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公开(公告)号：US11641717B2
公开(公告)日：2023-05-02
申请号：US17446353
申请日：2021-08-30
IPC分类号： B23K1/00 , H05K3/34 , B23K37/04 , B23K101/42
摘要： A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.
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公开(公告)号：US20230126760A1
公开(公告)日：2023-04-27
申请号：US17511039
申请日：2021-10-26
发明人： Rui Liu , Songnan Yang
摘要： A switched capacitor converter package includes a semiconductor package on a first side of an electrical routing apparatus, a first capacitor and a second capacitor on a second side of the electrical routing apparatus, wherein the first capacitor and the second capacitor are adjacent to each other and connected in parallel, and a third capacitor and a fourth capacitor connected on the second side of the electrical routing apparatus, wherein the third capacitor and the fourth capacitor are adjacent to each other and connected in parallel.
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公开(公告)号：US20230125153A1
公开(公告)日：2023-04-27
申请号：US17910492
申请日：2021-03-05
发明人： Akiko TANAKA , Yuichiro SHISHIDO , Ayumi NISHIMARU
摘要： A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D50 of the solder particles is 12 μm or less, a particle size D50 of the flux particles is 30 μm or less, and a ratio of a particle size D90 of the solder particles and a particle size D90 of the flux particles to the sheet thickness T is 0.95 or less.
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公开(公告)号：US20230121347A1
公开(公告)日：2023-04-20
申请号：US18068578
申请日：2022-12-20
申请人： RAYTHEON COMPANY
摘要： Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.
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公开(公告)号：US20230116166A1
公开(公告)日：2023-04-13
申请号：US17909146
申请日：2020-09-03
发明人： Mantie Li , Ling Xie , Liang Yu , Menglong Tu
摘要： A die bonding method for a micro-LED. The method includes plating tin at a die bonding position of a printed circuit board (PCB) to obtain a tin-plated layer; adding a protective layer and a flux layer on the tin-plated layer in sequence to obtain a pretreated PCB; and transferring a flip-chip micro-LED to the pretreated PCB, reflowing and die bonding to complete die bonding of the micro-LED.
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公开(公告)号：US20230112020A1
公开(公告)日：2023-04-13
申请号：US17779803
申请日：2020-11-18
申请人： SENJU METAL INDUSTRY CO., LTD. , National Institute of Advanced Industrial Science and Technology
发明人： Haruya SAKUMA , Kenichi TOMITSUKA , Hisahiko YOSHIDA , Kenji KANAZAWA , Sei UEMURA , Takashi NAKAMURA , Masateru NISHIOKA
摘要： A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.
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公开(公告)号：US11627668B2
公开(公告)日：2023-04-11
申请号：US17331003
申请日：2021-05-26
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： Yong-Chao Wei , Po-Yuan Chen
摘要： A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.
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公开(公告)号：US11622442B2
公开(公告)日：2023-04-04
申请号：US17109182
申请日：2020-12-02
发明人： Daisuke Tonaru
摘要： A circuit member joint structure includes a first circuit member including a first main surface on which a first mounting electrode is provided, a second circuit member including a second main surface on which a second mounting electrode is provided, a conductive joining material with which the first mounting electrode and the second mounting electrode are joined to each other, and an insulating joining material with which an end portion of the first circuit member and an end portion of the second circuit member are joined to each other. The first circuit member includes a first recess on the first main surface and spaced away from the first mounting electrode, and at least a portion of the insulating joining material is disposed in the first recess.
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公开(公告)号：US11619665B2
公开(公告)日：2023-04-04
申请号：US16736192
申请日：2020-01-07
发明人： Jeffrey N. Judd , Matthew Doyle , Matthew S. Kelly , Henry M. Newshutz , Timothy J. Tofil , Mark J. Jeanson
摘要： An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.
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公开(公告)号：US11605580B2
公开(公告)日：2023-03-14
申请号：US16883737
申请日：2020-05-26
发明人： Taner Dosluoglu
IPC分类号： H01L23/498 , H01L23/00 , H01L21/48 , H05K3/34 , H01L27/02 , H01L25/065 , H01L27/092
摘要： A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays.
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