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公开(公告)号：US20230121347A1
公开(公告)日：2023-04-20
申请号：US18068578
申请日：2022-12-20
申请人： RAYTHEON COMPANY
摘要： Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.
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公开(公告)号：US20230085035A1
公开(公告)日：2023-03-16
申请号：US17932864
申请日：2022-09-16
发明人： Abderrazzaq IFIS , Jens RIEDLER , Lukas HERRES , Felix SKRIVANEK , Julia PLATZER
摘要： A method of manufacturing a component carrier includes laser drilling a blind hole in a layer stack, and subsequently extending the blind hole to a through hole by etching. A component carrier includes an electrically insulating layer structure, an electrically conductive layer structure directly on an electrically insulating layer structure, and a tapering through hole extending through the electrically conductive layer structure and through the electrically insulating layer structure with a lateral overhang of the electrically conductive layer structure beyond the electrically insulating layer structure at the tapering through hole of not more than 20% of a maximum diameter of the tapering through hole.
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公开(公告)号：US20230063808A1
公开(公告)日：2023-03-02
申请号：US17465596
申请日：2021-09-02
申请人： Apple Inc.
发明人： Nima Shahidi , Meng Chi Lee
摘要： A coaxial interposer may shield certain signals (e.g., noisy signals, high speed signals, radio frequency (RF) signals) transmitted through an electronic device. The coaxial interposer may include a coaxial via that includes an outer barrel of non-conductive material and an inner barrel of non-conductive material separated by a conductive barrel. Further, the outer barrel of non-conductive material may be enclosed by an outer metal coating. The coaxial via serves to internally shield each signals transmitted between layers of a printed circuit board (PCB) within the electronic device.
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公开(公告)号：US20230058180A1
公开(公告)日：2023-02-23
申请号：US17505686
申请日：2021-10-20
发明人： Yu-Shen Chen , Chung-Yu Lan
摘要： A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.
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公开(公告)号：US11581652B2
公开(公告)日：2023-02-14
申请号：US17578034
申请日：2022-01-18
申请人： RAYTHEON COMPANY
摘要： The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：US11564316B2
公开(公告)日：2023-01-24
申请号：US17280269
申请日：2019-11-21
摘要： An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.
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公开(公告)号：US11564309B2
公开(公告)日：2023-01-24
申请号：US16704540
申请日：2019-12-05
摘要： The present disclosure relates to systems and methods using thermal vias to increase the current-carrying capacity of conductive traces on a multilayered printed circuit board (PCB). In various embodiments, parameters associated with vias may be selected to control various electrical and thermal properties of the conductive trace. Such parameters include the via diameter, a plating thickness, a number of vias, a placement of the vias, an amount of conductive material to be added or removed from the conductive trace, a change in the resistance of the conductive trace, a change in a fusing measurement of the conductive trace, and the like.
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公开(公告)号：US20230015176A1
公开(公告)日：2023-01-19
申请号：US17952586
申请日：2022-09-26
摘要： A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.
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9.发明授权公开(公告)号：US11546990B2
公开(公告)日：2023-01-03
申请号：US16751024
申请日：2020-01-23
发明人： Mikael Tuominen
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/11 , H05K1/14 , H05K1/16 , H05K3/00 , H05K3/10 , H05K3/42 , H05K3/46 , H05K3/40 , H05K1/09
摘要： A component carrier with an electrically insulating layer structure has opposed main surfaces, a through-hole, and an electrically conductive bridge structure connecting opposing sidewalls delimiting the through-hole. The sidewalls have a first tapering portion extending from a first main surface and a second tapering portion extending from a second main surface. A first demarcation surface faces the first main surface and a second demarcation surface faces the second main surface. A central bridge plane extends parallel to the first main surface and the second main surface and is at a vertical center between a lowermost point of the first demarcation surface and an uppermost point of the second demarcation surface. A first intersection point is between the central bridge plane and one of the sidewalls delimiting the through hole. A length of a shortest distance from the first intersection point to the first demarcation surface is at least 8 μm.
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公开(公告)号：US11545051B2
公开(公告)日：2023-01-03
申请号：US16295005
申请日：2019-03-07
申请人： Hanoi Ju
发明人： Hanoi Ju
摘要： Disclosed herein is a microcontroller board for the learning and practice of coding. In the microcontroller board, a platform area (S1) including a platform circuit board (10) in which a microcontroller is provided and module areas (S2) each having a cut line and including a module circuit board (20) are divided and formed on a single board array (S), corresponding header socket holes H are formed in the platform area (S1) including the platform circuit board (10) and the module areas (S2) on both sides of each of the cut lines, a plurality of machine holes (30) is provided along each of the cut lines between the header socket holes (H), via holes (40) are formed by plating the inner circumferential surfaces of the machine holes (30) with metal layers (35) in order to conduct electricity, and V-cut grooves (50) are formed along each of the cut lines.
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