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公开(公告)号：US20240363825A1
公开(公告)日：2024-10-31
申请号：US18769472
申请日：2024-07-11
发明人： Chunjian LIU , Jian TIAN , Jie LEI , Yajun MA , Jianying ZHANG
IPC分类号： H01L33/62 , H01L25/075 , H01L33/54
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/54
摘要： The present disclosure provides a driving backplane, a light emitting substrate, a backlight module, and a display apparatus, which belongs to the field of display technology. The driving backplane includes a base substrate, a driving layer and an encapsulation layer sequentially laminated. The driving layer has a pad for binding an electronic element and a raised block corresponding to the pad, the pad is located on a side of the corresponding raised block away from the base substrate (BP), and an orthographic projection of the pad on the base substrate is located within an orthographic projection of the corresponding raised block on the corresponding base substrate. The encapsulation layer has a binding opening. The pad and the raised block are located in the binding opening.
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公开(公告)号：US12132069B2
公开(公告)日：2024-10-29
申请号：US17346466
申请日：2021-06-14
申请人： Japan Display Inc.
发明人： Keisuke Asada , Kazuyuki Yamada , Kenichi Takemasa
CPC分类号： H01L27/156 , H01L33/382 , H01L33/42 , H01L33/54 , H01L33/56 , H01L33/62
摘要： According to one embodiment, a display device includes a substrate, a plurality of pixels, a resin layer and a common electrode. The pixels include a plurality of light emitting elements arranged on the substrate and having luminous colors different from each other, respectively. The resin layer is buried in a clearance part between the plurality of light emitting elements provided in each of the pixels. The common electrode is formed of a transparent conductive material covering the resin layer. The resin layer is provided in an island-like shape in each of the pixels.
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公开(公告)号：US20240321843A1
公开(公告)日：2024-09-26
申请号：US18676771
申请日：2024-05-29
申请人： Aledia
摘要： An optoelectronic device including a support including a face; light-emitting diodes lying on the face and including semiconductor elements in the form of wires, cones or truncated cones; for each light-emitting diode, an encapsulation block at least partially transparent to the radiation emitted by the light-emitting diodes and covering the light-emitting diode, the maximum thickness of the encapsulation block being comprised between 1 μm and 30 μm, interstices of air being present between the encapsulation blocks covering adjacent diodes; and an electrically conductive layer covering the encapsulation blocks, wherein the refractive index of the encapsulation block covering at least one of the light-emitting diodes is comprised between 1.3 and 1.6.
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4.发明授权公开(公告)号：US12095013B2
公开(公告)日：2024-09-17
申请号：US17430283
申请日：2019-04-12
发明人： Ee Lian Lee , Boon Liang Yap , Prakash Rajah
CPC分类号： H01L33/58 , H01L33/005 , H01L33/54 , H01L2933/005 , H01L2933/0058
摘要： In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.
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公开(公告)号：US12094917B2
公开(公告)日：2024-09-17
申请号：US17444742
申请日：2021-08-09
发明人： Tae Gyun Kim , Jun Hong Park , Ki Beom Lee , Eui Suk Jung
CPC分类号： H01L27/156 , H01L33/24 , H01L33/54
摘要： A unit of light-emitting elements includes: a plurality of light-emitting elements; and a binder extending around a periphery of the light-emitting elements and fixing the light-emitting elements. Each of the light-emitting elements includes: first and second semiconductor layers; and an active layer therebetween. A first semiconductor layer, an active layer, and a second semiconductor layer of a first light-emitting element are arranged along a first direction in this order, and a second semiconductor layer, an active layer, and a first semiconductor layer of a second light-emitting element are arranged along the first direction in this order.
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公开(公告)号：US20240304766A1
公开(公告)日：2024-09-12
申请号：US18417508
申请日：2024-01-19
发明人： Hanhyoung Kim , Jaesung You , Hyeongdu Choi
摘要： A light-emitting device package includes a mold, a first electrode and a second electrode that are at least partially buried in the mold, a first light source disposed on the first electrode and electrically connected thereto, and a coating layer disposed on a first portion of the first electrode and a second portion of the second electrode. A thickness of the coating layer is 40 nm or more.
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公开(公告)号：US12080695B2
公开(公告)日：2024-09-03
申请号：US18463290
申请日：2023-09-08
申请人： NICHIA CORPORATION
发明人： Kenji Ozeki , Hiroki Fukuta
IPC分类号： H01L25/16 , H01L23/00 , H01L23/24 , H01L25/07 , H01L25/075 , H01L27/02 , H01L29/866 , H01L33/00 , H01L33/50 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62
CPC分类号： H01L25/167 , H01L24/26 , H01L24/73 , H01L24/96 , H01L24/97 , H01L33/0095 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L23/24 , H01L25/072 , H01L25/0753 , H01L27/0248 , H01L29/866 , H01L33/505 , H01L33/62 , H01L2224/16227 , H01L2224/26155 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92225 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/1304 , H01L2924/1426 , H01L2924/1811 , H01L2924/19105 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2224/97 , H01L2224/81 , H01L2224/97 , H01L2224/83
摘要： A method that includes providing a substrate having first and second regions for forming first and second light emitting devices, respectively, that are axisymmetrical in plan view with respect to a boundary line extending between the regions. The method includes mounting first and second light emitting elements in the first and second regions, respectively, arranging first and second light transmissive members respectively thereon, and arranging a covering member to collectively cover at least a portion of the first and second light emitting devices. The first and second devices have external connection terminals that are exposed. The terminals of the first light emitting device are on a side of the first light emitting device opposite to a side thereof adjacent the boundary line, and the terminals of the second light emitting device are on a side thereof opposite to a side of the second light emitting device adjacent the boundary line.
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公开(公告)号：US20240290925A1
公开(公告)日：2024-08-29
申请号：US18432738
申请日：2024-02-05
申请人： LG Display Co., Ltd.
发明人： Sangmin Park , ChangBae Park , Bogyun Chung , Gwangmin Yeo
CPC分类号： H01L33/62 , H01L25/167 , H01L33/54
摘要： A display device is disclosed. The display device comprises a display panel including a plurality of subpixels; a light emitting diode in a subpixel from the plurality of sub pixels; a first planarization layer that encloses the light emitting diode; a second planarization layer on the first planarization layer and the light emitting diode; and a connection electrode on the second planarization layer and connected to the light emitting diode. The first planarization layer includes a first open area that encloses the light emitting diode and a portion of the first planarization layer corresponding to the first open area has a first thickness that is less than a second thickness of a second portion of the first planarization layer.
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公开(公告)号：US12075652B2
公开(公告)日：2024-08-27
申请号：US17495947
申请日：2021-10-07
发明人： Shoma Hinata , Hiroaki Sano , Koji Ishizuya , Yojiro Matsuda
IPC分类号： H10K50/858 , H01L27/146 , H01L33/52 , H01L33/54 , H10K50/81 , H10K50/82 , H10K59/35 , H10K59/80
CPC分类号： H10K50/858 , H01L27/14627 , H01L33/52 , H01L33/54 , H10K50/81 , H10K50/82 , H10K59/35 , H10K59/873
摘要： A light-emitting device includes: a substrate; a lens; and a light-emitting part provided between the substrate and the lens, wherein the lens has a convex curved surface portion on an opposite side to the substrate, in a first direction perpendicular to the substrate, the light-emitting part is more distant from the lens than a curvature center of the curved surface portion, when an apex of the curved surface portion in the first direction is referred to as a first position, and an end of the curved surface portion in a second direction in parallel with the substrate is referred to as a second position, and h represents a distance from the first position to the second position in the first direction, and r represents a distance from the first position to the second position in the second direction, h/r
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公开(公告)号：US12027429B2
公开(公告)日：2024-07-02
申请号：US17202275
申请日：2021-03-15
发明人： Akiyoshi Aoyagi , Ken Kikuchi , Katsuhiro Tomoda
IPC分类号： H01L21/66 , F21V19/00 , G09G3/32 , H01L25/075 , H01L25/16 , H01L33/54 , H01L33/58 , H01L33/62 , F21Y115/10
CPC分类号： H01L22/22 , F21V19/003 , G09G3/32 , H01L25/0753 , H01L25/167 , H01L33/54 , H01L33/58 , H01L33/62 , F21Y2115/10 , G09G2300/0408 , G09G2300/0421 , H01L2924/0002 , H01L2924/0002 , H01L2924/00
摘要： A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a plurality of light-emitting elements (12) arranged in a matrix on the wiring substrate; and a plurality of drive ICs (13) that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines (16) on a mounting surface where the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.
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