Systems and methods for improving radio frequency integrated circuits

    公开(公告)号:US11329732B1

    公开(公告)日:2022-05-10

    申请号:US17606775

    申请日:2020-10-23

    摘要: Systems and methods for improving radio frequency integrated circuits. Extended conducting plates having current forming elements are used to equalize return currents from an array of capacitance banks in radio frequency integrated circuits and to reduce crosstalk between crossing signal lines by providing isolation mechanisms for use as a shield between the signal carrying lines. Material encapsulated magneto-electric antennas are configured into antenna arrays on a PCB or a RFIC package. Antenna arrays may comprise antennas having different directivity levels and may have asymmetric arrangement of antenna elements.

    Automated analysis of RF spectrum

    公开(公告)号:US10735109B1

    公开(公告)日:2020-08-04

    申请号:US16739812

    申请日:2020-01-10

    申请人: EXFO Inc.

    摘要: Systems and methods e to automatically analyze and display results of tests of a link include obtaining data from one or more tests of a link, wherein the data includes samples for Antenna Carriers (AxC) for one or more AxCs auto-detected on the link; processing the data to detect peaks on any of the auto-detected AxCs on the link; performing an analysis of any detected peaks to identify any issues on the link; and causing display of a user interface that includes a reporting of any identified issues with the user interface including a display of the identified issues and a spectrum graph.

    Shielding via display chassis
    9.
    发明授权

    公开(公告)号:US10156872B2

    公开(公告)日:2018-12-18

    申请号:US15356168

    申请日:2016-11-18

    IPC分类号: G06F1/16 G06F1/18 H04B15/04

    摘要: An electronic device includes a case, an antenna supported by the case, a display module disposed within the case, a conductive chassis disposed within the case, the conductive chassis structurally supporting the display module, an electronics module disposed within the case such that the conductive chassis is positioned between the antenna and the electronics module, and an interconnect that electrically connects the conductive chassis and the case, the interconnect extending around the electronics module.