公开(公告)号：US20240365473A1

公开(公告)日：2024-10-31

申请号：US18764342

申请日：2024-07-04

申请人： TONG HSING ELECTRONIC INDUSTRIES, LTD.

发明人： YU-HSIEN LIAO ,  JHIH-WEI LAI ,  CHUN-CHIEH LIAO ,  JIAN-YU SHIH

IPC分类号： H05K3/02 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K3/027 ,  H05K1/0298 ,  H05K1/115

摘要： A method for manufacturing a conductive circuit board includes the steps of: preparing a substrate having opposite upper and lower surfaces, and at least one via hole extending through the upper and lower surfaces and defined by an inner surface; forming a compound metal layer on at least one of the upper surface and the lower surface of the substrate and on the inner surface; etching the compound metal layer by a laser beam, so that a patterned metal circuit layer having a predetermined pattern formed on the substrate; and forming a surface finish layer on a top surface of the patterned metal circuit layer, so as to form a conductive circuit layer. A conductive circuit board manufactured therefrom is also enclosed.

公开(公告)号：US20240301173A1

公开(公告)日：2024-09-12

申请号：US18665379

申请日：2024-05-15

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Kouichi AOKI

IPC分类号： C08K9/04 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B25/08 ,  B32B25/16 ,  B32B27/28 ,  C08J5/18 ,  C08K3/36 ,  C08L23/16 ,  H05K1/03 ,  H05K3/02

CPC分类号： C08K9/04 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B25/08 ,  B32B25/16 ,  B32B27/285 ,  C08J5/18 ,  C08K3/36 ,  C08L23/16 ,  H05K1/036 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2457/08 ,  C08J2323/16 ,  C08J2423/16 ,  C08L2203/202 ,  C08L2205/025 ,  H05K3/022 ,  H05K2201/0195

摘要： A resin sheet includes a dried product or semi-cured product of a thermosetting composition, the thermosetting composition including an ethylene-propylene-diene copolymer as Component (A); and an inorganic filler, as Component (B), surface-treated with a surface treatment agent having a polymerizable unsaturated bond.

公开(公告)号：US12088208B1

公开(公告)日：2024-09-10

申请号：US18206890

申请日：2023-06-07

申请人： Vicor Corporation

发明人： Patrizio Vinciarelli

IPC分类号： H02M3/335 ,  H01F1/44 ,  H01F3/10 ,  H01F27/28 ,  H01F41/04 ,  H02M1/44 ,  H02M3/337 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H02M1/00

CPC分类号： H02M3/33523 ,  H01F1/44 ,  H01F3/10 ,  H01F27/2804 ,  H01F41/041 ,  H02M1/44 ,  H02M3/33561 ,  H02M3/33592 ,  H02M3/3376 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/02 ,  H01F1/447 ,  H01F2003/106 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/0058 ,  H02M1/008 ,  H05K1/0204 ,  H05K1/0265 ,  H05K2201/08 ,  H05K2201/086

摘要： A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

公开(公告)号：US12082352B2

公开(公告)日：2024-09-03

申请号：US17869934

申请日：2022-07-21

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  GARUDA TECHNOLOGY CO., LTD.

发明人： Yao-Cai Li ,  Biao Li ,  Hao-Wen Zhong

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/02 ,  H05K3/06 ,  H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46

CPC分类号： H05K3/4635 ,  H05K1/118 ,  H05K3/28 ,  H05K3/462 ,  H05K2201/0338 ,  H05K2203/1377

摘要： A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

公开(公告)号：US12069809B2

公开(公告)日：2024-08-20

申请号：US18205318

申请日：2023-06-02

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Kazuya Shimada ,  Masahito Hayamizu ,  Toshihiko Sakata ,  Makoto Chakuno

IPC分类号： C23C28/00 ,  H05K3/02 ,  H05K3/42

CPC分类号： H05K3/022 ,  C23C28/322 ,  H05K3/422 ,  H05K3/426 ,  H05K3/427 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T428/12611

摘要： Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

公开(公告)号：US20240276636A1

公开(公告)日：2024-08-15

申请号：US18142974

申请日：2023-05-03

申请人： TONG HSING ELECTRONIC INDUSTRIES, LTD.

发明人： Yu-Hsien LIAO ,  Shih-Han WU ,  Jhih-Wei LAI ,  Jian-Yu SHIH ,  Ming-Yen PAN

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/02 ,  H05K3/24 ,  H05K3/38

CPC分类号： H05K1/0306 ,  H05K1/115 ,  H05K3/022 ,  H05K3/241 ,  H05K3/386

摘要： This disclosure is related to a circuit board structure with an embedded ceramic substrate. A circuit substrate includes an insulating base, a first copper foil and a through-hole portion. A ceramic substrate is disposed in the through-hole portion and includes a ceramic substrate and a second copper foil. A plurality of positioning parts are arranged between the insulating base and the ceramic base. An adhesive layer is disposed between the insulating base and the ceramic base to seal the through-hole portion. A metal layer is disposed on the first copper foil and the second copper foil to cover the adhesive layer exposed from the through-hole portion. The metal layer is patterned to form a circuit layer. This disclosure also provides a manufacturing process of a circuit board structure with an embedded ceramic substrate.

公开(公告)号：US20240268027A1

公开(公告)日：2024-08-08

申请号：US18569529

申请日：2022-06-15

申请人： Rolls-Royce Deutschland Ltd & Co KG

发明人： Stanley BUCHERT ,  Uwe WALTRICH

IPC分类号： H05K1/14 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10

CPC分类号： H05K1/144 ,  H05K3/0091 ,  H05K3/022 ,  H05K3/101 ,  H05K2201/041

摘要： A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.

公开(公告)号：US12058816B2

公开(公告)日：2024-08-06

申请号：US17609572

申请日：2020-05-13

申请人： Rogers Germany GmbH

发明人： Andreas Meyer

IPC分类号： H05K3/02 ,  B23K1/00 ,  C04B37/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38 ,  B23K101/42

CPC分类号： H05K3/022 ,  B23K1/0016 ,  C04B37/021 ,  H05K1/11 ,  H05K3/0044 ,  H05K3/388 ,  B23K2101/42 ,  C04B2237/40 ,  H05K2201/1034 ,  H05K2203/0369

摘要： Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).

公开(公告)号：US11979981B2

公开(公告)日：2024-05-07

申请号：US17911563

申请日：2021-02-18

申请人： KYOCERA Corporation

发明人： Takayuki Umemoto

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K3/02 ,  H05K3/10

CPC分类号： H05K1/0296 ,  H05K1/0373 ,  H05K3/02 ,  H05K3/108 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0769 ,  H05K2203/068

摘要： The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.

公开(公告)号：US20240090137A1

公开(公告)日：2024-03-14

申请号：US18259780

申请日：2021-12-06

申请人： SKC CO., LTD.

发明人： Il Hwan YOO ,  Joo Young JUNG ,  Myung Ok KYUN ,  Ji Yeon RYU ,  Seung Bae OH

IPC分类号： H05K3/02 ,  H05K1/02

CPC分类号： H05K3/022 ,  H05K1/0284 ,  H05K2201/09054 ,  H05K2201/09972 ,  H05K2203/0405

摘要： A surface-treated copper foil according to exemplary embodiments includes a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer. Abnormal growth of the protrusions may be prevented through the pores and thus a bonding force with the insulation layer may be improved.