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公开(公告)号：US20240365471A1
公开(公告)日：2024-10-31
申请号：US18766354
申请日：2024-07-08
申请人： WestRock MWV, LLC
摘要： A circuit assembly includes a flexible card having a main panel and an extension panel foldably connected along a fold line and a card circuit disposed on the flexible card and having one or more contact points disposed proximate the fold line, and a circuit board having one or more electrical contacts formed on a surface of the circuit board. The flexible card and the circuit board can be disposed in face-to-face contact with each contact point of the card circuit is in registry with a respective electrical contact of the circuit board, with the extension panel folded at the fold line over the circuit board. The assembly includes a clip disposed over the folded extension panel and main panel to apply a sandwiching force to secure the circuit board and the card circuit in electrical contact.
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公开(公告)号：US12133369B2
公开(公告)日：2024-10-29
申请号：US17916854
申请日：2021-05-19
发明人： Yuta Yoshimi , Kenta Fujii , Yuji Shirakata , Hiroyuki Yahara , Hiroyuki Kiyonaga , Tomohito Fukuda
CPC分类号： H05K7/209 , H02M3/003 , H02M3/33569 , H05K1/181 , H02M3/285 , H02M3/33573 , H05K1/148 , H05K3/366
摘要： A power conversion device includes an electronic component, a first printed circuit board, a first cooling body, a second printed circuit board, a second cooling body, and a first wiring member. The power conversion device further includes a first insulating member. On a first main surface of the first printed circuit board, a first joint portion to which the first wiring member is joined is provided. Between a second main surface of the first printed circuit board and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion.
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公开(公告)号：US12122308B2
公开(公告)日：2024-10-22
申请号：US18133871
申请日：2023-04-12
发明人： Jared Bilas , Kurt P. Seifert , David G. Siegfried , David R. Peterson , Frank W. Szuba, Jr. , Mark Intihar
CPC分类号： B60R16/0215 , H01B7/0045 , H01B7/04 , H01B7/08 , H01R12/61 , H05K3/361
摘要： A flexible planar wire cable includes a first flexible planar wire having first conductor segments contained in a first longitudinal plane and second conductor segments contained in a second longitudinal plane. First connection segments extend between the first conductor segments and the second conductor segments. The first conductor segments alternate with second conductor segments along a longitudinal axis of the wire harness assembly. The cable further includes a second flexible planar wire having third conductor segments contained in the second longitudinal plane and fourth conductor segments contained in the first longitudinal plane. Second connection segments extend between the third conductor segments and the fourth conductor segments. The third conductor segments alternate with the fourth conductor segments along the longitudinal axis of the flexible planar wire cable. The cable also includes an insulating layer separating and encasing the first and second flexible planar wires.
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公开(公告)号：US20240349428A1
公开(公告)日：2024-10-17
申请号：US18626514
申请日：2024-04-04
申请人： u-blox AG
发明人： Anthony Gergis , Timo Saarnimo
CPC分类号： H05K1/117 , H05K1/144 , H05K3/368 , H05K2201/041 , H05K2201/09163
摘要： A printed circuit board (100), PCB, comprises a top surface (101), a bottom surface (107), a series of M castellated orifices (102) on at least one of the edges of the PCB, and a series of N conductive pads (103) on the top surface (101) connecting to the M orifices (102) at respective connection edges (104), wherein M and N are integers greater than 1. Each of the pads (103) on the top surface (101) is partially covered by a respective spacer (105) such that an area between the connection edge (104) and a border (106) of a remaining pad area (103′) is completely covered by the spacer (105), and the connection edge (104) and the border (106) of the remaining pad area (103′) have a minimum distance of D, wherein D is a positive number. A solder leaking is prevented between the pads (103) on the top surface (101) and the castellated orifices (102) by the spacers (105).
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公开(公告)号：US12114436B2
公开(公告)日：2024-10-08
申请号：US18054157
申请日：2022-11-10
发明人： Zhicheng Yang , Xianyou Deng , Jinfeng Liu , Hegen Zhang , Tao Luo , Zhishen Wang
CPC分类号： H05K3/361 , H05K1/142 , H05K3/4611 , H05K2201/09163 , H05K2203/061
摘要： A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.
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公开(公告)号：US20240334603A1
公开(公告)日：2024-10-03
申请号：US18672676
申请日：2024-05-23
发明人： Ren XIONG , Fan LI , Qiang TANG , Fei SHANG , Haijun QIU , Yuanyuan CHAI , Huiqiang SONG
IPC分类号： H05K1/11 , G06F3/041 , G06F3/044 , H01R12/61 , H05K1/18 , H05K3/36 , H10K59/131 , H10K59/179
CPC分类号： H05K1/118 , G06F3/0412 , G06F3/0443 , G06F3/0446 , H01R12/61 , H05K3/363 , G06F3/04164 , H05K1/189 , H05K2201/041 , H05K2201/09227 , H05K2201/09236 , H05K2201/09381 , H05K2201/0939 , H05K2201/09481 , H05K2201/10128 , H10K59/131 , H10K59/179
摘要： A display device is provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.
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公开(公告)号：US20240314943A1
公开(公告)日：2024-09-19
申请号：US18576236
申请日：2021-12-20
发明人： Hiromitsu ITAMOTO
CPC分类号： H05K3/4691 , H05K1/144 , H05K1/147 , H05K3/363 , H05K2201/09572
摘要： Solder (12) joins together a second conductive pattern (4) of a flexible substrate (1) and a third conductive pattern (7) of a print substrate (6) and joins together a second GND pattern (5) of the flexible substrate (1) and a third GND pattern (8) of the print substrate (6). A through hole (11) passes through the flexible substrate (1) and connects the first and second GND patterns (3,5) together. In an extension direction in which the second conductive pattern (4) extends, an end portion of a solder joint portion between the second conductive pattern (4) and the third conductive pattern (7) is in a position corresponding to the through hole (11) and is shifted from an end portion of the through hole (11).
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公开(公告)号：US20240310945A1
公开(公告)日：2024-09-19
申请号：US18673178
申请日：2024-05-23
发明人： Shinya HASHIMOTO
IPC分类号： G06F3/041 , G02F1/1333 , G02F1/1343 , G06F1/16 , G06F3/044 , H05K1/02 , H05K1/11 , H05K3/36
CPC分类号： G06F3/04164 , G02F1/133345 , G02F1/13338 , G02F1/13439 , G06F1/16 , G06F3/0412 , G06F3/0416 , G06F3/0418 , G06F3/044 , G06F3/0446 , H05K1/0216 , H05K1/11 , H05K1/118 , G06F2203/04102 , G06F2203/04103 , G06F2203/04107 , G06F2203/04111 , H05K3/361 , H05K2201/09245 , H05K2201/09254
摘要： A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.
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公开(公告)号：US12094811B2
公开(公告)日：2024-09-17
申请号：US16096618
申请日：2017-04-21
发明人： Val Marinov
CPC分类号： H01L23/49838 , H01L21/4814 , H01L23/49816 , H01L23/49827 , H01L23/52 , H01L24/16 , H01L24/83 , H01L24/97 , H05K1/028 , H05K1/0393 , H05K1/189 , H05K3/361 , H01L2224/16225 , H01L2224/83851 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15321 , H01L2924/181
摘要： An apparatus includes a first substrate including one or more electrical connection features; and an assembly including: a second substrate; conductive features formed on the second substrate, one or more of which are electrically connected to corresponding electrical connection features of the first substrate; and an electronic component between the second substrate and the first substrate and electrically connected to one or more of the conductive features.
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公开(公告)号：US20240306306A1
公开(公告)日：2024-09-12
申请号：US18666091
申请日：2024-05-16
发明人： JUN TSUKANO
CPC分类号： H05K3/103 , H05K3/361 , H05K2203/0278
摘要： A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.
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