BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING SILICON DIOXIDE INSULATION

    公开(公告)号:US20230115592A1

    公开(公告)日:2023-04-13

    申请号:US17938114

    申请日:2022-10-05

    摘要: An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of dielectric material disposed on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of dielectric material, a redistribution layer disposed on the layer of dielectric material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.

    Nonlinear acoustic medium
    4.
    发明授权

    公开(公告)号:US11581871B1

    公开(公告)日:2023-02-14

    申请号:US16269499

    申请日:2019-02-06

    申请人: FemtoDx, Inc.

    发明人: Pritiraj Mohanty

    摘要: Nonlinear acoustic media and related methods are described herein. The nonlinear acoustic media are configured to generate higher harmonic output signals from a single-frequency input signal. The higher harmonic output signals can be generated through the coupling of an acoustic dielectric medium to a nonlinear piezoelectric medium having four ports.

    RESONATOR AND RESONANCE DEVICE
    5.
    发明申请

    公开(公告)号:US20230014350A1

    公开(公告)日:2023-01-19

    申请号:US17954892

    申请日:2022-09-28

    IPC分类号: H03H9/10 H03H9/24 H03H9/05

    摘要: A resonator may include a vibrating portion that includes a plurality of vibrating arms to numbering in three or more, each having a fixed end, and including at least two vibrating arms to bend out of plane with different phases and a base portion having a fore end portion to which the fixed end of each of the plurality of vibrating arms to is connected and a rear end portion opposed to the fore end portion; a holding portion configured to hold the vibrating portion; and a support arm having one end connected to the holding portion and the other end connected to the rear end portion of the base portion. The support arm is asymmetric with respect to a center line of the vibrating portion with respect to a longitudinal direction in plan view.

    Vibration element, electronic apparatus, and vehicle

    公开(公告)号:US11538981B2

    公开(公告)日:2022-12-27

    申请号:US16911437

    申请日:2020-06-25

    摘要: A vibration element includes: a base; a first arm continuous with the base; a second arm that is continuous with the base and is adjacent to the first arm; a first electrode disposed on the first arm, the second arm, and the base; a first piezoelectric layer that has a first polarity and that is disposed on the first electrode on the first arm; a second piezoelectric layer that has a second polarity different from the first polarity and that is disposed on the first electrode on the second arm; an insulating layer disposed on the first electrode on the base; and a second electrode disposed on the first piezoelectric layer, the second piezoelectric layer, and the insulating layer.

    Methods and devices for microelectromechanical resonators

    公开(公告)号:US11479460B2

    公开(公告)日:2022-10-25

    申请号:US16369757

    申请日:2019-03-29

    摘要: MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

    MICROELECTROMECHANICAL RESONATOR
    8.
    发明申请

    公开(公告)号:US20220337218A1

    公开(公告)日:2022-10-20

    申请号:US17847438

    申请日:2022-06-23

    申请人: SiTime Coporation

    摘要: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

    Resonator electrode shields
    9.
    发明授权

    公开(公告)号:US11444600B1

    公开(公告)日:2022-09-13

    申请号:US17199275

    申请日:2021-03-11

    申请人: SiTime Coporation

    IPC分类号: H03H9/24 H03H9/02 H03H3/007

    摘要: A microelectromechanical system (MEMS) resonator includes a resonant semiconductor structure, drive electrode, sense electrode and electrically conductive shielding structure. The first drive electrode generates a time-varying electrostatic force that causes the resonant semiconductor structure to resonate mechanically, and the first sense electrode generates a timing signal in response to the mechanical resonance of the resonant semiconductor structure. The electrically conductive shielding structure is disposed between the first drive electrode and the first sense electrode to shield the first sense electrode from electric field lines emanating from the first drive electrode.

    Resonance device
    10.
    发明授权

    公开(公告)号:US11283422B2

    公开(公告)日:2022-03-22

    申请号:US16860196

    申请日:2020-04-28

    摘要: A resonator that includes a substrate, an insulating film that is formed on the substrate, and vibration regions each of which is formed on the insulating film and includes lower electrodes that are formed on the insulating film, a piezoelectric film that is formed on the lower electrodes, and an upper electrode that is formed on the piezoelectric film. At least one lower electrode of the lower electrodes that are formed on the insulating film has an electric potential that differs from an electric potential of another lower electrode such that at least one vibration region vibrates in antiphase with another vibration region. Moreover, a package seals a resonator and includes the substrate, the insulating film, and the vibration regions and includes a ground terminal for grounding the substrate.