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公开(公告)号:US11005018B2
公开(公告)日:2021-05-11
申请号:US16197103
申请日:2018-11-20
申请人: Chen-Fu Chu
发明人: Chen-Fu Chu
IPC分类号: H01L33/62 , H01L27/15 , H01L33/52 , H01L25/075 , H01L25/16 , H01L33/36 , H01L33/50 , H01L33/56 , H01L21/78 , H01L21/304 , H01L33/00 , H01S5/02232 , H01S5/022 , B05C5/02 , B05C9/12 , B05C9/14 , C23C14/14 , C23C14/34 , C23C16/455 , C23C16/50 , H01L31/16 , H01L33/32 , H01L33/44 , H01L33/58 , H01L33/60 , H01L33/64
摘要: A semiconductor continuous array layer comprising: an array of multiple semiconductor units; a sidewall of each semiconductor unit is surrounded by a semi-cured material or a cured material connecting the semiconductor units together to form a semiconductor continuous array; wherein multiple voids or air gaps are enclosed by the semi-cured material or the cured material within the semiconductor continuous array or around the edge of the semiconductor continuous array.
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公开(公告)号:US20230101190A1
公开(公告)日:2023-03-30
申请号:US18077234
申请日:2022-12-08
申请人: Chen-Fu CHU
发明人: Chen-Fu CHU
IPC分类号: H01L25/075 , H01L27/15 , H01L33/56 , H01L33/50 , H01L33/62 , H01L33/36 , H01L25/16 , H01L33/52 , C23C14/34 , B05C5/02 , H01L21/78 , H01S5/0234 , H01L33/44 , B05C9/14 , C23C16/50 , C23C14/14 , H01L33/00 , H01S5/023 , H01S5/0235 , H01L33/58 , H01L31/16 , B05C9/12 , C23C16/455 , H01L21/304 , H01L33/60 , H01L33/64 , H01S5/02234 , H01S5/02232 , H01S5/0233 , H01L33/32
摘要: Disclosed is a color emissive LED array having a substantially flat backplane which has circuitry. The color emissive LED array includes a plurality of multi thickness color emissive LED units disposed in an array on the substantially flat backplane; The plurality of multi thickness color emissive LED units have a thickness of the first color emissive LED unit is less than a thickness of the second color emissive LED unit and less than a thickness of the third color emissive LED unit. Meanwhile, the substantially flat backplane having circuitry has one or more anode and one or more cathode. Further, the array is attached to the substantially flat backplane having circuitry by using a jointing layer.
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