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    Laser processing apparatus
    3.
    发明授权
    Laser processing apparatus 有权

    公开(公告)号：US12048970B2

    公开(公告)日：2024-07-30

    申请号：US17048100

    申请日：2019-04-26

    申请人： Mitsubishi Electric Corporation

    发明人： Kenta Fujii ,  Motoaki Nishiwaki ,  Nobuaki Tanaka ,  Masaki Seguchi ,  Kyohei Ishikawa

    IPC分类号： B23K26/38 ,  B23K26/064

    CPC分类号： B23K26/38 ,  B23K26/064

    摘要： A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.

    Detection device
    4.
    发明授权
    Detection device 有权

    公开(公告)号：US11975401B2

    公开(公告)日：2024-05-07

    申请号：US17201068

    申请日：2021-03-15

    申请人： DISCO CORPORATION

    发明人： Keiji Nomaru

    IPC分类号： B23K26/03 ,  B23K26/08 ,  B23K26/00 ,  B23K26/064 ,  B23K101/40

    CPC分类号： B23K26/034 ,  B23K26/009 ,  B23K26/064 ,  B23K26/0853 ,  B23K2101/40

    摘要： A detection mechanism of a detection device includes a pulsed laser oscillator that emits a pulsed laser beam; an fθ lens facing a workpiece held by a chuck table; a thermal excitation section that applies the pulsed laser beam emitted from the pulsed laser oscillator to an upper surface of a wafer through the fθ lens and generates an ultrasonic wave propagated in a spherical form by thermal excitation; and an image forming section that forms an image by capturing a reflected laser beam influenced by vibration of the ultrasonic wave generated by the thermal excitation section, propagated through the inside of the workpiece, reflected by a lower surface of the workpiece, and returned to the upper surface of the workpiece, by an aperture synthesis method.

    LASER WELDING PENETRATION MONITORING
    5.
    发明公开
    LASER WELDING PENETRATION MONITORING 审中-公开

    公开(公告)号：US20240139874A1

    公开(公告)日：2024-05-02

    申请号：US18550916

    申请日：2022-03-31

    申请人： JAGUAR LAND ROVER LIMITED

    发明人： Oliver BAILEY ,  Mo AL-BADANI

    IPC分类号： B23K26/21 ,  B23K26/03 ,  B23K26/064 ,  B23K26/70

    CPC分类号： B23K26/21 ,  B23K26/032 ,  B23K26/064 ,  B23K26/70 ,  B23K2101/36

    摘要： A laser beam welding system comprises a welding laser source and a penetration monitoring laser source arranged for simultaneous operation in a manner such that a penetration monitoring laser beam from the penetration monitoring laser source is incident on a molten weld pool at a process site comprising an area of contact between a connection tab and a cell terminal, the connection tab and cell terminal to be joined by the welding system, and wherein the molten weld pool is created by a welding laser beam emitted by the welding laser source. The penetration monitoring laser beam is reflected from the molten weld pool to a receiver arranged to receive the reflected penetration monitoring laser beam. Data is outputted indicative of the distance travelled by the penetration monitoring laser beam and therefore the penetration of the welding laser beam at the process site.

    OVERLAY WELDING METHOD AND METHOD FOR REPAIRING METAL MEMBER
    6.
    发明公开
    OVERLAY WELDING METHOD AND METHOD FOR REPAIRING METAL MEMBER 审中-公开

    公开(公告)号：US20240131638A1

    公开(公告)日：2024-04-25

    申请号：US18380405

    申请日：2023-10-15

    申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

    发明人： Ryoji FUSHINO ,  Takuya HIRAOKA ,  Akito HIGASA ,  Koji TSUKIMOTO

    IPC分类号： B23P6/00 ,  B23K26/064 ,  B23K26/342

    CPC分类号： B23P6/007 ,  B23K26/064 ,  B23K26/342 ,  B33Y10/00

    摘要： An overlay welding method includes irradiating a surface of a metal member with a laser beam while supplying a weld metal powder, and performing overlay welding on the surface of the metal member, and repeatedly performing a weld bead formation step of melting and solidifying the weld metal powder with the laser beam to form a plurality of weld beads on the surface of the metal member. Each of the plurality of weld beads has one portion in a width direction overlapping each other. In the overlay welding method, in a case of forming an adjacent weld bead, which is a weld bead adjacent to a previously formed weld bead, an energy density of the laser beam is adjusted to be higher at a portion of the adjacent weld bead overlapping the previously formed weld bead than at a portion not overlapping the previously formed weld bead.

    LASER CUTTING
    8.
    发明公开
    LASER CUTTING 审中-公开

    公开(公告)号：US20240066628A1

    公开(公告)日：2024-02-29

    申请号：US18506103

    申请日：2023-11-09

    申请人： Align Technology, Inc.

    发明人： James C. CULP

    IPC分类号： B23K26/06 ,  A61C13/00 ,  B23K26/064 ,  B23K26/08 ,  B23K26/142 ,  B23K26/38 ,  G05B15/02

    CPC分类号： B23K26/0626 ,  A61C13/0006 ,  B23K26/064 ,  B23K26/08 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0861 ,  B23K26/142 ,  B23K26/38 ,  G05B15/02 ,  A61C7/08

    摘要： Laser cutting systems and methods are described herein. Systems may include a laser, an optical component, a fixture for holding a dental appliance, and a controller. A cut path for trimming excess material from the dental appliance may be derived from a virtual cut path in a virtual version of the dental appliance. The excess material may be trimmed from the dental appliance along the cut path with the laser while adjusting a laser energy applied to the dental appliance to reduce a brittleness at an edge of the cut path. Adjusting the applied laser energy may include adjusting one or more of: a power of the laser, an optical component of the laser to adjust a focal length of the laser, and a relative orientation of the laser with respect to the dental appliance in at least three axes of movement.

    LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
    9.
    发明公开
    LASER PROCESSING DEVICE AND LASER PROCESSING METHOD 审中-公开

    公开(公告)号：US20240051067A1

    公开(公告)日：2024-02-15

    申请号：US18266842

    申请日：2021-12-20

    申请人： HAMAMATSU PHOTONICS K.K.

    发明人： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

    IPC分类号： B23K26/351 ,  B23K26/064 ,  B23K26/04

    CPC分类号： B23K26/351 ,  B23K26/064 ,  B23K26/048

    摘要： A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.