公开(公告)号：US11296392B1

公开(公告)日：2022-04-05

申请号：US17023580

申请日：2020-09-17

Applicant: Rohde & Schwarz GmbH & Co. KG

Inventor： Florian Huber

IPC: H01P1/202 ,  H01F7/02 ,  H01P1/218 ,  H01P1/201 ,  H01P7/00

Abstract: A magnetic structure for an electromagnetic resonator is provided. The magnetic structure comprises at least a solenoid and a permanent magnet, wherein the solenoid and the permanent magnet are concentrically arranged to each other such that the magnetic field lines provided by the permanent magnet are at least essentially perpendicular to magnetic field lines of a magnetic field generated by the solenoid. The arrangement of the permanent magnet and the solenoid may be housed by an element with a high magnetic permeability.

公开(公告)号：US10740688B2

公开(公告)日：2020-08-11

申请号：US15377005

申请日：2016-12-13

Applicant: RIGETTI & CO., INC.

Inventor： Michael Karunendra Selvanayagam ,  Chad T. Rigetti ,  Eyob A. Sete ,  Matthew J. Reagor

IPC: G06F15/80 ,  G06N99/00 ,  H01L39/02 ,  H01L39/22 ,  H01P5/02 ,  G06N10/00 ,  H01L27/18 ,  H01P1/201 ,  H01L39/04

Abstract: In a general aspect, a microwave quantum circuit includes an on-chip impedance matching circuit. In some cases, a microwave quantum circuit includes a dielectric substrate, a quantum circuit device on the substrate, and an impedance matching circuit device on the substrate. The quantum circuit device includes a Josephson junction, and the impedance matching circuit device is coupled to the quantum circuit device on the substrate.

公开(公告)号：US20190238109A1

公开(公告)日：2019-08-01

申请号：US16373025

申请日：2019-04-02

Applicant: Associated Universities, Inc.

Inventor： Matthew A. Morgan

IPC: H03H7/06 ,  H03H7/38 ,  H01P1/207 ,  H01P1/201 ,  H01F38/14 ,  H03H7/42 ,  H03H7/46

CPC classification number: H03H7/06 ,  H01F38/14 ,  H01F2038/143 ,  H01P1/201 ,  H01P1/207 ,  H03H7/38 ,  H03H7/42 ,  H03H7/46

Abstract: Reflectionless low-pass, high-pass, band-pass, band-stop, all-pass, all-stop, and multi-band filters, as well as a method for designing such filters is disclosed, along with a method of enhancing the performance of such filters through the use of unmatched sub-networks to realize an optimal frequency response, such as the Chebyshev equal-ripple response. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The unmatched sub-networks preferably offer additional degrees of freedom by which element values can be assigned to realize improved cutoff sharpness, stop-band rejection, or other measures of performance.

公开(公告)号：US10333188B2

公开(公告)日：2019-06-25

申请号：US15343742

申请日：2016-11-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bengui Yuan ,  Ling Guo ,  Qun Fang

IPC: H01P1/201 ,  H01P7/10 ,  H01P1/208 ,  H01P1/207

Abstract: A transverse magnetic (TM) mode dielectric filter includes an enclosure, a dielectric resonator, a main cover, and an elastic component, where the dielectric resonator is disposed in a resonant cavity of the enclosure; the main cover is secured between the elastic component and an open end of the enclosure; the elastic component includes multiple elastic flaps; the multiple elastic flaps are evenly distributed around an axial direction of the dielectric resonator; one end of each of the elastic flaps is fixedly connected to the main cover, and free ends of the elastic flaps elastically act on a central part of an outer surface of the main cover, to provide an elastic force towards the dielectric resonator. The evenly distributed multiple elastic flaps produce a pressure towards the dielectric resonator. A uniform and stable pressure is produced around the dielectric resonator, to ensure a uniform current density inside the resonant cavity.

公开(公告)号：US10297538B2

公开(公告)日：2019-05-21

申请号：US15497189

申请日：2017-04-25

Applicant: Panasonic Corporation

Inventor： Osamu Tabata ,  Shuichi Nagai ,  Songbaek Choe

IPC: H01L23/495 ,  H01F38/14 ,  H01L23/522 ,  H01L25/00 ,  H01P1/201 ,  H01P5/02 ,  H04B5/00 ,  H01L23/49 ,  H01P1/203 ,  H01L21/56 ,  H01P7/08 ,  H01L23/48

Abstract: A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.

公开(公告)号：US09935348B2

公开(公告)日：2018-04-03

申请号：US14651978

申请日：2013-10-10

Applicant: ZTE CORPORATION

Inventor： Wanli Yu ,  Yulong Kang ,  Xiaowen Dai

IPC: H01P1/208 ,  H01P11/00 ,  H01P1/20 ,  H01P1/201 ,  H01P7/10

CPC classification number: H01P1/2084 ,  H01P1/2002 ,  H01P1/201 ,  H01P7/10 ,  H01P11/008 ,  Y10T29/49018

Abstract: A method for implementing a TM dielectric resonator is provided, which includes: a dielectric resonant column component with a metal connecting plate is machined; a metal cavity with an opening at one end is machined; the metal connection plate of the dielectric resonant column component is fastened to the inner wall of the metal cavity by a screw; the opening of the metal cavity is covered with a prefabricated cover plate; and a prefabricated tuning screw is screwed from the cover plate into the metal cavity.

公开(公告)号：US09906204B2

公开(公告)日：2018-02-27

申请号：US14714122

申请日：2015-05-15

Applicant: Nokia Technologies Oy

Inventor： Toni H. Lähteensuo ,  Brecht Francois ,  Niels Bonne Larsen ,  Lingkai Kong

IPC: H03H7/46 ,  H01P1/201 ,  H01P1/10 ,  H01P5/12 ,  H04B1/04 ,  H04B1/10

CPC classification number: H03H7/465 ,  H01P1/10 ,  H01P1/201 ,  H01P5/12 ,  H04B1/0475 ,  H04B1/10

Abstract: Methods and apparatus, including computer program products, are provided for tunable filters and/or front-ends. In one aspect there is provided an apparatus. The apparatus may a first band filter; a second tunable band filter; and a radio frequency switch coupled to at least the first band filter and the second tunable band filter, wherein the radio frequency switch is configured to switch between at least the first band filter and the second tunable band filter. Related apparatus, systems, methods, and articles are also described.

公开(公告)号：US20170330824A1

公开(公告)日：2017-11-16

申请号：US15497189

申请日：2017-04-25

Applicant: Panasonic Corporation

Inventor： OSAMU TABATA ,  SHUICHI NAGAI ,  SONGBAEK CHOE

IPC: H01L23/495 ,  H01L23/522 ,  H01L25/00 ,  H01P1/201 ,  H01F38/14 ,  H04B5/00 ,  H01P5/02 ,  H01P7/08 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01F38/14 ,  H01L21/565 ,  H01L23/48 ,  H01L23/49 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/5227 ,  H01L25/00 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01P1/201 ,  H01P1/20345 ,  H01P5/028 ,  H01P7/08 ,  H04B5/0025 ,  H04B5/0093 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.

公开(公告)号：US09812752B2

公开(公告)日：2017-11-07

申请号：US15218626

申请日：2016-07-25

Applicant: QUALCOMM Incorporated

Inventor： John Jong-Hoon Lee ,  Young Kyu Song ,  Uei-Ming Jow ,  Sangjo Choi ,  Xiaonan Zhang

IPC: H01P1/20 ,  H01P7/06 ,  H01L21/00 ,  H01L27/15 ,  H01L23/66 ,  H01L49/02 ,  H03B5/18 ,  H01P1/201 ,  H01P1/207 ,  H01L23/552 ,  H01L21/48 ,  H01L23/522 ,  H01L23/60 ,  H01L23/00 ,  H05K1/02

CPC classification number: H01P1/207 ,  H01L21/4853 ,  H01L23/5222 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/60 ,  H01L23/66 ,  H01L24/16 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6627 ,  H01L2223/6666 ,  H01L2223/6672 ,  H01L2224/10 ,  H01L2224/16227 ,  H01P1/201 ,  H01P7/06 ,  H01P7/065 ,  H03B5/1817 ,  H05K1/0243

Abstract: A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.

公开(公告)号：US09786972B2

公开(公告)日：2017-10-10

申请号：US14790086

申请日：2015-07-02

Applicant: ANRITSU CORPORATION

Inventor： Takashi Kawamura ,  Akihito Otani

IPC: H01P1/201 ,  H01P1/207 ,  H01P1/04 ,  H01P5/02

CPC classification number: H01P1/201 ,  H01P1/042 ,  H01P1/207 ,  H01P5/024

Abstract: In an end surface 32b of the second transmission line forming body 32 forming a second waveguide 30, the height of a central region 33 which includes an opening of the second transmission line 30b is a reference plane. A depressed portion 32e that is depressed to a depth greater than the length of a thread portion of a screw 205 from the reference plane is provided in a region outside the central region 33 and includes a screw hole forming position. A screw hole 32d for fixing an external circuit 200 to be connected is provided at the screw hole forming position in the depressed portion 32e. The height of a region, which is excluding the depressed portion 32e and is further away from the central region 33 than the screw hole forming position, is equal to the reference plane.