Abstract:
An anode for an X-ray tube is provided. The anode has a shape configured such that, in use: an electron beam impinges upon the anode at a focal spot on the surface of the anode, and the anode is heated by the electron beam from a first state to a predetermined second state and undergoes resulting thermal expansion causing a change in the location of the focal spot on the surface of the anode, wherein the configured shape of the anode is such that the spatial position of the focal spot with respect to the X-ray tube is substantially the same for the first state and the second state. A method of producing an anode for an X-ray tube is also provided.
Abstract:
Apparatuses, systems, and methods for ion traps are described herein. One apparatus includes a number of microwave (MW) rails and a number of radio frequency (RF) rails formed with substantially parallel longitudinal axes and with substantially coplanar upper surfaces. The apparatus includes two sequences of direct current (DC) electrodes with each sequence formed to extend substantially parallel to the substantially parallel longitudinal axes of the MW rails and the RF rails. The apparatus further includes a number of through-silicon vias (TSVs) formed through a substrate of the ion trap and a trench capacitor formed in the substrate around at least one TSV.
Abstract:
A semiconductor device may include the following elements: a semiconductor substrate, an insulator positioned on the substrate, a source electrode positioned on the insulator, a drain electrode positioned on the insulator, a gate electrode positioned between the source electrode and the drain electrode, a hollow channel surrounded by the gate electrode and positioned between the source electrode and the drain electrode, a dielectric member positioned between the hollow channel and the gate electrode, a first insulating member positioned between the gate electrode and the source electrode, and a second insulating member positioned between the gate electrode and the drain electrode.
Abstract:
The present invention relates to mounting of an anode disk. In order to provide a mount of an anode disk to a rotating shaft that is suitable for increased thermal loads on the anode disk, a rotating anode assembly (10) is provided that comprises an anode disk (12), a rotating shaft (14), and an anode disk support (16). The anode disk is concentrically mounted to a rotating axis (18) of the rotating shaft via the anode disk support, and the anode disk support comprises a first support (20) with a first circular axial support surface (22) that is provided at the rotating shaft in a concentric manner with the rotating axis. Further, the anode disk support comprises a second support (24) with a second axial support surface (26) that is at least temporarily attached to the rotating shaft for urging the anode disk against the first support surface in an axial clamping direction. Still further, the first support is provided as a radially flexible support (28). Upon heating up of the anode disk during X-ray generation, and a thermal expansion of the anode disk, the radially flexible support bends (32) radially such that the first axial support surface at least partly follows the thermal expansion in a radial direction.
Abstract:
A semiconductor device may include the following elements: a semiconductor substrate, an insulator positioned on the substrate, a source electrode positioned on the insulator, a drain electrode positioned on the insulator, a gate electrode positioned between the source electrode and the drain electrode, a hollow channel surrounded by the gate electrode and positioned between the source electrode and the drain electrode, a dielectric member positioned between the hollow channel and the gate electrode, a first insulating member positioned between the gate electrode and the source electrode, and a second insulating member positioned between the gate electrode and the drain electrode.
Abstract:
Apparatuses, systems, and methods for ion traps are described herein. One apparatus includes a number of microwave (MW) rails and a number of radio frequency (RF) rails formed with substantially parallel longitudinal axes and with substantially coplanar upper surfaces. The apparatus includes two sequences of direct current (DC) electrodes with each sequence formed to extend substantially parallel to the substantially parallel longitudinal axes of the MW rails and the RF rails. The apparatus further includes a number of through-silicon vias (TSVs) formed through a substrate of the ion trap and a trench capacitor formed in the substrate around at least one TSV.
Abstract:
A high voltage vacuum feed through (23) for an electron tube (25) has an anode (28) and an insulating body (1) of ceramic material, the insulating body (1) having a continuous hollow space (10). The anode (28) has a rear part (2) and a front part (3) mounted thereto. The rear part (2) consists of a first metallic material, having a thermal expansion coefficient corresponding to a thermal expansion coefficient of the ceramic material. The rear part (2) is arranged in the hollow space (10) of the insulating body (1) and is soldered into the insulating body (1) in a vacuum-tight fashion. The front part (3) has a second metallic material whose heat conductivity is larger than that of the first metallic material. The high voltage vacuum feed through reliably remains vacuum-tight during operation and can be easily provided with different target materials.
Abstract:
An image intensifier tube includes a collimator having multiple channels for receiving electrons from a photocathode layer, and a microchannel plate (MCP) having multiple channels for receiving electrons from the collimator. An ion barrier film (IBF) is disposed on top of an input side of the MCP, in which the IBF includes a small amount of conductive material. The IBF may include alumina doped with chromium oxide, or manganese oxide, or any other conductive material. The small amount of conductive material includes 1% to 5% of conductive material in a layer of non-conductive material.
Abstract:
We disclose targets for generating x-rays using electron beams, along with their method of fabrication. The targets comprise a number of microstructures fabricated from an x-ray target material arranged in close thermal contact with a substrate such that the heat is more efficiently drawn out of the x-ray target material. This in turn allows irradiation of the x-ray generating substance with higher electron density or higher energy electrons, which leads to greater x-ray brightness, without inducing damage or melting.The microstructures may comprise conventional x-ray target materials (such as tungsten) that are patterned at micron-scale dimensions on a thermally conducting substrate, such as diamond. The microstructures may have any number of geometric shapes to best generate x-rays of high brightness and efficiently disperse heat.In some embodiments, the target comprising microstructures may be incorporated into a rotating anode geometry, to enhance x-ray generation in such systems.
Abstract:
Provided are a field emission surface light source apparatus and a method of fabricating the field emission surface light source apparatus. The field emission surface light source apparatus includes a base substrate and a transparent substrate facing each other, a plurality of gate electrodes formed on an upper surface of the base substrate, an insulating layer formed on the upper surface of the base substrate to cover the gate electrodes, a plurality of emitters formed on an upper surface of the insulating layer, and a fluorescent layer formed on a lower surface of the transparent substrate. The fluorescent layer faces the emitters.