Semiconductor laser device
    1.
    发明授权

    公开(公告)号:US12040590B2

    公开(公告)日:2024-07-16

    申请号:US17273962

    申请日:2019-09-24

    申请人: ROHM CO., LTD.

    摘要: A semiconductor laser device A1 comprises a semiconductor laser chip 2 and a stem 1. The stem 1 includes a base 11 and leads 3A, 3B, and 3C fixed to the base, and supports the semiconductor laser chip 2. The semiconductor laser device A1 further comprises a first metal layer 15 including a first layer 151 covering the base 11 and the leads 3A, 3B, and 3C, a second layer 152 interposed between the first layer 151 and each of the base 11 and the leads 3A, 3B, and 3C, and a third layer 153 interposed between the second layer 152 and each of the base 11 and the leads 3A, 3B, and 3C. Crystal grains in the second layer 152 are smaller than crystal grains in the third layer 153. Such a configuration can suppress corrosion.

    PACKAGE FOR ACCOMMODATING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE

    公开(公告)号:US20240195142A1

    公开(公告)日:2024-06-13

    申请号:US18286856

    申请日:2022-04-05

    IPC分类号: H01S5/022 H01P3/06

    CPC分类号: H01S5/022 H01P3/06

    摘要: A signal line includes a first section, a second section, and a third section. A width of a signal conductor in the second section is constant, is less than or equal to a width of the signal conductor in the first section, and is greater than a width of the signal conductor in a center portion of the third section. A distance between the signal conductor and each first ground conductor is constant in the second section, is less than the distance in the first section, and is greater than the distance in the center portion of the third section. The second section has a length of from ⅓ times to 3/2 times a distance H between the signal conductor and a second ground conductor on a side opposite to the coaxial line from a position at which a distal end portion of a pin terminal is present.

    LIGHT EMITTING DEVICE
    6.
    发明公开

    公开(公告)号:US20230369824A1

    公开(公告)日:2023-11-16

    申请号:US18358019

    申请日:2023-07-24

    摘要: A light emitting device includes first and second semiconductor laser elements, first and second light-reflective members, and a basal part. The light emitted from the first semiconductor laser element irradiates a first light-reflective surface of the first light-reflective member at a first position. The light emitted from the second semiconductor laser element irradiates a second light-reflective surface of the second light-reflective member at a second position. A height of the first position is different from a height of the second position. With respect to a virtual axis extending along the prescribed direction, the first position and the second position have the same coordinates. A mounting position of the first light-reflective member and a mounting position of the second light-reflective member are different with respect to the prescribed direction.

    Power over fiber system
    8.
    发明授权

    公开(公告)号:US11757536B2

    公开(公告)日:2023-09-12

    申请号:US17620061

    申请日:2020-06-26

    发明人: Tomonori Sugime

    IPC分类号: H04B10/80 H02J50/30 H01S5/022

    摘要: A power over fiber system includes a power sourcing equipment, a powered device, an optical fiber cable and a converter. The power sourcing equipment includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The powered device includes a photoelectric conversion element that converts the feed light into electric power. The optical fiber cable has one end connectable to the power sourcing equipment and another end connectable to the powered device to transmit the feed light. The converter converts a wavelength of the feed light.

    Sealed optoelectronic components and associated optical devices

    公开(公告)号:US11735889B1

    公开(公告)日:2023-08-22

    申请号:US17672936

    申请日:2022-02-16

    摘要: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.