust sensing device. The cartridge provides a flow path to the assembly, which directs the fluid across the flow sensor and returns the fluid to the cartridge flow path. The flow sensor monitors the controlled flow of fluid and transmits signals indicative of that flow. The assembly structure provides a robust sensor that is operable and accurate in many different applications.
摘要:
A supporting film is formed over an entire front surface of a base material, a heating resistor composed of a platinum film having a predetermined pattern is formed on the supporting film, and a protecting film is formed over an entire surface of the supporting film so as to cover the heating resistor. A heating structure having a diaphragm construction is constructed by forming a cavity under a region where the heating resistor is formed by removing a portion of the base material so as to extend to the supporting film from the rear surface side of the base material. The supporting film and the protecting film are each constituted by a silicon nitride film having an index of refraction of less than 2.25.
摘要:
With a sensor and method, it is possible for platinum resistor elements to be used advantageously as heating elements, temperature sensors, printed circuit traces, or as chemically resistant electron beam sensitive layers. To ensure a long-lasting adhesion of the platinum resistance layer to a dielectric substrate, even during exposure to temperatures which are elevated over ambient temperature and under dry and most atmospheric conditions, a thin adhesion layer of platinum silicide, for example, is deposited between the platinum resistance layer and the dielectric substrate. Resistor elements patterned from the platinum layer can advantageously be used in temperature sensors, mass flow sensors, chemical sensors, gas sensors, or humidity sensors.
摘要:
A temperature sensor is provided with a temperature-sensitive element on a surface of a monocrystalline substrate, wherein the temperature-sensitive element is made of a platinum thin-film resistor and is produced as an epitaxial layer. The monocrystalline substrate can be an electrically insulating material, preferably &agr;-Al2O3 or MgO. Alternatively, the substrate may be an electrically conducting material, such as silicon, with an electrically insulating epitaxial layer arranged between the substrate and the platinum thin-film resistor. The platinum thin-film resistor epitaxial layer is preferably deposited by physical vapor deposition (PVD), chemical vapor deposition (CVD), or molecular beam epitaxy (MBE).
摘要翻译:温度传感器在单晶衬底的表面上设置有温度敏感元件,其中温度敏感元件由铂薄膜电阻器制成并被制造为外延层。 单晶衬底可以是电绝缘材料,优选为α-Al 2 O 3或MgO。 或者,衬底可以是诸如硅的导电材料,其中布置在衬底和铂薄膜电阻器之间的电绝缘外延层。 铂薄膜电阻器外延层优选通过物理气相沉积(PVD),化学气相沉积(CVD)或分子束外延(MBE)沉积。
摘要:
The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.
摘要:
A temperature sensor which features improved response characteristics and in which a thermistor element is contained in a metal enclosure in a state where a pair of electrode wires for taking out signals are connected in an exposed manner at two opposing end surfaces thereof. The temperature sensor comprises a metal enclosure 2, a thermistor element 3 contained in the metal enclosure, and a pair of electrode wires 4 connected to the two opposing end surfaces of the thermistor element in a form being exposed over the thermistor element in the metal enclosure to take out thermistor signals, wherein a distance H between the thermistor element and the metal enclosure is not smaller than 0 but is not larger than 0.3 mm.
摘要:
A sensor component comprises a ceramic support (12) with a metal film (14) applied thereto. At least one connecting wire (16) is electrically connected to the metal film (14) in a contact area (18). A fixing glaze (20) is applied to the metal film (14) and the at least one connecting wire (16) in the contact area (18). The ceramic support (12) has at least one recess (24) in the area of the fixing glaze (20).