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公开(公告)号：US12132157B2
公开(公告)日：2024-10-29
申请号：US18490139
申请日：2023-10-19
申请人： NICHIA CORPORATION
发明人： Takeshi Tamura
CPC分类号： H01L33/60 , G02F1/133603 , G02F1/133611 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/58 , H01L33/62 , G02F1/133606 , H01L2933/0091
摘要： A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.
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公开(公告)号：US12132154B2
公开(公告)日：2024-10-29
申请号：US17483118
申请日：2021-09-23
发明人： Dongkuk Lee , Daesup Kim , Dongmyung Shin , Wooseok Jang , Sunhwan Hwang
CPC分类号： H01L33/504 , H01L33/0095 , H01L33/60 , H01L33/62 , H01L2933/0041
摘要： A semiconductor light emitting device is provided. The device includes: an LED chip having a lower surface, an upper surface, and a side surface between the upper surface and the lower surface; first and second conductive bumps disposed on first and second conductive bumps provided on the lower surface; a first wavelength conversion layer having a first region provided on the upper surface of the LED chip and a second region which extends past the side surface of the LED chip; a second wavelength conversion layer having a first surface contacting the side surface of the LED chip, a second surface, a third surface connecting the first surface and the second surface, and contacting the second region, and a fourth surface located opposite to the third surface and inclined; and a reflective resin portion provided on the lower surface of the LED chip and the fourth surface.
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公开(公告)号：US12132143B2
公开(公告)日：2024-10-29
申请号：US18126487
申请日：2023-03-27
申请人： InnoLux Corporation
发明人： Hsiao-Lang Lin , Tsung-Han Tsai
IPC分类号： H01L33/00 , H01L25/075 , H01L33/50
CPC分类号： H01L33/0095 , H01L25/0753 , H01L33/502 , H01L2933/0041
摘要： The present disclosure provides a light emitting device including a substrate, a plurality of light emitting elements disposed on the substrate, a partition wall disposed on the substrate, a light conversion element, an encapsulation layer disposed on the light emitting element, an intermediate layer disposed between the light conversion element and one of the light emitting elements, and a protection layer disposed between the intermediate layer and the light emitting elements. The partition wall defines a plurality of cavities, and one of the cavities corresponds to one of the light emitting elements. The light conversion element is disposed in the one of the cavities.
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公开(公告)号：US12132073B2
公开(公告)日：2024-10-29
申请号：US18465733
申请日：2023-09-12
申请人： EPISTAR CORPORATION
发明人： Min Hsun Hsieh , Hsin-Mao Liu
IPC分类号： H01L31/12 , G09G3/32 , H01L27/15 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62 , H01L33/38 , H01L33/44
CPC分类号： H01L27/156 , G09G3/32 , H01L27/15 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/62 , H01L33/385 , H01L33/44 , H01L2224/24 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： A light-emitting module including a first optoelectronic unit having a first electrode pad and a second electrode pad, a second optoelectronic unit having a third electrode pad and a fourth electrode pad, a first supporting structure enclosing the first optoelectronic unit and the second optoelectronic unit, a first pin overlapping and confronted with both of the first electrode pad and the third electrode pad, a second pin overlapping the second electrode pad and the first supporting structure, and a third pin overlapping the fourth electrode pad and physically separated from the second pin.
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公开(公告)号：US20240355991A1
公开(公告)日：2024-10-24
申请号：US18763447
申请日：2024-07-03
发明人： Jong Min JANG , Chang Yeon KIM
摘要： A light emitting device including a first light emitting part, a second light emitting part disposed on a first surface of the first light emitting part, and a third light emitting part disposed on a first surface of the second light emitting part, a first contact member contacting a surface of a second n-type semiconductor layer of the second light emitting part, an ohmic electrode electrically connected to a third p-type semiconductor layer of the third light emitting part, and an adhesive layer disposed between the second light emitting part and the third light emitting part, in which the first contact member extends toward the first light emitting part to be electrically connected to a first n-type semiconductor layer of the first light emitting part, and the adhesive layer extends toward the ohmic electrode.
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公开(公告)号：US20240355971A1
公开(公告)日：2024-10-24
申请号：US18522349
申请日：2023-11-29
发明人： Xiaoping YU
CPC分类号： H01L33/54 , H01L25/167 , H01L33/502
摘要： A display panel and a joinable display panel are provided. Multiple first pixel units are arranged in a first region and include multiple first LED elements with different light-emitting colors. Multiple second pixel units are arranged in a second region and include multiple second LED elements with different light-emitting colors. In the first LED element and the second LED element with a certain color light, the luminous brightness of the first LED element is greater than that of the second LED element. A package structure covers the multiple first pixel units and the multiple second pixel units. A regulating material for reducing a brightness of the certain color light is arranged in the package structure, and is correspondingly arranged in the first region.
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公开(公告)号：US12125951B2
公开(公告)日：2024-10-22
申请号：US17530543
申请日：2021-11-19
发明人： Erik Johansson , Robert Fitzmorris , Kevin Wiese , James Wyckoff
CPC分类号： H01L33/504 , H01L25/167 , H01L33/005 , H01L33/54 , H01L33/56 , H01L2933/0041 , H01L2933/005
摘要： A structure comprising a nanoparticle converting electromagnetic radiation of a first wavelength into electromagnetic radiation of a second wavelength range, an interlayer at least partially surrounding the nanoparticle, and an encapsulation at least partially surrounding the interlayer is specified, wherein the interlayer comprises a plurality of first amphiphilic ligands and a plurality of second amphiphilic ligands and the first ligands and the second ligands are intercalated.
Furthermore, an agglomerate comprising a plurality of structures, an optoelectronic device as well as methods for producing a structure and an agglomerate are disclosed.-
公开(公告)号：US12123092B2
公开(公告)日：2024-10-22
申请号：US17470250
申请日：2021-09-09
申请人： SKY TECH INC.
发明人： Jing-Cheng Lin , Chia-Cheng Ku
IPC分类号： C23C16/455 , C23C16/30 , C23C16/44 , C23C14/22 , H01L33/50
CPC分类号： C23C16/4407 , C23C16/306 , C23C16/4417 , C23C16/45525 , C23C16/45544 , C23C16/45561 , C23C14/223 , H01L33/502
摘要： The present disclosure provides a powder-atomic-layer-deposition device with knocker, which mainly includes a vacuum chamber, a shaft seal, a drive unit and a knocker. The drive unit is connected to the rear wall of the vacuum chamber via the shaft seal, for driving the vacuum chamber to rotate. The shaft seal includes an outer tube and an inner tube, wherein the inner tube is disposed within the containing space of the outer tube. The inner tube is disposed with a gas-extracting pipeline and a gas-inlet pipeline therein, wherein the gas-extracting pipeline is for gas extraction of the vacuum chamber, the gas-inlet pipeline is for transferring a precursor gas into the vacuum chamber. The knocker and the vacuum chamber are adjacent to each other, for knocking the vacuum chamber to prevent powders within the reacting space from sticking to the inner surface of the vacuum chamber.
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公开(公告)号：US20240349407A1
公开(公告)日：2024-10-17
申请号：US18756737
申请日：2024-06-27
发明人： Chung Hoon LEE
CPC分类号： H05B45/20 , G09G3/2003 , G09G3/32 , H01L33/50 , H05B45/22
摘要： A lighting device including a first light emitter including a plurality of light sources each being configured to emit light with a different color temperature, a second light emitter including at least one light emitting structure to emit light having a different color range than that emitted from the first light emitter, a controller to adjust characteristics of light emitted from the first and second light emitters, a user interface member configured to receive input of a user and connected to the controller, and a storage medium connected to the controller, in which each of the light sources includes a light-emitting diode chip and a wavelength conversion member to convert a wavelength range of light emitted from the light-emitting diode chip, and the controller is further configured to control the first and second light emitters according to a spectrum of light stored in the storage medium.
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公开(公告)号：US20240347678A1
公开(公告)日：2024-10-17
申请号：US18579356
申请日：2022-08-29
发明人： Huajie YAN , Qian SUN , Mingxing WANG , Wei LI , Zhiqiang JIAO , Qingyu HUANG , Mengna SUN
CPC分类号： H01L33/502 , H01L33/0075 , H01L33/14 , H01L33/24 , H01L33/32 , H01L2933/0041 , H01L2933/0083
摘要： The present disclosure provides a light-emitting device, a method for manufacturing a light-emitting device and a display apparatus, and belongs to the field of display technology, and can solve the problem that the light-emitting device in the related art has low luminescence efficiency. The light-emitting device of the present disclosure includes: a substrate, a light-emitting diode on the substrate and a color conversion layer on a side of the light-emitting diode away from the substrate; the light-emitting device further includes: nano-metal particles; a plurality of grooves are formed in a surface of the light-emitting diode away from the substrate; and the nano-metal particles are filled in the plurality of grooves.
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