-
公开(公告)号：US12228771B2
公开(公告)日：2025-02-18
申请号：US17270799
申请日：2018-09-04
Applicant: JABIL INC.
Inventor： Wenlu Wang , Marcel Moortgat
Abstract: An apparatus, system and method of providing a tray suitable for holding an optoelectronic device during printed circuit board manufacturing processes. The apparatus, system and method includes a tray body having an inset for receiving the optoelectronic device; a plurality of positioners for the optoelectronic device within the inset; and a guide channel about a perimeter of the tray body suitable for receiving optical fibers of the optoelectronic device when the optoelectronic device is received in the inset, the guide channel comprising at least one retainer for retaining received ones of the optical fibers therewithin.
-
公开(公告)号：US20250056778A1
公开(公告)日：2025-02-13
申请号：US18718740
申请日：2021-12-27
Applicant: FUJI CORPORATION
Inventor： Shota SHIMIZU , Toshiaki MIZUNO
Abstract: A mounting device, which picks up a component by a suction nozzle attached to a syringe and mounts the component on a board, includes a camera configured to capture an image of a target object from below, a head provided with the syringe to be able to be lifted or lowered and configured to move in a horizontal direction, a control section configured to control the head and the camera such that a jig nozzle is attached to the syringe at a predetermined determination timing and an image of the jig nozzle is captured from below in a state where the syringe is lowered at a predetermined position in the horizontal direction, and a determination section configured to process the captured image and determine bending of the syringe based on a position of the jig nozzle with respect to the predetermined position.
-
公开(公告)号：US12207413B2
公开(公告)日：2025-01-21
申请号：US18001039
申请日：2020-07-08
Applicant: FUJI CORPORATION
Inventor： Noriaki Iwaki
Abstract: A component supply method of supplying components scattered on a stage, includes a storage step of storing position information indicating a position of a component, posture information indicating a posture of the component, and number information indicating the number of components based on imaging data of the components scattered on the stage, and a holding step of holding the components scattered on the stage with a holding tool based on the position information and the posture information stored in the storage step.
-
公开(公告)号：US12201984B2
公开(公告)日：2025-01-21
申请号：US18503759
申请日：2023-11-07
Applicant: MGI Tech Co., Ltd.
Inventor： Jian Gong , Liang Wang , Yan-You Lin , Cheng Frank Zhong
IPC: B23P19/04 , B01L3/00 , G01N27/447 , H05K13/04 , G02B26/00
Abstract: An apparatus for forming a plurality of microdroplets from a droplet includes a substrate, a dielectric layer on the substrate and having a plurality of hydrophilic surface regions spaced apart from each other by a hydrophobic surface, and a plurality of electrodes covered by the dielectric layer. The electrodes are configured to form an electric field across the droplet in response to voltages provided by a control circuit to move the droplet across the dielectric layer in a lateral direction while leaving portions of the droplet on the hydrophilic surface regions to form the plurality of microdroplets on the hydrophilic surface regions.
-
公开(公告)号：US12191987B2
公开(公告)日：2025-01-07
申请号：US18388461
申请日：2023-11-09
Applicant: Intel Corporation
Inventor： Francesc Guim Bernat , Susanne M. Balle , Rahul Khanna , Sujoy Sen , Karthik Kumar
IPC: H04L43/08 , G02B6/38 , G02B6/42 , G02B6/44 , G06F1/18 , G06F1/20 , G06F3/06 , G06F8/65 , G06F9/4401 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G06F13/40 , G06F15/16 , G06F16/174 , G06F16/901 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04B10/25 , H04L41/14 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L49/00 , H04L49/25 , H04L49/356 , H04L49/45 , H04L67/02 , H04L67/306 , H04L69/04 , H04L69/329 , H04Q11/00 , H05K7/14 , B25J15/00 , B65G1/04 , G05D23/19 , G05D23/20 , G06F9/50 , G06F11/14 , G06F11/34 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F13/42 , G06F15/80 , G06Q10/06 , G06Q10/0631 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/00 , G11C5/06 , H04J14/00 , H04L9/06 , H04L9/14 , H04L9/32 , H04L12/28 , H04L41/02 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/70 , H04L47/765 , H04L47/78 , H04L47/80 , H04L47/83 , H04L49/15 , H04L49/55 , H04L61/00 , H04L67/00 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/51 , H04Q1/04 , H04W4/02 , H04W4/80 , H05K1/02 , H05K1/18 , H05K5/02 , H05K7/20 , H05K13/04
Abstract: Technologies for dynamically managing resources in disaggregated accelerators include an accelerator. The accelerator includes acceleration circuitry with multiple logic portions, each capable of executing a different workload. Additionally, the accelerator includes communication circuitry to receive a workload to be executed by a logic portion of the accelerator and a dynamic resource allocation logic unit to identify a resource utilization threshold associated with one or more shared resources of the accelerator to be used by a logic portion in the execution of the workload, limit, as a function of the resource utilization threshold, the utilization of the one or more shared resources by the logic portion as the logic portion executes the workload, and subsequently adjust the resource utilization threshold as the workload is executed. Other embodiments are also described and claimed.
-
Patent Agency Ranking
公开(公告)号：US12186794B2
公开(公告)日：2025-01-07
申请号：US17436364
申请日：2019-03-08
Applicant: FUJI CORPORATION
Inventor： Satoshi Kato
Abstract: A bending device to bend leads of a component one by one in the same direction at different timings. The bending device including a support block below the component that is movable in a vertical direction; a pair of support members fixed to the support block, the pair of support members contacting and supporting the leads of the component from below; a pair of clamp arms swingably held to the support block, the pair of clamp arms contacting and clamping the leads of the component from above; and a pair of bending rollers arranged above the leads of the component that bend the leads at the different timings.
-
公开(公告)号：US20240422956A1
公开(公告)日：2024-12-19
申请号：US18805605
申请日：2024-08-15
Applicant: ASMPT GmbH & Co. KG
Inventor： Karl-Heinz BESCH , Thomas BLIEM , Thomas ROSSMANN , Klaus SATTLER , Michele TRIGIANI , Markus HUBER
Abstract: A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.
-
公开(公告)号：US12159800B2
公开(公告)日：2024-12-03
申请号：US16818469
申请日：2020-03-13
Applicant: LG ELECTRONICS INC.
Inventor： Inbum Yang , Sangsik Jung , Imdeok Jung , Bongwoon Choi
IPC: H01L21/677 , H01L25/075 , H01L33/00 , H05K13/02 , H05K13/04
Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.
-
公开(公告)号：US20240397687A1
公开(公告)日：2024-11-28
申请号：US18791885
申请日：2024-08-01
Applicant: JABIL INC.
Inventor： Mark Tudman , Rayce Loftin
Abstract: An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.
-
公开(公告)号：US20240390934A1
公开(公告)日：2024-11-28
申请号：US18793442
申请日：2024-08-02
Applicant: Kulicke and Soffa Hi-Tech Co., Ltd.
Inventor： Lu-Min Chen , Tsung-Lin Tsai
Abstract: A dual-valve automatic calibration system comprises a primary positioner, a first secondary positioner and a second secondary positioner: the first secondary positioner and the second secondary positioner are connected with a first fluid coating unit and a second fluid coating unit, respectively; the primary positioner comprises a primary X-axis positioner and a primary Y-axis positioner; both the first secondary positioner and the second secondary positioner are connected with the primary X-axis positioner. In contrast to the prior art that a secondary positioner is installed on a primary Z-axis positioner, a dual-valve automatic calibration system contributes to promotion of positioning precision on the Z-axis and reduction of a burden imposed on the Z-axis.
-
-
-
-
-
-
-
-
-
Search Results
6448
records
(took 0.023 seconds)
