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公开(公告)号：US11929369B2
公开(公告)日：2024-03-12
申请号：US17143114
申请日：2021-01-06
申请人： InnoLux Corporation
发明人： Shuhei Hosaka
IPC分类号： H01L27/12 , G02F1/1335 , G02F1/1339 , G02F1/1345 , G02F1/1362 , H01L23/057 , H01L25/16 , H01L27/15 , H10K50/842 , H10K59/131 , H10K59/38
CPC分类号： H01L27/124 , H01L23/057 , G02F1/133514 , G02F1/1339 , G02F1/13458 , G02F1/136286 , H01L25/167 , H01L27/156 , H10K50/8428 , H10K59/131 , H10K59/38
摘要： An electronic device includes a first substrate including a first surface and a first side-surface adjacent to the first surface, a second substrate including a second surface and a second side-surface adjacent to the second surface, a plurality of first conductive wires disposed on the first surface, a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively and a plurality of second conductive wires disposed on the first side-surface and the second side-surface. The plurality of first conductive wires are electrically connected to the plurality of second conductive wires respectively.
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公开(公告)号：US11640926B2
公开(公告)日：2023-05-02
申请号：US16667243
申请日：2019-10-29
发明人： Yuji Ichimura
IPC分类号： H01L23/24 , H01L23/08 , H01L23/057 , H01L21/48 , H01L21/52 , H01L21/56 , H01L23/367 , H01L23/00 , H01L25/16
摘要： A semiconductor device includes a semiconductor chip, a substrate having a main surface on which the semiconductor chip is arranged, a resin case which has a storage space therein and a side wall, the side wall having an injection path extending from the storage space to a device exterior, the resin case having a first opening at a bottom side thereof, connecting the storage space to the device exterior, the substrate being disposed on the resin case, at a main surface side of the substrate facing at the bottom side of the resin case, and a sealing material filling the storage space and the injection path.
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公开(公告)号：US11569141B2
公开(公告)日：2023-01-31
申请号：US17058283
申请日：2018-08-08
发明人： Daisuke Oya , Yukimasa Hayashida , Tetsuo Motomiya
IPC分类号： H01L23/08 , H01L29/417 , H01L23/057
摘要： A semiconductor device includes a first electrode; a second electrode; a resin case surrounding the first electrode and the second electrode; and a resin insulating part made of a material the same as a material of the resin case and covering part of the first electrode and part of the second electrode inside the resin case. The resin insulating part contacts an inner wall of the resin case or is separated from the inner wall of the resin case. A move positioned between the first electrode and the second electrode is formed at the resin insulating part, and thus a space in which the resin insulating part does not exist or a material different from the resin insulating part is provided between the first electrode and the second electrode.
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公开(公告)号：US20220415732A1
公开(公告)日：2022-12-29
申请号：US17840971
申请日：2022-06-15
IPC分类号： H01L23/057 , H01L23/31 , H01L23/373
摘要： A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and at least two external contacts made of a metal or an alloy and arranged next to each other, which are electrically and mechanically connected to the first side of the first chip carrier and protrude laterally out of the encapsulation body. At least one of the external contacts has at least one wing arranged within the encapsulation body and located opposite the other external contact. The wing includes one or more cutouts that are filled with the encapsulation material of the encapsulation body.
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公开(公告)号：US20220359319A1
公开(公告)日：2022-11-10
申请号：US17872436
申请日：2022-07-25
发明人： Alexander Hoehn
IPC分类号： H01L23/057 , H01L21/48 , H01L23/00 , H01L25/07 , H01L25/00
摘要： A power semiconductor module arrangement includes: a housing; first and second electrical contacts within the housing; and a mounting arrangement including a frame or body and first and second terminal elements. The mounting arrangement is inserted in and coupled to the housing. First ends of the first and second terminal elements mechanically and electrically contact the first and second electrical contacts, respectively. A middle part of each terminal element extends through the frame or body. A second end of each terminal element extends outside the housing. The first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body. The first terminal element is injected into and inextricably coupled to the frame or body. The second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body.
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公开(公告)号：US11462446B2
公开(公告)日：2022-10-04
申请号：US16866990
申请日：2020-05-05
发明人： Alexander Hoehn
IPC分类号： H01L23/057 , H01L21/48 , H01L23/00 , H01L25/07 , H01L25/00
摘要： A power semiconductor module arrangement includes a semiconductor substrate arranged in a housing, at least one semiconductor body being arranged on the semiconductor substrate, and a mounting arrangement including a frame or body, a first terminal element, and a second terminal element. The mounting arrangement is inserted in and coupled to the housing. Each terminal element mechanically and electrically contacts the semiconductor substrate with a first end. A middle part of each terminal element extends through the frame or body. A second end of each terminal element extends outside the housing. The first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body. The first terminal element is injected into and inextricably coupled to the frame or body. The second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body.
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公开(公告)号：US11424170B2
公开(公告)日：2022-08-23
申请号：US15301772
申请日：2015-03-30
发明人： Nora Busche , Joerg Strogies , Klaus Wilke
IPC分类号： H01L23/057 , H01L23/498 , H01L23/373 , H01L23/00 , H01L21/50 , H01L23/10 , H01L21/48 , H01L23/473
摘要： A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.
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公开(公告)号：US11251098B2
公开(公告)日：2022-02-15
申请号：US16647420
申请日：2017-11-01
发明人： Yosuke Nakata
IPC分类号： H01L23/043 , H01L23/057 , H01L23/24 , H01L23/498 , H01L23/373 , H01L23/66 , H01L25/07 , H01L25/18 , H01L25/16
摘要： In the semiconductor device, a screw has a head section embedded in a case groove section provided in a frame placing stage of a case to cause side and front surfaces of the head section to be covered by the case, thereby fixing the screw to the case. A threaded section passes through a frame through hole of a frame exposed section disposed above the head section to protrude upward to be exposed on a side facing away from the base plate.
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公开(公告)号：US20210384092A1
公开(公告)日：2021-12-09
申请号：US17339300
申请日：2021-06-04
发明人： Leonardus Theodorus Maria Raben , Franciscus Gerardus Maria Meeuwsen , Jan Joseph Briones Miranda
IPC分类号： H01L23/057 , H01L23/08 , H01L23/00
摘要： The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers.
Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.-
公开(公告)号：US11177190B2
公开(公告)日：2021-11-16
申请号：US16883464
申请日：2020-05-26
发明人： Makoto Isozaki , Seiichi Takahashi
IPC分类号： H01L23/373 , H01L23/057 , H01L23/00 , H01L25/07
摘要： A semiconductor device, including a first conductive portion including a first conducting region and a first wiring region communicating with the first conducting region via a first communicating portion, a second conductive portion including a second conducting region and a second wiring region that communicates with the second conducting region via a second communicating portion and that faces the first wiring region with a prescribed space therebetween, and a wiring member electrically connecting the first wiring region and the second wiring region in a wiring direction. The first communicating portion and the second communicating portion are separate from each other when viewed from the wiring direction.
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