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公开(公告)号:US12040590B2
公开(公告)日:2024-07-16
申请号:US17273962
申请日:2019-09-24
申请人: ROHM CO., LTD.
发明人: Hiroyuki Tajiri , Kenji Sakai , Kazuyoshi Izumi
IPC分类号: H01S5/022 , H01S5/02212 , H01S5/0231
CPC分类号: H01S5/0231 , H01S5/022 , H01S5/02212
摘要: A semiconductor laser device A1 comprises a semiconductor laser chip 2 and a stem 1. The stem 1 includes a base 11 and leads 3A, 3B, and 3C fixed to the base, and supports the semiconductor laser chip 2. The semiconductor laser device A1 further comprises a first metal layer 15 including a first layer 151 covering the base 11 and the leads 3A, 3B, and 3C, a second layer 152 interposed between the first layer 151 and each of the base 11 and the leads 3A, 3B, and 3C, and a third layer 153 interposed between the second layer 152 and each of the base 11 and the leads 3A, 3B, and 3C. Crystal grains in the second layer 152 are smaller than crystal grains in the third layer 153. Such a configuration can suppress corrosion.
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公开(公告)号:US20240195142A1
公开(公告)日:2024-06-13
申请号:US18286856
申请日:2022-04-05
申请人: KYOCERA Corporation
发明人: Takayuki SHIRASAKI
摘要: A signal line includes a first section, a second section, and a third section. A width of a signal conductor in the second section is constant, is less than or equal to a width of the signal conductor in the first section, and is greater than a width of the signal conductor in a center portion of the third section. A distance between the signal conductor and each first ground conductor is constant in the second section, is less than the distance in the first section, and is greater than the distance in the center portion of the third section. The second section has a length of from ⅓ times to 3/2 times a distance H between the signal conductor and a second ground conductor on a side opposite to the coaxial line from a position at which a distal end portion of a pin terminal is present.
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公开(公告)号:US12007317B2
公开(公告)日:2024-06-11
申请号:US17606183
申请日:2020-04-22
发明人: Takuya Iida , Shiho Tokonami , Hiroki Ishikawa , Tsutomu Yamasaki
CPC分类号: G01N1/4022 , G01N1/10 , H01S5/022 , G01N2001/1025 , G01N2001/4027
摘要: A laser module includes a plurality of light emission regions and the plurality of light emission regions emit a plurality of laser beams. An optical waveguide and a lens condense the plurality of laser beams to an identical focal point. An adjustment mechanism is configured to adjust relative positional relation between the sample stage and a condenser lens (the optical waveguide and the lens). A controller is configured to switch between a single-point irradiation mode and a multi-point irradiation mode. The single-point irradiation mode refers to a mode in which the adjustment mechanism is controlled such that the focal point of the plurality of laser beams falls on the thin film. The multi-point irradiation mode refers to a mode in which the adjustment mechanism is controlled such that the focal point does not fall on the thin film.
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公开(公告)号:US11901692B2
公开(公告)日:2024-02-13
申请号:US17541933
申请日:2021-12-03
CPC分类号: H01S5/022 , G02B6/13 , H01S5/0202 , H01S5/028
摘要: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.
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公开(公告)号:US11899256B2
公开(公告)日:2024-02-13
申请号:US18093468
申请日:2023-01-05
申请人: NEC Corporation
发明人: Isao Tomita
IPC分类号: G02B6/42 , H04B10/40 , H04B10/61 , H01S5/02251 , H01S5/0239 , H01S5/50 , H01S5/00 , H01S5/14 , H01S5/02216 , G02F1/01 , H01S5/022 , G02F2/00
CPC分类号: G02B6/4292 , G02B6/42 , G02B6/4246 , H01S5/0239 , H01S5/02251 , H01S5/50 , H04B10/40 , H04B10/61 , G02F1/01 , G02F2/00 , H01S5/005 , H01S5/0064 , H01S5/0071 , H01S5/022 , H01S5/02216 , H01S5/142
摘要: A pluggable optical connector is configured to be insertable into and removable from an optical communication apparatus, and to be capable of communicating a modulation signal and a data signal with the optical communication apparatus. A wavelength-tunable light source is configured to output an output light and a local oscillation light. An optical transmission unit is configured to output an optical signal generated by modulating the output light in response to the modulation signal. An optical reception unit is configured to demodulate an optical signal received by using the local oscillation light to the data signal. Pluggable optical receptors are configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptors, and configured to be capable of outputting the optical signal to the optical fiber and transferring the optical signal received thorough the optical fiber to the optical reception unit.
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公开(公告)号:US20230369824A1
公开(公告)日:2023-11-16
申请号:US18358019
申请日:2023-07-24
申请人: NICHIA CORPORATION
发明人: Masatoshi NAKAGAKI , Soichiro MIURA
IPC分类号: H01S5/0239 , H01S5/40 , H01S5/02355 , H01S5/022 , H01S5/0233 , H01S5/02345
CPC分类号: H01S5/0239 , H01S5/40 , H01S5/02355 , H01S5/022 , H01S5/0233 , H01S5/4031 , H01S5/02345
摘要: A light emitting device includes first and second semiconductor laser elements, first and second light-reflective members, and a basal part. The light emitted from the first semiconductor laser element irradiates a first light-reflective surface of the first light-reflective member at a first position. The light emitted from the second semiconductor laser element irradiates a second light-reflective surface of the second light-reflective member at a second position. A height of the first position is different from a height of the second position. With respect to a virtual axis extending along the prescribed direction, the first position and the second position have the same coordinates. A mounting position of the first light-reflective member and a mounting position of the second light-reflective member are different with respect to the prescribed direction.
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公开(公告)号:US11784461B2
公开(公告)日:2023-10-10
申请号:US17697897
申请日:2022-03-17
申请人: NICHIA CORPORATION
发明人: Masatoshi Nakagaki , Soichiro Miura
IPC分类号: H01S5/02355 , H01S5/0239 , H01S5/40 , H01S5/0233 , H01S5/022 , H01S5/02345
CPC分类号: H01S5/0239 , H01S5/022 , H01S5/0233 , H01S5/02355 , H01S5/40 , H01S5/4031 , H01S5/02345
摘要: A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.
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公开(公告)号:US11757536B2
公开(公告)日:2023-09-12
申请号:US17620061
申请日:2020-06-26
申请人: KYOCERA CORPORATION
发明人: Tomonori Sugime
CPC分类号: H04B10/807 , H01S5/022 , H02J50/30
摘要: A power over fiber system includes a power sourcing equipment, a powered device, an optical fiber cable and a converter. The power sourcing equipment includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The powered device includes a photoelectric conversion element that converts the feed light into electric power. The optical fiber cable has one end connectable to the power sourcing equipment and another end connectable to the powered device to transmit the feed light. The converter converts a wavelength of the feed light.
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公开(公告)号:US20230275194A1
公开(公告)日:2023-08-31
申请号:US18005533
申请日:2021-07-13
发明人: Matthias Hien
IPC分类号: H01L33/48 , H01L25/075 , H01L25/04 , H01L31/0203 , H01L31/18 , H01S5/022 , B33Y80/00 , B33Y10/00
CPC分类号: H01L33/486 , H01L25/0753 , H01L25/042 , H01L31/0203 , H01L31/18 , H01S5/022 , B33Y80/00 , B33Y10/00 , H01L2933/0033
摘要: A method for manufacturing a component is disclosed. In an embodiment a method for producing a component includes providing a connection carrier and forming a housing body on at least a part of the connection carrier by a 3D printing method, wherein forming the housing body includes applying at least one layer of a liquid potting compound, selectively curing the at least one layer of the liquid potting compound and removing residues of the liquid potting compound.
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公开(公告)号:US11735889B1
公开(公告)日:2023-08-22
申请号:US17672936
申请日:2022-02-16
发明人: Anders Larsson , Dimitrios Kalavrouziotis , Attila Fulop , Filip Leonard Hjort , Elad Mentovich
CPC分类号: H01S5/183 , H01S5/022 , H04B10/40 , H04B10/503
摘要: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.
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