公开(公告)号：US20240213951A1

公开(公告)日：2024-06-27

申请号：US18596747

申请日：2024-03-06

申请人： Murata Manufacturing Co., Ltd.

发明人： Kazumasa HARUTA

IPC分类号： H03H9/08 ,  H03H9/10 ,  H03H9/13 ,  H03H9/17

CPC分类号： H03H9/08 ,  H03H9/105 ,  H03H9/13 ,  H03H9/173 ,  H03H9/176

摘要： An acoustic wave device includes a support, a piezoelectric layer having anisotropy of a coefficient of linear expansion, and including first and second main surfaces, and first and second electrodes on the first and second main surfaces of the piezoelectric layer. The support includes a hollow portion. At least a portion of the first and second electrodes overlaps the hollow portion. A heat dissipation structure including the support is provided on the first main surface side of the piezoelectric layer. One of a first and second region includes a high heat dissipation region. Each of the first and second electrodes includes an electrode layer having a higher coefficient of linear expansion than a maximum coefficient of linear expansion of the piezoelectric layer.

公开(公告)号：US20240072727A1

公开(公告)日：2024-02-29

申请号：US18271580

申请日：2022-02-21

申请人： DAISHINKU CORPORATION

发明人： Takuya KOJO

IPC分类号： H03B5/04 ,  H03B5/32 ,  H03H9/05 ,  H03H9/08

CPC分类号： H03B5/04 ,  H03B5/32 ,  H03H9/0552 ,  H03H9/08

摘要： An OCXO according to one or more embodiments may include a core section hermetically encapsulated in a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC. The core section is supported by the package via a core substrate. The OCXO further includes a capacitor as an electronic component for adjustment, which is attached to the package by soldering. The core section is vacuum-sealed in a sealed space of the package, while the capacitor is disposed in a space other than the sealed space.

公开(公告)号：US11831277B2

公开(公告)日：2023-11-28

申请号：US17826216

申请日：2022-05-27

申请人： Seiko Epson Corporation

发明人： Ryuta Nishizawa ,  Junichi Takeuchi

IPC分类号： H03B5/32 ,  H03H9/08 ,  H03H9/05

CPC分类号： H03B5/32 ,  H03H9/0538 ,  H03H9/08

摘要： A resonator device includes a resonator element, a base which has a first surface and a second surface that are in front-back relation, and in which the resonator element is arranged at the first surface, an integrated circuit provided to the base, a lid which has an inner surface opposed to the resonator element, and an outer surface in a front-back relationship with the inner surface, and which is bonded to the base so as to house the resonator element, and a radiation layer which is arranged at the inner surface of the lid, and is higher in emissivity than the lid.

公开(公告)号：US11716054B2

公开(公告)日：2023-08-01

申请号：US17620829

申请日：2020-05-28

申请人： ECOLE NATIONALE SUPERIEURE DE MECANIQUE ET DES MICROTECHNIQUES—ENSMM ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE—CNRS

发明人： Thomas Baron ,  Gilles Martin ,  Valérie Soumann ,  Yannick Gruson

IPC分类号： H03B5/32 ,  H03B1/02 ,  H03L1/02 ,  H03L1/04 ,  H03H9/02 ,  H03H9/08

CPC分类号： H03B5/32 ,  H03B1/02 ,  H03L1/02 ,  H03L1/04 ,  H03H9/02448 ,  H03H9/08

摘要： A temperature-controlled RF resonator. The resonator includes an insulating thermal enclosure within which are implemented: at least one resonant element configured to deliver an RF output signal when supplied with an RF input signal; at least one heating element configured to supply thermal energy within the thermal enclosure when the at least one heating element is powered by an LF electric power signal; and at least one temperature sensor configured to deliver an LF electric measurement signal as a function of the temperature inside the thermal enclosure. Such an RF resonator has at least one input/output port crossing the insulating thermal enclosure and propagating at least: one signal from among the RF signals; and another signal from among the LF electric signals.

公开(公告)号：US20230032754A1

公开(公告)日：2023-02-02

申请号：US17876657

申请日：2022-07-29

申请人： SEIKO EPSON CORPORATION

发明人： Ryuta NISHIZAWA ,  Junichi TAKEUCHI

IPC分类号： H03B5/04 ,  H03B5/36 ,  H01L23/34 ,  H03H9/08 ,  H03H9/02 ,  H03H9/19

摘要： A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid. In addition, a constituent material of the first lid is silicon, and the emissivity of the low emissivity layer at room temperature is less than 0.5.

公开(公告)号：US20230013541A1

公开(公告)日：2023-01-19

申请号：US17810869

申请日：2022-07-06

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Joshua James Caron ,  Eesa Rahimi

IPC分类号： H03H9/02 ,  H03H9/64 ,  H03F1/30 ,  H03H9/08 ,  H03H9/10

摘要： A surface acoustic wave device including a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode. The polymeric roof layer is spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode. The polymeric roof layer is supported along a span of the polymeric roof layer by at least one pillar. The thermal conductivity of the pillar is greater than the thermal conductivity of the polymeric roof layer. Related wafer-level packages, radio frequency modules and wireless communication devices are also provided.

公开(公告)号：US11309863B2

公开(公告)日：2022-04-19

申请号：US16154067

申请日：2018-10-08

申请人： RAKON LIMITED

发明人： Brent John Robinson

IPC分类号： H03H9/08 ,  H03H9/05 ,  G01K1/14 ,  H03B5/32 ,  G01K7/22 ,  G01K11/26 ,  H03H9/10 ,  H03H9/205

摘要： A single frequency control device incorporating a high frequency resonator, a low frequency resonator and a temperature sensing element, the latter thermally coupled closely to the said resonators to facilitate temperature sensing with higher resolution and accuracy. Additional benefits offered by the structure include smaller size and lower cost.

公开(公告)号：US11239821B2

公开(公告)日：2022-02-01

申请号：US16704291

申请日：2019-12-05

申请人： Murata Manufacturing Co., Ltd.

发明人： Masato Nomiya

IPC分类号： H03H9/05 ,  H03H9/08 ,  H03H9/10 ,  H03H9/64 ,  H03H9/72

摘要： An electronic component device includes first and second mount boards, and first, second, and third electronic components. The first electronic component includes a first major surface and a second major surface, and is disposed on the first mount board. The first major surface is positioned closer to the first mount board than the second major surface. The second electronic component includes a third major surface and a fourth major surface, and is disposed on the second mount board. The third major surface is positioned closer to the second mount board than the fourth major surface. The third electronic component includes a fifth major surface and a sixth major surface, and is disposed on the second mount board. The fifth major surface is positioned closer to the second mount board than the sixth major surface. The second major surface directly contacts the fourth and sixth major surfaces, or indirectly contacts the fourth and sixth major surfaces with a bonding layer interposed therebetween.

公开(公告)号：US20210250012A1

公开(公告)日：2021-08-12

申请号：US17240943

申请日：2021-04-26

申请人： Global Communication Semiconductors, LLC.

发明人： Liping D. Hou ,  Kun-Mao Pan ,  Shing-Kuo Wang

IPC分类号： H03H9/08 ,  H03H3/02 ,  H03H9/17

摘要： Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack formed over a substrate includes a piezoelectric film element, a first (e.g., bottom) electrode coupled to a first side of the piezoelectric film element, and a second (e.g., top) electrode that is coupled to a second side of the piezoelectric film element. A cavity is positioned between the stack and the substrate. The resonator includes one or more planarizing layers, including a first planarizing layer around the cavity, wherein a first portion of the first electrode is adjacent the cavity and a second portion of the first electrode is adjacent the first planarizing layer. The resonator optionally includes an air reflector around the perimeter of the piezoelectric film element. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode.

公开(公告)号：US20210067132A1

公开(公告)日：2021-03-04

申请号：US16550673

申请日：2019-08-26

申请人： Intel Corporation

发明人： Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC分类号： H03H9/08 ,  H01L27/20 ,  H03H9/70 ,  H01L23/552 ,  H01L23/367 ,  H01L25/16 ,  H01L23/498 ,  H03H3/02 ,  H03H9/54 ,  H03H9/05 ,  H01L23/66

摘要： Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.