公开(公告)号：US06700204B2

公开(公告)日：2004-03-02

申请号：US10038732

申请日：2002-01-02

申请人： Chien-Ping Huang ,  Chien-Te Chen

发明人： Chien-Ping Huang ,  Chien-Te Chen

IPC分类号： H01R2348

CPC分类号： H05K3/3442 ,  H05K1/111 ,  H05K3/28 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/24917

摘要： A substrate for accommodating a passive component is proposed, including a core layer defined with a chip attach area and a trace forming area surrounding the chip attach area, with a solder mask layer being applied on the trace forming area. At least a pair of solder pads are formed on the trace forming area, and partly exposed to outside of the solder mask layer. The solder pads are each formed at a central position with an recess, allowing the core layer to be partly exposed through the recesses of the solder pads. For bonding a passive component to the solder pads, solder paste soldered on the solder pads forms a recessed top surface due to surface tension of the solder paste, and generates a downward and convergent dragging force for properly positioning the passive component on the solder pads without producing shifting or tombstone effect.

摘要翻译： 提出了一种用于容纳无源部件的基板，包括由芯片附着区域限定的芯层和围绕芯片附着区域的迹线形成区域，在迹线形成区域上施加有阻焊层。 在迹线形成区域上形成至少一对焊盘，并且部分地暴露于焊料掩模层的外部。 焊盘各自形成在具有凹部的中心位置，允许芯层通过焊盘的凹部部分露出。 为了将无源部件焊接到焊盘，由于焊膏的表面张力焊接在焊盘上的焊膏形成凹陷的顶部表面，并且产生向下且会聚的拖曳力，以将无源部件适当地定位在焊盘上，而无需 产生转移或墓碑效应。

公开(公告)号：US06437450B1

公开(公告)日：2002-08-20

申请号：US09614726

申请日：2000-07-12

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01R2348

CPC分类号： H01L21/563 ,  H01L21/67092 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.