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公开(公告)号：US20230059939A1
公开(公告)日：2023-02-23
申请号：US17891854
申请日：2022-08-19
发明人： WEN-JENG HSUE , Yi-Da Pan
IPC分类号： B23H7/26
摘要： A channel machining equipment and a channel machining method allow a wall of an internal curved channel in a workpiece to be conducted. A set of traction lines and guiding bodies are to support the EDM electrode and thus allow an electrode linked with the guide mechanism to substantially move in a central portion of the curved channel to optimize an EDM effect on the wall of the channel. Therefore, a precision machining process (such as grinding, EDM, and so on) can be conducted on the internal curved channel of the workpiece to make it have satisfactory wall roughness and shape precision according to predetermined standards, thereby solving the problem of failure in effectively machining the wall of the curved channel in the workpiece in the prior art.
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公开(公告)号：US11311955B2
公开(公告)日：2022-04-26
申请号：US16177488
申请日：2018-11-01
申请人： Agie Charmilles SA
发明人： Umang Maradia , Mikhail Kliuev
摘要： The invention provides a method for machining a shape such as slot or cavity or aperture using a plurality of first type holes (1) and second type holes (2), wherein during machining of first type holes (1) the hole circumference completely envelopes the respective portion of the electrode circumference.
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公开(公告)号：US11077510B2
公开(公告)日：2021-08-03
申请号：US16351439
申请日：2019-03-12
申请人： SODICK CO., LTD.
发明人： Yoshinobu Yamamoto
摘要： A fine hole electric discharge machine includes a machining tank, a storage tank, at least one pipeline, a guide base, a liquid current generator, and a controller. The at least one pipeline has at least one opening directed to the upper surface of a workpiece and allows machining liquid to flow through. The liquid current generator selectively forms a first liquid current in which the machining liquid is supplied from the storage tank and jetted from a predetermined opening of the opening, or a second liquid current in which the machining liquid is sucked from an opening the same as or different from the predetermined opening and recovered to the storage tank. The controller controls the liquid current generator to form the first liquid current or the second liquid current.
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公开(公告)号：US10974336B2
公开(公告)日：2021-04-13
申请号：US15136023
申请日：2016-04-22
发明人： Renwei Yuan , Dong Liu , Lei Li
摘要： A method for profile machining comprises: providing an electrode having an electrode axis, a free axial end with an end face, and a peripheral surface other than the end face; energizing the electrode and a workpiece having a thickness, with one of the workpiece and the electrode as an anode and the other as a cathode; and machining the workpiece with the peripheral surface of the electrode, during which the peripheral surface and the electrode axis of the electrode are across the workpiece in a thickness direction thereof. In addition, an embodiment of present invention relates to a component machined by the method.
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公开(公告)号：US10821533B2
公开(公告)日：2020-11-03
申请号：US16351108
申请日：2019-03-12
申请人： FANUC CORPORATION
发明人： Kousuke Ookubo
摘要： To provide a wire electrical discharge machine for which the machining precision of corner parts and corner exit parts in a workpiece are improved. A wire electrical discharge machine includes a machining path compensation unit which compensates a machining path, in a case of creating a corner part which is a circular arc as a second machining block, by compensating a position of a center of the circular arc of the second machining block by way of a first compensation vector calculated based on at least one indicator among the four indicators of deflection of a wire electrode, etc., and inserting a linear first compensation block between an end point of the first machining block and a start point of a second machining block which was compensated, and by eliminating a predetermined distance from the start point of a third machining block, creates a starting point of this third machining block, and then inserts a second compensation block between the end point of the compensated second machining block and the created starting point of the first machining block.
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6.发明申请公开(公告)号：US20200254546A1
公开(公告)日：2020-08-13
申请号：US16651761
申请日：2018-09-28
申请人： Safran
发明人： Martin Ducas , Mirna Bechelany
摘要： The invention relates to the production of a device for holding one or more electrode(s) for electrical discharge machining, comprising a body (41) having a rectilinear portion (43a) in which at least one first duct (45) is provided for the passage of one or more electrode(s) (21). The body further has an integral curved portion (43b) in which (at least) one second curved dielectric fluid supply duct (47) is provided and in which is provided a curved extension (45b) of said at least one first duct. The curved extension and the second curved duct are made of ceramic, with an inner mean roughness of: Ra
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公开(公告)号：US10737341B2
公开(公告)日：2020-08-11
申请号：US15834080
申请日：2017-12-07
发明人： Yung-Fang Tsai , Chia-Wei Cheng
摘要： The present disclosure provides an electrochemical machining apparatus including a pressurized tank, a cap, a stabilizing plate, a guiding element, and an electrode. The pressurizing tank has a top surface and a chamber, wherein the top surface is disposed with an opening and a limiting portion. The cap fits in the opening and is limited by the limiting portion to seal the pressurized tank. The stabilizing plate is spaced from the top surface or the cap by a distance. The guiding element penetrates the stabilizing plate to connect with the cap and provides a channel to the chamber. The electrode is guided by the guiding element and penetrates the chamber via the channel. When the electrode processes a workpiece in the chamber during an electrochemical machining operation, the cap takes a pressure generated during the electrochemical machining operation, and the stabilizing plate stabilizes the electrode and the guiding element.
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公开(公告)号：US10661369B2
公开(公告)日：2020-05-26
申请号：US15903450
申请日：2018-02-23
发明人： Takayuki Mori , Hiroyuki Sunada , Hirotaro Hosoe
IPC分类号： B23H9/10 , B23H9/14 , B23H9/16 , B23H7/22 , B23H7/24 , B23H3/06 , B23H3/04 , B23H3/02 , B23H7/26
摘要： Provided is an electrode capable of increasing a degree of freedom in machining shape with a simple structure, an electrochemical machining apparatus using the electrode, an electrochemical machining method, and a product machined by the method. An electrode 4 has a core tube 41 formed of a material by which a second hole 101b having a direction or a curvature different from that of a first hole 101a having a predetermined curvature can be formed continuously from the first hole 101a and a coating 42 fixed to an outer periphery of the core tube 41.
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公开(公告)号：US20200030901A1
公开(公告)日：2020-01-30
申请号：US15735085
申请日：2015-06-12
发明人： Tomohiro NAGASE
摘要： This small-hole electric discharge machining machine for electric discharge machining of a workpiece by use of a rod-like or pipe-like electrode is equipped with: a first support part for supporting the base side of the electrode; a second support part for supporting the tip side of the electrode; and an intermediate guide device that is disposed between the first support part and the second support part, and guides the electrode. The intermediate guide device is equipped with: a guide part that has an open form and a closed form, and guides the electrode when in the closed form; a driving means for causing the guide part to transition between the open form and the closed form; and a biasing means for biasing the guide part in the closing direction when the guide part is in the closed form.
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10.发明申请公开(公告)号：US20190295855A1
公开(公告)日：2019-09-26
申请号：US15935867
申请日：2018-03-26
IPC分类号： H01L21/326 , H01L21/304 , H01L21/288 , B23H7/26
摘要： A method of structuring and/or thinning a semiconductor wafer having a plurality of functional chip sites includes forming one or more semiconductor devices in a device region of each functional chip site at a frontside of the semiconductor wafer, and forming an electrode at one of the frontside or a backside of the semiconductor wafer. The side of the semiconductor wafer at which the electrode is formed is structured by applying voltage pulses between the electrode and a tool electrode positioned above the semiconductor wafer as part of an electrical discharge machining (EDM) process before the electrode is removed by the EDM process, and between the tool electrode and an intrinsic conductive layer formed on the side of the semiconductor wafer being structured after the electrode is removed by the EDM process.
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