公开(公告)号：US12154743B2

公开(公告)日：2024-11-26

申请号：US17611199

申请日：2020-04-23

Applicant: Maschinenfabrik Reinhausen GmbH

Inventor： Sebastian Schmid ,  Juergen Schimbera ,  Kathrin Pruessing

IPC: H02P1/00 ,  H01H3/26 ,  H01H9/00 ,  H01F21/12

Abstract: A drive system drives at least one switch. The drive system includes: a drive shaft, which is configured to connect the drive system to the at least one switch and at least one motor, which is configured to be coupled to the drive shaft; a feedback system which is configured to determine a position of the drive shaft and, based on this position, to generate a feedback signal; and a controller which, based on the feedback signal, selects a stored travel profile from a plurality of travel profiles and controls the motor in accordance with the selected travel profile.

公开(公告)号：US12142407B2

公开(公告)日：2024-11-12

申请号：US17186339

申请日：2021-02-26

Applicant: Infineon Technologies Austria AG

Inventor： Luca Peluso ,  Gerald Deboy ,  Matthias J. Kasper ,  Kennith K. Leong

IPC: H01F17/06 ,  H01F17/04 ,  H01F21/12 ,  H01F27/24 ,  H01F17/00

Abstract: According to one configuration, an inductor device includes a core fabricated from multiple different types of magnetically permeable material. The inductor device includes an electrically conductive path extending through the core. A magnetic permeability of the core varies in magnitude depending on a distance with respect to the electrically conductive path.

公开(公告)号：US20240221988A1

公开(公告)日：2024-07-04

申请号：US18601191

申请日：2024-03-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Hsiao-Tsung YEN ,  Cheng-Wei LUO

IPC: H01F21/12

CPC classification number: H01F21/12 ,  H01F2021/125

Abstract: A semiconductor device includes a first conductive winding over a first substrate. The semiconductor device further includes a second substrate bonded to the first substrate. The semiconductor device further includes a switch in the second substrate. The semiconductor device further includes an inter-level via (ILV) in the second substrate. The semiconductor device further includes a second conductive winding over the second substrate, wherein the second conductive winding includes a conductive line around a central opening, the switch is electrically connected to the second conductive winding on a first side of the opening, and the ILV is electrically connected to the second conductive winding on a second side of the opening opposite the first side.

公开(公告)号：US11923119B2

公开(公告)日：2024-03-05

申请号：US17986435

申请日：2022-11-14

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Magnus Nilsson ,  Magnus Sandgren

IPC: H04B1/40 ,  H01F21/12 ,  H01L23/522 ,  H03J3/20 ,  H03J5/02 ,  H03J5/24

CPC classification number: H01F21/12 ,  H01L23/5227 ,  H03J3/20 ,  H03J5/02 ,  H03J5/246 ,  H04B1/40 ,  H01F2021/125 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A tunable inductor arrangeable on a chip or substrate comprises a first winding part connected at one end to a first input of the tunable inductor arrangement, a second winding part connected at one end to the other end of the first winding part, a third winding part connected at one end to a second input of the tunable inductor arrangement, a fourth winding part connected at one end to the other end of the third winding part, and a switch arrangement arranged. The switch arrangement tunes the tunable inductor by selectively connecting the first and fourth winding parts in parallel and the second and third winding parts in parallel, with the parallel couplings in series between the first and second inputs, or connecting the first, second, fourth and third winding parts in series between the first and second inputs. Corresponding transceivers, communication devices, methods and computer programs are disclosed.

公开(公告)号：US11887765B2

公开(公告)日：2024-01-30

申请号：US16736928

申请日：2020-01-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Sunwoo Lee

IPC: H01F21/12 ,  H03H7/42 ,  H01F19/04 ,  H01F17/00

CPC classification number: H01F21/12 ,  H01F17/0006 ,  H01F19/04 ,  H03H7/42

Abstract: A switching transformer includes a primary circuit and a secondary circuit. The primary circuit includes a first input/output (I/O) terminal, a plurality of primary windings, and primary switching circuitry including at least one switch configured to selectively connect the plurality of primary windings in series or in parallel. The secondary circuit includes a second I/O terminal, a plurality of secondary windings, and secondary switching circuitry including at least one switch configured to selectively connect the plurality of secondary windings in series or in parallel.

公开(公告)号：US11711056B2

公开(公告)日：2023-07-25

申请号：US17751005

申请日：2022-05-23

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yi-Hsuan Liu ,  Hsieh-Hung Hsieh ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

IPC: H03B5/12 ,  H03J3/20 ,  H03J3/22 ,  H01F21/12

CPC classification number: H03B5/1256 ,  H03B5/1212 ,  H03B5/1228 ,  H01F2021/125 ,  H03B2201/0216 ,  H03J3/20 ,  H03J3/22

Abstract: A method using a phase locked loop (PLL) includes receiving a reference frequency. The method further includes generating a control signal based on the reference frequency. The method further includes adjusting an output signal based on the control signal. Adjusting the output signal includes operating a plurality of switches in response to the control signal, wherein operating the plurality of switches comprises selectively electrically connecting a first ground plane to a first floating plane, wherein the first floating plane is between the first ground plane and the signal line, and the first floating plane is a same distance from a substrate as the first ground plane.

公开(公告)号：US11309119B2

公开(公告)日：2022-04-19

申请号：US16034680

申请日：2018-07-13

Applicant: Airoha Technology Corp.

Inventor： Kuo-Yu Tseng ,  Shih-Chieh Chien

IPC: H01F27/28 ,  H03H7/42 ,  H03H1/00 ,  H01L23/64 ,  H01F21/12

Abstract: An on-chip balun transformer including a primary winding and a secondary winding is provided. The primary winding includes at least one parallel coil and a plurality of first serial semi-turn coils connected to the at least one parallel coil. The secondary winding, magnetically coupled to the primary winding, includes a plurality of second serial semi-turn coils connected to each other. At least one of the second serial semi-turn coils is located within the at least one parallel coil. The primary winding and the secondary winding are coplanar.

公开(公告)号：US20210099169A1

公开(公告)日：2021-04-01

申请号：US17078658

申请日：2020-10-23

Applicant: pSemi Corporation

Inventor： Ronald Eugene Reedy ,  Dan William Nobbe ,  Tero Tapio Ranta ,  Cheryl V. Liss ,  David Kovac

IPC: H03K17/16 ,  H03M1/10 ,  H01F21/12 ,  H03H7/01 ,  H03K17/10 ,  H03K17/687 ,  H01G7/00 ,  H03H7/38 ,  H03H11/28 ,  H01L23/522 ,  H01L27/06 ,  H01L27/12 ,  H01L49/02 ,  H03J3/20 ,  H01G4/002

Abstract: Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

公开(公告)号：US10382031B2

公开(公告)日：2019-08-13

申请号：US15279302

申请日：2016-09-28

Applicant: pSemi Corporation

Inventor： Tero Tapio Ranta

IPC: H03K17/16 ,  H03M1/10 ,  H03K17/687 ,  H01G7/00 ,  H03H7/38 ,  H01F21/12 ,  H03H7/01 ,  H03H11/28 ,  H01L23/522 ,  H01L27/06 ,  H01L27/12 ,  H01L49/02 ,  H03J3/20 ,  H01G4/002 ,  H03K17/10 ,  H03M1/80

Abstract: A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an RF+ terminal and the second terminal comprises an RF− terminal. In accordance with some embodiments, the DTCs comprise a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second RF terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.

公开(公告)号：US10374571B2

公开(公告)日：2019-08-06

申请号：US15792291

申请日：2017-10-24

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation ,  Semiconductor Manufacturing International (Beijing) Corporation

Inventor： Xi Ning Wang ,  Jen Hao Cheng ,  Zhi Jiang Zhou ,  Jin Feng Gao

IPC: H03H7/42 ,  H01F17/00 ,  H01F21/12 ,  H01F27/28 ,  H01L23/522

Abstract: A balun structure is provided. The balun structure includes a substrate, a first coil structure and a second coil structure having a spiral shape and on the substrate. The first coil structure includes a first single-layer coil surrounding by first laminated coils that are connected to the first single-layer coil. The second coil structure can include a second single-layer coil and second laminated coils that are connected to the second single-layer coil. A projection of the first single-layer coil and a projection of the second single-layer coil on a surface of the substrate overlap with each other. A number of the second laminated coils is larger than or equal to a number of the first laminated coils. The second laminated coils are arranged alternately with the first laminated coils or the first single-layer coil in a plane parallel to the surface of the substrate.