公开(公告)号：US20240212892A1

公开(公告)日：2024-06-27

申请号：US18487058

申请日：2023-10-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUTO AKIYAMA ,  YASUTAKA HANASHIRO ,  KEIJI KAWAJIRI

IPC: H01C7/10 ,  H01C7/00 ,  H01C7/18 ,  H01G4/008 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01C7/10 ,  H01C7/008 ,  H01C7/18 ,  H01G4/008 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

Abstract: A laminated ceramic component includes a sintered body, internal electrodes provided inside the sintered body, and external electrodes provided on a surface of the sintered body and electrically connected to the internal electrodes. The external electrodes include a first end-surface electrode provided on at least a portion of a first end surface of the sintered body, a second end-surface electrode provided on at least a portion of a second end surface of the sintered body, a first side-surface electrode provided on a portion of a first side surface of the sintered body, and a second side-surface electrode provided on a portion of a second side surface of the sintered body. Each of the first and second end-surface electrodes and the first and second side-surface electrodes contains metal and glass component. A content of the glass component in each of the first and second end-surface electrodes is different from a content of the glass component in each of the first and second side-surface electrodes.

公开(公告)号：US20240029925A1

公开(公告)日：2024-01-25

申请号：US18482101

申请日：2023-10-06

Applicant: ROHM CO., LTD.

Inventor： Kosaku TANAKA

IPC: H01C1/148 ,  H01C1/032 ,  H01C7/18

CPC classification number: H01C1/148 ,  H01C1/032 ,  H01C7/18

Abstract: A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

公开(公告)号：US20230368949A1

公开(公告)日：2023-11-16

申请号：US18248190

申请日：2021-09-22

Applicant: ROHM CO., LTD.

Inventor： Takuya MAEKAWA

IPC: H01C1/032 ,  H01C1/148 ,  H01C7/18 ,  H01C7/00

CPC classification number: H01C1/032 ,  H01C1/148 ,  H01C7/18 ,  H01C7/006

Abstract: A chip resistor includes a substrate, a first electrode, a second electrode, a first resistor body, a second resistor body, and a connection electrode. The substrate includes a first primary surface. The first electrode includes a first terminal electrode and a first auxiliary electrode. The second electrode includes a second terminal electrode and a second auxiliary electrode. The first auxiliary electrode has a larger area than the first terminal electrode and the second auxiliary electrode has a larger area than the second terminal electrode, in plan view of the first primary surface of the substrate.

公开(公告)号：US20230317372A1

公开(公告)日：2023-10-05

申请号：US18124015

申请日：2023-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukie WATANABE

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01C7/00 ,  H01C7/18 ,  H01C1/148

CPC classification number: H01G4/005 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01C7/008 ,  H01C7/18 ,  H01C1/148

Abstract: In a multilayer ceramic electronic component, a first auxiliary electrode layer spaced away from a second internal electrode layer and exposed to a first end surface is on a same plane as a ceramic layer on which the second internal electrode layer is located, a second auxiliary electrode layer spaced away from a first internal electrode layer and exposed to a second end surface is on a same plane as the ceramic layer on which the first internal electrode layer is located, a first via conductor is at a central portion in a width direction of the first internal electrode layer and the first auxiliary electrode layer and exposed to the first end surface, and a second via conductor is at a central portion in a width direction of the second internal electrode layer and the second auxiliary electrode layer and exposed to the second end surface.

公开(公告)号：US20230274864A1

公开(公告)日：2023-08-31

申请号：US18173598

申请日：2023-02-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuto AKIYAMA ,  Ken YANAI ,  Masashi TAKAMURA ,  Yuji YAMAGISHI ,  Ryosuke USUI

IPC: H01C7/102 ,  H01C7/18

CPC classification number: H01C7/102 ,  H01C7/18

Abstract: A multilayer varistor according to the present disclosure includes: a sintered compact having, on a surface thereof, at least one planar portion and at least one corner portion; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the at least one planar portion and the at least one corner portion of the sintered compact at least partially; and an external electrode arranged to cover the high-resistivity layer partially and electrically connected to the internal electrode. The high-resistivity layer includes: a first high-resistivity layer covering the at least one planar portion; and a second high-resistivity layer covering the at least one corner portion. The first high-resistivity layer has a larger average thickness than the second high-resistivity layer.

公开(公告)号：US20220293306A1

公开(公告)日：2022-09-15

申请号：US17692284

申请日：2022-03-11

Applicant: KYOCERA AVX Components Corporation

Inventor： Michael W. Kirk ,  Marianne Berolini ,  Palaniappan Ravindranathan

IPC: H01C7/112 ,  H01C7/18 ,  H01C1/14

Abstract: A varistor array can include a monolithic body including a plurality of dielectric layers. A first varistor can be formed in the monolithic body. The first varistor can include a first external terminal on a first end of the monolithic body, a first plurality of electrodes connected with the first external terminal, a second external terminal on a second end of the monolithic body, and a second plurality of electrodes connected with the second external terminal. The second plurality of electrodes can be interleaved with the first plurality of electrodes and can overlap the first plurality of electrodes at an overlapping area that is insensitive to a relative misalignment between the first plurality of electrodes and the second plurality of electrodes when the misalignment is less than a threshold. A second varistor can be formed in the monolithic body that is distinct from the first varistor.

公开(公告)号：US20220268639A1

公开(公告)日：2022-08-25

申请号：US17629784

申请日：2019-07-26

Applicant: INTERFLEX CO., LTD

Inventor： Jin KEUM ,  Chan Woo YANG

IPC: G01K7/16 ,  H01C7/18 ,  H01C7/00

Abstract: The present invention measures a temperature of a heating element and includes a first insulating layer having an electrical insulating function; a sensor electrode provided on an upper side of the first insulating layer and having a change in intensity of a current according to a change in heat generated by the heating element; and a second insulating layer covering an upper side of the sensor electrode, wherein the sensor electrode is disposed in parallel with the first insulating layer and having a plurality of bent portions from one end of the sensor electrode to the other end of the sensor electrode.

公开(公告)号：US10886061B2

公开(公告)日：2021-01-05

申请号：US15840916

申请日：2017-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kaoru Tachibana

IPC: H01F5/00 ,  H01F27/29 ,  H01F27/245 ,  H01F27/28 ,  H01F41/02 ,  H01F27/32 ,  H01F17/00 ,  H01G4/232 ,  H01C17/00 ,  H01G4/30 ,  H01G4/12 ,  H01G4/228 ,  H01C1/14 ,  H01C7/18

Abstract: A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming a groove by removing a part of a bottom surface of the multilayer body. The method further includes segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions, and forming an outer electrode conductor layer on the bottom surface of the multilayer body after formation of the groove and segmentation.

公开(公告)号：US20200154571A1

公开(公告)日：2020-05-14

申请号：US16744569

申请日：2020-01-16

Applicant: TDK CORPORATION

Inventor： Naoyoshi YOSHIDA ,  Kouki YAMADA ,  Hisashi AIBA ,  Kazuto TAKEYA ,  Hiroya NAKAMURA

IPC: H05K1/18 ,  H01G4/232 ,  H01C7/00 ,  H01C7/04 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30 ,  H01G2/06 ,  H01G4/005

Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

公开(公告)号：US10475583B2

公开(公告)日：2019-11-12

申请号：US15875386

申请日：2018-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan Kwak ,  Hyun Sik Kim ,  Jong Wook Roh ,  Kyoung-Seok Moon ,  Hyeon Cheol Park ,  Yoon Chul Son ,  Daejin Yang ,  Doh Won Jung ,  Youngjin Cho

IPC: H01G4/12 ,  C04B35/46 ,  H01G4/30 ,  H01G4/14 ,  C04B35/47 ,  C04B35/628 ,  H01C7/00 ,  H01C7/10 ,  H01C7/18 ,  H01C17/065 ,  H01G4/248 ,  H01G4/232

Abstract: A dielectric composite including a plurality of crystal grains including a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer includes a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains, and a multi-layered capacitor and an electronic device including the same.