公开(公告)号：US20240363348A1

公开(公告)日：2024-10-31

申请号：US18765888

申请日：2024-07-08

申请人： Applied Materials, Inc.

发明人： Karthik Narayanan BALAKRISHNAN ,  Jungrae PARK ,  Arunkumar TATTI ,  Sriskantharajah THIRUNAVUKARASU ,  Eng Sheng PEH

IPC分类号： H01L21/033 ,  B23K26/14 ,  B23K26/142 ,  B23K101/40 ,  H01L21/78

CPC分类号： H01L21/0337 ,  B23K26/142 ,  B23K26/1436 ,  B23K26/1437 ,  H01L21/78 ,  B23K2101/40

摘要： Methods and apparatus for laser patterning leverage mask trench debris removal techniques to form etch singulation trenches. In some embodiments, the method includes forming a mask layer on the wafer, forming a pattern in the mask layer using a laser of a laser assembly where the pattern allows singulation of the wafer by deep etching and forms a trench in the mask layer with a laser beam which has a process point at a bottom of the trench, directing gas nozzles that flow a pressurized gas at the process point in the trench as the pattern is formed with a gas flow angle relative to the process point and evacuating debris from the trench using an area of negative pressure where the gas flow from gas nozzles and the area of negative pressure are in fluid contact and are confined within a cylindrical housing.

公开(公告)号：US12130422B2

公开(公告)日：2024-10-29

申请号：US17066945

申请日：2020-10-09

申请人： NPS CO., LTD.

发明人： Seong Ho Bae

IPC分类号： G02B26/08 ,  B23K26/04 ,  B23K26/14 ,  B23K26/38 ,  G01M11/02 ,  G05B19/401 ,  G06N20/00

CPC分类号： G02B26/0816 ,  B23K26/043 ,  B23K26/1462 ,  G01M11/0221 ,  G05B19/401 ,  G06N20/00 ,  B23K26/38 ,  G05B2219/4719

摘要： The present disclosure relates to a laser apparatus including a laser oscillator for oscillating a laser beam; a mirror mount assembly including a mount-side reflective mirror for transmitting the laser beam by reflecting the laser beam; an aligner including a dial that is configured to change alignment of the mount-side reflective mirror according to a rotation angle and a rotation direction and is responsible for adjusting, by the degree of displacement of the reflection angle of the mount-side reflective mirror according to change in the alignment state, a processing optical path through which the laser beam travels, and a driving motor for driving rotation of the dial; an examination module for calculating the optical path difference between a predetermined reference processing optical path and the processing optical path and examining whether optical path distortion occurs on the processing optical path; a calculation module for, when the optical path difference exceeds predetermined reference optical path difference, calculating the target driving speed and target driving time of the driving motor for changing alignment of the mount-side reflective mirror to correct the optical path distortion so that the optical path difference is less than or equal to the predetermined reference optical path difference; and a controller for driving the driving motor according to the target driving speed and the target driving time, wherein the examination module recalculates the optical path difference between the reference processing optical path and the processing optical path that has been changed by the driving motor according to the target driving speed and the target driving time and re-examines whether the optical path distortion occurs, the calculation module recalculates the target driving speed and the target driving time based on the recalculated optical path difference when the recalculated optical path difference exceeds the reference optical path difference, and the controller drives the driving motor again according to the recalculated target driving speed and target driving time.

公开(公告)号：US12111006B2

公开(公告)日：2024-10-08

申请号：US17577894

申请日：2022-01-18

申请人： General Electric Company

发明人： Todd William Danko ,  Alexander Kyle Duncan ,  Marshall G. Jones ,  Guanghua Wang ,  Venkata Vijayaraghava Nalladega ,  Viktor Holovashchenko ,  John M. Lizzi ,  Arpit Jain

IPC分类号： F16L55/30 ,  B23K26/08 ,  B23K26/14 ,  B23K26/16 ,  B23K26/34 ,  B23K26/362 ,  B23K37/02 ,  B23K101/10 ,  F16L55/18 ,  F16L101/30

CPC分类号： F16L55/30 ,  F16L55/18 ,  B23K26/0869 ,  B23K26/14 ,  B23K26/16 ,  B23K26/34 ,  B23K26/362 ,  B23K37/0282 ,  B23K37/0294 ,  B23K2101/10 ,  F16L2101/30

摘要： Methods, systems, and apparatus are described for maintaining the interior cavities of pipes. In one aspect, a motorized apparatus includes a main body having a length extending along a longitudinal axis of the main body, where the main body comprises a first end and a second end opposite the first end. The motorized apparatus further includes at least one drive assembly coupled to at least one of the first end and the second end of the main body, where the at least one drive assembly comprises driven members that engage with an inner surface of the pipe and move the motorized apparatus through an interior cavity of the pipe. The motorized apparatus further includes a maintenance head movably coupled to the main body that moves along the length of the main body and rotates about the longitudinal axis of the main body, where the maintenance head comprises at least one tool configured to perform an action on the inner surface of the pipe.

公开(公告)号：US12103105B2

公开(公告)日：2024-10-01

申请号：US17248542

申请日：2021-01-28

申请人： II-VI Delaware, Inc

发明人： Goran Bjelajac ,  Alexander Müller ,  Hannes Noack

IPC分类号： B23K26/14 ,  B23K26/38 ,  B23K26/70

CPC分类号： B23K26/1462 ,  B23K26/38 ,  B23K26/702

摘要： A laser cutting head uses a nozzle and gas flow to perform laser cutting or the like. The laser processing and the gas flow passes from an end of the housing. A sensor assembly affixed to the end of the housing has a first through which the laser processing passes and an orifice from which the gas flow passes. A conductive adapter affixes to the sensor assembly and has a passage through which the laser processing passes. The nozzle affixes in a receptacle in an end of the conductive adapter. A collar disposed about the adapter defining one or more gas flow passages therethrough. A cover is disposed between the sensor assembly and the collar and encloses a space communicating the gas flow from the orifice to the one or more flow passages of the collar.

公开(公告)号：US20240308000A1

公开(公告)日：2024-09-19

申请号：US18183233

申请日：2023-03-14

申请人： SAUDI ARABIAN OIL COMPANY

发明人： Sameeh Issa Batarseh

IPC分类号： B23K26/342 ,  B23K26/06 ,  B23K26/14

CPC分类号： B23K26/342 ,  B23K26/0608 ,  B23K26/14 ,  B23K2101/10

摘要： An in-situ cladding method including providing a pipe with a target surface with a defected area. The method also includes lowering an in-situ cladding system into the pipe. The in-situ cladding system includes a dual head laser, with primary and secondary beams, and a wire feeding system. The method also includes lowering the wire feeding system into the pipe, feeding a cladding wire onto the target surface, melting the cladding wire onto the target surface with the primary beam, and blowing gas onto the cladding wire using an internal purging system. The method further includes forcing melting of the cladding wire in a first desired direction to form a first layer, forcing melting of the cladding wire in a second desired direction to form a second layer, switching off the primary beam and switching on the secondary beam, and welding the first and second layers together using the secondary beam.

公开(公告)号：US20240300050A1

公开(公告)日：2024-09-12

申请号：US18243532

申请日：2023-09-07

申请人： Quanzhou Shengwei Electronic Technology Co., Ltd.

发明人： Zuhui Chen ,  Qishan Weng ,  Wei Lin ,  Hongtao Tian ,  Yutang Huang ,  Qiuxia Zheng ,  Yuhui Lin ,  Yitong Yang ,  Li Wu

IPC分类号： B23K26/067 ,  B23K26/14 ,  B23K26/362 ,  B23K26/70

CPC分类号： B23K26/067 ,  B23K26/14 ,  B23K26/362 ,  B23K26/703

摘要： The present disclosure provides a laser etching system for electrode layer patterning, which can perform electrode layer patterning on the conductive layer of a first surface of the substrate of a double-sided structure touch panel by means of employing a laser beam without damaging the conductive layer on the second surface of the substrate. The system comprises a laser emitter for generating and emitting laser beams, and a laser etching platform for supporting and fixing the touch panel substrate, with the first surface facing the laser beam and the second surface adhering to the laser etching platform. The laser etching system further comprises optical elements, which ensure that the ratio of the spot size of the laser beam irradiated on the second surface to that irradiated on the first surface is not less than 1.2.

公开(公告)号：US20240286219A1

公开(公告)日：2024-08-29

申请号：US18571267

申请日：2022-04-28

申请人： NIPPON STEEL CORPORATION

发明人： Yoshihiro YAMADA ,  Takeshi IMAI ,  Dairi YAJIMA ,  Hideyuki HAMAMURA ,  Yoshiaki HIROTA

IPC分类号： B23K26/16 ,  B23K26/08 ,  B23K26/14 ,  B23K26/364 ,  B23K103/04

CPC分类号： B23K26/16 ,  B23K26/083 ,  B23K26/1464 ,  B23K26/364 ,  B23K2103/04

摘要： A laser processing device includes: a laser light source unit that irradiates, with laser light, a surface of a steel sheet conveyed in a predetermined conveyance direction; a first nozzle that injects gas toward an irradiation site of the laser light, parallel to an optical axis direction of the laser light; and a dust collection mechanism unit that is provided only at one of an upstream side or a downstream side of the irradiation site, in the conveyance direction, and that collects, from a dust collection port, laser sputter generated from the irradiation site.

公开(公告)号：US12068159B2

公开(公告)日：2024-08-20

申请号：US17219082

申请日：2021-03-31

申请人： Applied Materials, Inc.

发明人： Karthik Narayanan Balakrishnan ,  Jungrae Park ,  Arunkumar Tatti ,  Sriskantharajah Thirunavukarasu ,  Eng Sheng Peh

IPC分类号： H01L21/033 ,  B23K26/14 ,  B23K26/142 ,  B23K101/40 ,  H01L21/78

CPC分类号： H01L21/0337 ,  B23K26/142 ,  B23K26/1436 ,  B23K26/1437 ,  H01L21/78 ,  B23K2101/40

摘要： Methods and apparatus for laser patterning leverage mask trench debris removal techniques to form etch singulation trenches. In some embodiments, the method includes forming a mask layer on the wafer, forming a pattern in the mask layer using a laser of a laser assembly where the pattern allows singulation of the wafer by deep etching and forms a trench in the mask layer with a laser beam which has a process point at a bottom of the trench, directing gas nozzles that flow a pressurized gas at the process point in the trench as the pattern is formed with a gas flow angle relative to the process point and evacuating debris from the trench using an area of negative pressure where the gas flow from gas nozzles and the area of negative pressure are in fluid contact and are confined within a cylindrical housing.

公开(公告)号：US20240261898A1

公开(公告)日：2024-08-08

申请号：US18564708

申请日：2022-04-28

申请人： KOMATSU INDUSTRIES CORPORATION

发明人： Yoshihiro YAMAGUCHI ,  Nobuhiro TAKATA ,  Shigeru NOZAKI

IPC分类号： B23K26/14

CPC分类号： B23K26/1435

摘要： A container can store a transmission inhibition liquid that inhibits transmission of a laser beam. A liquid storage unit has an internal space, and is connected to the container such that the transmission inhibition liquid stored in the container enters the internal space. A transmittance detection sensor detects transmittance of the internal space in the liquid storage unit.

公开(公告)号：US20240247361A1

公开(公告)日：2024-07-25

申请号：US18443968

申请日：2024-02-16

申请人： AUBURN UNIVERSITY

发明人： Masoud MAHJOURI-SAMANI ,  Nima SHAMSAEI

IPC分类号： C23C14/22 ,  B22F10/25 ,  B22F10/34 ,  B22F12/44 ,  B22F12/53 ,  B22F12/70 ,  B22F12/90 ,  B23K26/14 ,  B23K26/144 ,  B23K26/36 ,  B23K103/00 ,  B28B1/00 ,  B33Y10/00 ,  B33Y30/00

CPC分类号： C23C14/228 ,  B22F10/25 ,  B22F10/34 ,  B22F12/53 ,  B22F12/70 ,  B23K26/1437 ,  B23K26/144 ,  B23K26/1464 ,  B23K26/1482 ,  B23K26/36 ,  B28B1/001 ,  B33Y10/00 ,  B33Y30/00 ,  B22F12/44 ,  B22F12/90 ,  B23K2103/50

摘要： A device including a chamber and a nozzle detachably connected to the chamber, the nozzle defining an aperture, a target carousel disposed within the chamber, a first laser configured to generate a first beam directed toward the target carousel to perform in-situ ablation to form a laser plume, a gas flow system configured to supply gas into the chamber, such that the gas interacts with the laser plume and causes condensation and formation of nanoparticles, and a second laser configured to generate a second beam directed through the interior of the chamber, through the aperture of the nozzle, and toward a substrate disposed outside the device, the second laser beam configured to sinter and crystalize on the substrate the nanoparticles exiting the nozzle.