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    DISPLAY DEVICE
    1.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号：US20240363596A1

    公开(公告)日：2024-10-31

    申请号：US18415183

    申请日：2024-01-17

    申请人： Samsung Display Co., LTD.

    发明人： Joo Woan CHO ,  Jin Taek PARK ,  Byeong Hwa CHOI ,  Jae Ho CHOI ,  Hae Yun CHOI

    IPC分类号： H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H05K1/18

    CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H05K1/189 ,  H05K2201/10128

    摘要： The present disclosure may provide a display device. According to one or more embodiments, the display device includes a first display panel for emitting a first light, a second display panel for emitting second light, a third display panel for emitting third light, and a light coupler for combining the first light, the second light, and the third light, and for outputting combined light, and a circuit board on a first surface of the light coupler, and electrically connected to the first display panel, to the second display panel, and to the third display panel, wherein the first display panel, the second display panel, and the third display panel are respectively on a second surface, a third surface, and a fourth surface of the light coupler.

    Light emitting module and liquid crystal display device
    2.
    发明授权
    Light emitting module and liquid crystal display device 有权

    公开(公告)号：US12132157B2

    公开(公告)日：2024-10-29

    申请号：US18490139

    申请日：2023-10-19

    申请人： NICHIA CORPORATION

    发明人： Takeshi Tamura

    IPC分类号： H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

    CPC分类号： H01L33/60 ,  G02F1/133603 ,  G02F1/133611 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  G02F1/133606 ,  H01L2933/0091

    摘要： A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

    Semiconductor light emitting device
    3.
    发明授权
    Semiconductor light emitting device 有权

    公开(公告)号：US12132154B2

    公开(公告)日：2024-10-29

    申请号：US17483118

    申请日：2021-09-23

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Dongkuk Lee ,  Daesup Kim ,  Dongmyung Shin ,  Wooseok Jang ,  Sunhwan Hwang

    IPC分类号： H01L33/50 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62

    CPC分类号： H01L33/504 ,  H01L33/0095 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041

    摘要： A semiconductor light emitting device is provided. The device includes: an LED chip having a lower surface, an upper surface, and a side surface between the upper surface and the lower surface; first and second conductive bumps disposed on first and second conductive bumps provided on the lower surface; a first wavelength conversion layer having a first region provided on the upper surface of the LED chip and a second region which extends past the side surface of the LED chip; a second wavelength conversion layer having a first surface contacting the side surface of the LED chip, a second surface, a third surface connecting the first surface and the second surface, and contacting the second region, and a fourth surface located opposite to the third surface and inclined; and a reflective resin portion provided on the lower surface of the LED chip and the fourth surface.

    LIGHT EMITTING DEVICE AND IMAGE DISPLAY APPARATUS
    4.
    发明公开
    LIGHT EMITTING DEVICE AND IMAGE DISPLAY APPARATUS 审中-公开

    公开(公告)号：US20240355965A1

    公开(公告)日：2024-10-24

    申请号：US18685638

    申请日：2022-03-17

    申请人： SONY GROUP CORPORATION

    发明人： Naoki HIRAO ,  Yusuke OYAMA

    IPC分类号： H01L33/20 ,  H01L25/075 ,  H01L33/60

    CPC分类号： H01L33/20 ,  H01L25/0753 ,  H01L33/60

    摘要： A light emitting device according to one embodiment of the present disclosure includes a first compound semiconductor layer having a first surface and a second surface that are opposed to each other, an active layer facing the second surface of the first compound semiconductor layer, a second compound semiconductor layer having a third surface that faces the active layer and a fourth surface that is opposed to the third surface and serves as a light exit surface and including one or a plurality of light collecting structures on the fourth surface, and a current narrowing structure provided within the first compound semiconductor layer or the second compound semiconductor layer.

    SUBSTRATE FOR MOUNTING LED AND LED-MOUNTED SUBSTRATE
    5.
    发明公开
    SUBSTRATE FOR MOUNTING LED AND LED-MOUNTED SUBSTRATE 审中-公开

    公开(公告)号：US20240351939A1

    公开(公告)日：2024-10-24

    申请号：US18291005

    申请日：2022-07-26

    申请人： TAIYO HOLDINGS CO., LTD.

    发明人： Meiten KOH ,  Haruka ONODA ,  Masayuki SHIMURA ,  Kosuke NAKAJIMA

    IPC分类号： C03C17/00 ,  C03C17/32 ,  H01L25/13 ,  H01L33/60

    CPC分类号： C03C17/009 ,  C03C17/007 ,  C03C17/32 ,  H01L25/13 ,  H01L33/60 ,  C03C2217/70

    摘要： Provided is a substrate for mounting an LED that can be applied to a thin base material and can result in a sufficient reflectance, particularly a substrate for mounting an LED, adaptable to a mini-LED and a μ-LED. In the substrate for mounting an LED, including a base material and a reflective layer that is layered on an upper region thereof, plural openings are disposed at generally equal spacings in longitudinal and lateral directions in the reflective layer, respectively, the reflective layer is the cured product of a curable resin composition including a curable resin and titanium oxide, the cured product has a storage elastic modulus of 4.0 GPa or less at 25° C., the spacings between the opening and the opening adjacent thereto in the longitudinal direction and the lateral direction are not less than twice the lengths of the opening in the longitudinal direction and the lateral direction, respectively, and the total area rate of the openings with respect to the area of the reflective layer is 0.1% or more and 9.0% or less.

    DISPLAY APPARATUS
    8.
    发明公开
    DISPLAY APPARATUS 审中-公开

    公开(公告)号：US20240339574A1

    公开(公告)日：2024-10-10

    申请号：US18451814

    申请日：2023-08-17

    申请人： AUO Corporation

    发明人： Hsin Chiang Chiang ,  Pao-Yu Huang

    IPC分类号： H01L33/60 ,  H01L25/075

    CPC分类号： H01L33/60 ,  H01L25/0753

    摘要： A display apparatus includes a driving circuit substrate, a plurality of light emitting devices, a filler, a color filter substrate, a first bank layer, a plurality of color conversion patterns, and a plurality of reflective structures. The light emitting devices are disposed on the driving circuit substrate. The filler is disposed on the light emitting devices. The color filter substrate is disposed opposite to the driving circuit substrate. The first bank layer is located between the color filter substrate and the filler. The color conversion patterns are respectively disposed in a plurality of openings of the first bank layer. The reflective structures are disposed on the driving circuit substrate and located between the light emitting devices and the driving circuit substrate. Each reflective structure has a reflective concave surface caved toward the driving circuit substrate. A reflectivity of the reflective structure falls within a range from 95% to 98%.