公开(公告)号：US20240357916A1

公开(公告)日：2024-10-24

申请号：US18420539

申请日：2024-01-23

申请人： Samsung Display Co., LTD.

发明人： SEUNG-HOON JANG ,  Konstantin MISHCHIK ,  Hyung Sik KIM ,  SUNGGYU PARK

IPC分类号： H10K71/00 ,  B23K26/38 ,  G02B26/02 ,  G02B27/09 ,  G02B27/10

CPC分类号： H10K71/851 ,  B23K26/38 ,  G02B26/02 ,  G02B27/0927 ,  G02B27/1093

摘要： An embodiment of the disclosure provides an optical panel cutting device, including: a light converter that converts an incident beam into a Bessel beam; a projection lens that amplifies energy of a beam outgoing from the light converter; a beam splitter that splits a beam outgoing from the projection lens; and an objective lens that amplifies a beam outgoing from the beam splitter to cut a panel, wherein the beam outgoing from the objective lens includes a first peak and at least one second peak, and the at least one second peak has a lower intensity than the first peak.

公开(公告)号：US12122060B2

公开(公告)日：2024-10-22

申请号：US17284077

申请日：2019-08-14

申请人： TRUMPF Werkzeugmaschinen SE + Co. KG

发明人： Simon Ockenfuss ,  Karl Lukas Knierim

IPC分类号： B26D5/00 ,  B23K26/38 ,  B24C1/04 ,  B26F3/00

CPC分类号： B26D5/005 ,  B23K26/38 ,  B24C1/045 ,  B26F3/004

摘要： A method cuts a, in particular flat, workpiece by a cutting beam and a cutting fluid. A workpiece part to be cut away is consecutively cut into at least two smaller portions which fall or are lowered downwards from a surrounding remaining workpiece after they have each been cut away. The division into smaller portions and the execution of the cut for separating the first smaller portion occur such that the point at which the first-cut, first smaller portion is cut away lies within the outer contour of the workpiece part to be cut away.

公开(公告)号：US12121995B2

公开(公告)日：2024-10-22

申请号：US17307928

申请日：2021-05-04

申请人： YANGTZE MEMORY TECHNOLOGIES CO., LTD.

发明人： Liquan Cai ,  Peng Chen ,  Houde Zhou

IPC分类号： B23K26/38 ,  B23K26/40 ,  B23K101/40

CPC分类号： B23K26/38 ,  B23K26/40 ,  B23K2101/40

摘要： A laser system for dicing a semiconductor structure is disclosed. The laser system includes a laser source and a laser energy adjusting unit. The laser source is configured to generate a laser. The laser energy adjusting unit is movably provided on a laser light path between the laser source and the semiconductor structure. The laser energy adjusting unit is moved to the laser light path between the laser source and the semiconductor structure based on a first determination that the laser source is focused on a first preset region of the semiconductor structure having a first material.

公开(公告)号：US20240342833A1

公开(公告)日：2024-10-17

申请号：US18753349

申请日：2024-06-25

申请人： Trumpf Laser UK Limited

发明人： Andrew Malinowski ,  Christophe Andre Codemard ,  Mikhail Nickolaos Zervas ,  Paul Martin Harrison ,  Mark Greenwood

IPC分类号： B23K26/38 ,  B23K26/06 ,  B23K26/073 ,  B23K26/08 ,  B23K26/142 ,  B23K26/20 ,  B23K26/34 ,  G02B6/02 ,  G02B27/48

CPC分类号： B23K26/38 ,  B23K26/06 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/073 ,  B23K26/0876 ,  B23K26/142 ,  B23K26/20 ,  B23K26/34 ,  G02B6/02042 ,  G02B6/02071 ,  G02B27/48

摘要： Apparatus (10) for laser processing a material (11), which apparatus comprises a laser (1) and a beam delivery cable (2), wherein: the laser (1) is connected to the beam delivery cable (2); the beam delivery cable (2) is configured to transmit laser radiation (13) emitted from the laser (1), and the laser radiation (13) is defined by a beam parameter product (4); and the apparatus (10) is characterized in that: the apparatus (10) includes at least one squeezing mechanism (5) comprising a periodic surface (6) defined by a pitch (7); a length (8) of optical fibre (9) that forms part of the laser (1) and/or the beam delivery cable (2) is located adjacent to the periodic surface (6); and the squeezing mechanism (5) is configured to squeeze the periodic surface (6) and the length (8) of the optical fibre (9) together with a squeezing force (12); whereby the beam parameter product (4) is able to be varied by adjusting the squeezing force (12).

公开(公告)号：US12115590B2

公开(公告)日：2024-10-15

申请号：US18131923

申请日：2023-04-07

申请人： Walmart Apollo, LLC

发明人： James Benjamin Edwards ,  Paul E. Durkee

IPC分类号： B23D59/00 ,  B23K26/06 ,  B23K26/38 ,  B65B69/00 ,  G06N3/04 ,  G06V10/20 ,  G06V10/764 ,  G06V10/80 ,  G06V10/82 ,  G06V20/52 ,  B26D5/00 ,  G06K7/10

CPC分类号： B23D59/001 ,  B23K26/0626 ,  B23K26/38 ,  B65B69/0033 ,  G06N3/04 ,  G06V10/255 ,  G06V10/764 ,  G06V10/80 ,  G06V10/82 ,  G06V20/52 ,  B26D5/007 ,  G06K7/10297

摘要： Features are applied to a mathematical model to produce a cutting pattern for opening a container. The cutting pattern specifies which of one or more cutting tools is to be used and the location of where cuts are to be made on the container. The cutting pattern is sent to a container opening machine. The container opening machine is operated and the container cut and opened by the container opening machine according to the cutting pattern.

公开(公告)号：US20240326165A1

公开(公告)日：2024-10-03

申请号：US18735595

申请日：2024-06-06

申请人： DENSO CORPORATION

发明人： Koichiro YASUDA ,  Ryota TAKAGI ,  Tomoki KAWAZU ,  Sodai NOMURA ,  Hideaki SHIRAI ,  Bahman SOLTANI ,  Shunsuke SOBAJIMA

IPC分类号： B23K26/082 ,  B23K26/38

CPC分类号： B23K26/082 ,  B23K26/38

摘要： A surface of one end side of an ingot in a height direction thereof is irradiated with a laser beam having a permeability to the ingot, thereby forming a peeling layer at a depth position corresponding to a thickness of the wafer from the surface. A laser scanning irradiating the laser beam is performed for a plurality of times changing the irradiation position in a second direction while causing an irradiation position of the laser beam to move in a first direction. With a single laser scanning, a plurality of laser beams are irradiated in which irradiation positions are different in the first direction and the second direction.

公开(公告)号：US20240318418A1

公开(公告)日：2024-09-26

申请号：US18188931

申请日：2023-03-23

申请人： Albert A. Burlando

发明人： Albert A. Burlando

IPC分类号： E03F5/04 ,  B05D1/04 ,  B23K26/38

CPC分类号： E03F5/041 ,  B05D1/04 ,  B23K26/38 ,  B23K26/0093 ,  B23K2103/05 ,  E03F2201/00

摘要： A method of manufacturing a storm drain marker. The marker is constructed of a stainless steel plate with a front surface centrally disposed depression and a back surface that is recessed. The front surface is coated with a porcelain frit, and overlaid with a ceramic printed decal which is fused with the porcelain frit coating. The shaped plate forming an informational marker that can withstand long term exposure to the elements.

公开(公告)号：US20240308003A1

公开(公告)日：2024-09-19

申请号：US18575070

申请日：2022-06-29

申请人： VULKAM ,  LASER ENGINEERING APPLICATIONS

发明人： Sébastien GRAVIER ,  Sarah ABRAHAM ,  Xavier CERUTTI ,  Léo LEBRUN ,  Mathieu DIJOUX

IPC分类号： B23K26/38 ,  B23K26/0622 ,  B23K26/08 ,  B23K103/18

CPC分类号： B23K26/38 ,  B23K26/0624 ,  B23K26/08 ,  B23K2103/26

摘要： A method for machining a sample of amorphous metal alloy using a femtosecond laser, including at least one step of irradiating the sample with a laser beam along a reference trajectory to ablate material from the sample, so as to obtain a sample machined and maintained in the amorphous state, in which, the laser beam is pulsed, and the duration of each pulse is less than 1000 femtoseconds, preferably less than 600 femtoseconds, and in which the amorphous metal alloy has a critical diameter less than 5 millimeters, and/or a difference between the crystallization temperature and the glass transition temperature less than 60° C., and/or a quotient of the difference between the crystallization temperature and the glass transition temperature and of the difference between the liquidus temperature and the temperature glass transition is less than 0.12.

公开(公告)号：US12070422B2

公开(公告)日：2024-08-27

申请号：US17210113

申请日：2021-03-23

申请人： Allotex, Inc.

发明人： David Muller

IPC分类号： A61F9/008 ,  B23K26/12 ,  B23K26/361 ,  B23K26/38 ,  B23K26/402 ,  A61F2/14 ,  B23K103/00

CPC分类号： A61F9/00804 ,  A61F9/0081 ,  A61F9/00812 ,  A61F9/00831 ,  A61F9/00834 ,  B23K26/127 ,  B23K26/361 ,  B23K26/38 ,  B23K26/402 ,  A61F2/145 ,  A61F2009/00842 ,  A61F2009/00851 ,  A61F2009/00872 ,  A61F2009/00878 ,  A61F2009/00893 ,  A61F2009/00895 ,  B23K2103/32

摘要： A system for forming a corneal implant includes a cutting apparatus, which includes a laser source that emits a laser and optical elements that direct the laser. The system includes a controller implemented with at least one processor and at least one data storage device. The controller generates a sculpting plan for modifying a first shape of a lenticule formed from corneal tissue and achieving a second shape for the lenticule to produce a corneal implant with a refractive profile to reshape a recipient eye. The sculpting plan is determined from measurements relating to the lenticule having the first shape and information relating to a refractive profile for a corneal implant. The controller controls the cutting apparatus to direct, via the one or more optical elements, the laser from the laser source to sculpt the lenticule according to the sculpting plan to produce the corneal implant with the refractive profile.

公开(公告)号：US20240269779A1

公开(公告)日：2024-08-15

申请号：US18564744

申请日：2022-04-28

申请人： KOMATSU INDUSTRIES CORPORATION

发明人： Yoshihiro YAMAGUCHI ,  Nobuhiro TAKATA ,  Shigeru NOZAKI ,  Keita KONDOU

IPC分类号： B23K26/70 ,  B23K26/08 ,  B23K26/38

CPC分类号： B23K26/706 ,  B23K26/38 ,  B23K26/0876

摘要： A container can store a transmission inhibition liquid that inhibits transmission of a laser beam. A laser head emits a laser beam. A transmittance detection sensor detects transmittance of a transmission inhibition liquid stored in a container. A liquid level sensor is fixed to the laser head, and detects a relative distance between the liquid level sensor and a liquid level of the transmission inhibition liquid. A controller controls emission of the laser beam to a workpiece by the laser head based on detection results of the transmittance detection sensor and the liquid level sensor.