Capacitor and manufacturing method therefor

    公开(公告)号:US11903182B2

    公开(公告)日:2024-02-13

    申请号:US17022439

    申请日:2020-09-16

    发明人: Bin Lu Jian Shen

    摘要: A capacitor includes: a semiconductor substrate; at least one trench provided in the semiconductor substrate and formed downward from an upper surface of the semiconductor substrate; a first conductive layer provided above the semiconductor substrate and in the trench; a first insulating layer provided between the substrate and the first conductive layer to isolate the first conductive layer from the substrate; a second conductive layer provided above the r substrate and in the trench, the second conductive layer including a first and a second conductive region that are independent from each other, the first conductive region being electrically connected to the substrate, and the second conductive region being electrically connected to the first conductive layer; and a second insulating layer provided between the first and the second conductive layer to isolate the first conductive region from the first conductive layer and isolate the second conductive region from the substrate.

    METAL INSULATOR METAL (MIM) STRUCTURE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230163161A1

    公开(公告)日:2023-05-25

    申请号:US18155757

    申请日:2023-01-18

    摘要: A MIM structure and manufacturing method thereof are provided. The MIM structure includes a substrate and a metallization structure over the substrate. The metallization structure includes a bottom electrode layer, a dielectric layer on the bottom electrode layer, a ferroelectric layer on the dielectric layer, a top electrode layer on the ferroelectric layer, a first contact electrically coupled to the top electrode layer, and a second contact penetrating the dielectric layer and the ferroelectric layer, electrically coupled to a base portion of the bottom electrode layer. The bottom electrode layer includes the base portion and a plurality of protrusions, each of the protrusions is protruding from the base portion and leveled with a lower surface of the dielectric layer, each portion of the dielectric layer over the bottom electrode layer substantially have identical thicknesses.

    Method of winding coilware, computer program product, control device, and winding machine

    公开(公告)号:US11651908B2

    公开(公告)日:2023-05-16

    申请号:US17029308

    申请日:2020-09-23

    摘要: A method of winding coilware via a winding machine having a plurality of winding devices, which are drivable by a plurality of drives which comprise at least a supply roll and a winding body, includes providing the coilware from the supply roll and winding the coilware over at least one deflection roll onto the winding body, where at least one drive is adjusted as a function of a position-dependent compensation signal at least partly compensating a defect, and where the position-dependent compensation signal for the drive is provided by acquiring a time domain interference variable during a winding operation, transforming the acquired interference variable into a frequency domain spectrum, filtering the spectrum via a filter specific to the winding device assigned to the drive, transforming the filtered spectrum back into the time domain to provide a time-dependent compensation signal, and transforming the time-dependent compensation signal into the position-dependent compensation signal.