公开(公告)号：US20250050462A1

公开(公告)日：2025-02-13

申请号：US18721138

申请日：2022-10-25

Applicant: EBARA CORPORATION

Inventor： Makoto KASHIWAGI

IPC: B24B49/00 ,  B24B7/04 ,  B24B27/033 ,  B24B41/06 ,  B24B49/12 ,  H01L21/02

Abstract: The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, such as a wafer. In the substrate processing method, rollers (11a, 11b) secured to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b) are brought into contact with the periphery of a substrate (W) having a notch (Nw), and further the rollers (11a, 11b) are moved in a circular motion, thereby rotating and circularly moving the substrate (W), and further, processing the substrate (W) by bringing a processing tool (201) into contact with the substrate (W). During processing of the substrate (W), a rotational speed of the substrate (W) is calculated based on measured values of a notch detection sensor (77) which is capable of detecting that the notch (Nw) has passed the movable shaft (13b), and an alarm is issued when the rotational speed of the substrate (W) is out of an allowable range which is set with respect to a theoretical rotational speed of the substrate (W).

公开(公告)号：US12220782B2

公开(公告)日：2025-02-11

申请号：US17647065

申请日：2022-01-05

Applicant: DISCO CORPORATION

Inventor： Zhibo Su ,  Kazuki Terada

IPC: B23Q3/157 ,  B24B27/06 ,  B24B41/04 ,  B24B45/00 ,  B24B49/00 ,  B24B49/12 ,  B24B53/12 ,  B24B55/04 ,  B28D5/02 ,  B23Q3/155 ,  B23Q11/08 ,  B23Q13/00

Abstract: A cutting apparatus includes a cutting unit including a spindle as a rotational shaft and a mount flange for mounting a cutting blade thereon, the mount flange being fixed to a distal end of the spindle, a support unit for supporting a cutting blade housed in a blade case, the support unit including a blade case support for supporting the blade case for housing the cutting blade therein, a changing mechanism for dismounting a cutting blade that has been mounted on the mount flange from the mount flange and mounting the cutting blade that has been supported on the support unit on the mount flange, and a moving mechanism for moving the changing mechanism between a changing position, a blade transfer position, and a retracted position.

公开(公告)号：US12145237B2

公开(公告)日：2024-11-19

申请号：US16719641

申请日：2019-12-18

Applicant: Seoul Laser Dieboard System Co., Ltd.

Inventor： Kyong Chan Lim

IPC: B24B7/12 ,  B24B27/033 ,  B24B29/00 ,  B24B29/06 ,  B24B49/00

Abstract: Method and system, including: a strip of metallic material used by a bender to produce the 3-D signage; a sanding unit coupled to the bender and configured to sand away any dirt, oil, or other undesirable material attaching to the strip of metallic material; and a controller configured to make a measurement of how fast the strip of metallic material is feeding into the bender, and to control an operating speed of the sanding unit based on the measurement.

公开(公告)号：US12128522B2

公开(公告)日：2024-10-29

申请号：US17871259

申请日：2022-07-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Shu-Bin Hsu ,  Ren-Guei Lin ,  Feng-Inn Wu ,  Sheng-Chen Wang ,  Jung-Yu Li

IPC: B24B37/26 ,  B24B49/00 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02

CPC classification number: B24B37/26 ,  B24B49/00 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02

Abstract: A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.

公开(公告)号：US20240342854A1

公开(公告)日：2024-10-17

申请号：US18294730

申请日：2022-07-04

Applicant: EBARA CORPORATION

Inventor： Hiroki NAKAMURA ,  Yuta SUZUKI ,  Yusuke WATANABE ,  Michiaki MATSUDA ,  Koki YAMAMOTO ,  Taro TAKAHASHI

IPC: B24B37/013 ,  B24B49/00 ,  B24B49/04

CPC classification number: B24B37/013 ,  B24B49/003 ,  B24B49/045

Abstract: To accurately detect a polishing end point even if a change in a polishing frictional force is small. A polishing apparatus includes a polishing table for holding a polishing pad, a holder for holding a polishing target object such that the polishing target object faces the polishing pad, and an end point detector that detects, based on a signal indicating a state of polishing of the polishing target object by the polishing pad, a polishing end point indicating an end of the polishing. The end point detector is configured to remove noise of the signal, exponentiate the signal subjected to the noise removal with an exponent greater than 1, and detect the polishing end point based on the exponentiated signal.

公开(公告)号：US20240326691A1

公开(公告)日：2024-10-03

申请号：US18738309

申请日：2024-06-10

Applicant: MAGNA MIRRORS OF AMERICA, INC.

Inventor： Darryl P. De Wind ,  Michael J. Baur ,  Timothy G. Perkins

IPC: B60R1/04 ,  B24B9/02 ,  B24B9/08 ,  B24B13/00 ,  B24B49/00 ,  B24B51/00 ,  B60R1/08 ,  B60R1/12 ,  C03C17/06 ,  G02B5/04 ,  G02B5/08 ,  G02B7/182 ,  G02F1/1333 ,  G02F1/153 ,  G02F1/157 ,  G02F1/161 ,  G02F1/163

CPC classification number: B60R1/04 ,  B24B9/02 ,  B24B9/08 ,  B24B13/00 ,  B24B49/00 ,  B60R1/086 ,  B60R1/088 ,  B60R1/12 ,  C03C17/06 ,  G02B5/04 ,  G02B7/182 ,  G02F1/13338 ,  G02F1/153 ,  G02F1/157 ,  G02F1/161 ,  G02F1/163 ,  B24B51/00 ,  B60R1/1207 ,  B60R2001/1223 ,  C03C2217/25 ,  C03C2218/31 ,  G02B5/08

Abstract: A vehicular interior rearview mirror assembly includes a mounting structure and a mirror head adjustable about the mounting structure. The mirror head accommodates a mirror reflective element comprising a glass substrate. With the vehicular interior rearview mirror assembly mounted at an interior portion of a vehicle, the mirror head is adjustable about the mounting structure by a driver of the vehicle to adjust the driver's rearward view. The glass substrate includes a periphery surface extending between a planar first surface and a planar second surface and spanning the thickness dimension of the glass substrate. The planar first surface faces the driver of the vehicle. No part of the mirror casing encroaches onto the planar first surface of the glass substrate. The mirror head accommodates a video device for internal cabin surveillance, and wherein the internal cabin surveillance includes detection of drowsiness of the driver of the vehicle.

公开(公告)号：US20240286242A1

公开(公告)日：2024-08-29

申请号：US18652248

申请日：2024-05-01

Applicant: Bruker Nano Inc.

Inventor： Vladimir Gulkov ,  Nikolay Yeremin

IPC: B24B37/013 ,  B24B37/04 ,  B24B37/10 ,  B24B37/30 ,  B24B49/00 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/046 ,  B24B37/107 ,  B24B37/30 ,  B24B49/006 ,  B24B49/10

Abstract: Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.

公开(公告)号：US20240217062A1

公开(公告)日：2024-07-04

申请号：US18395059

申请日：2023-12-22

Applicant: EBARA CORPORATION

Inventor： Masashi KABASAWA ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Toshimitsu SASAKI ,  Kohei EGAWA

IPC: B24B53/017 ,  B24B37/04 ,  B24B49/00

CPC classification number: B24B53/017 ,  B24B37/042 ,  B24B49/006

Abstract: An object of the present disclosure is to more appropriately control the moving speed of a dresser. A substrate polishing apparatus includes a dresser that moves in a plurality of scan areas set on a polishing member, and a moving speed calculation unit that calculates a moving speed of the dresser in each of the scan areas based on an evaluation index including a deviation from a stay time of the dresser in each of the scan areas on a basis of a previous recipe.

公开(公告)号：US20240217054A1

公开(公告)日：2024-07-04

申请号：US18610375

申请日：2024-03-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shang-Yu Wang ,  Chun-Hao Kung ,  Ching-Hsiang Tsai ,  Kei-Wei Chen ,  Hui-Chi Huang

IPC: B24B37/10 ,  B24B37/04 ,  B24B49/00 ,  H01L21/306

CPC classification number: B24B37/107 ,  B24B37/042 ,  B24B49/00 ,  H01L21/30625

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

公开(公告)号：US11975419B2

公开(公告)日：2024-05-07

申请号：US16466050

申请日：2016-12-09

Applicant: Mirka Ltd

Inventor： Matias Nybacka ,  Caj Nordström

IPC: B24B47/10 ,  B24B23/03 ,  B24B23/04 ,  B24B41/04 ,  B24B47/12 ,  B24B49/00

CPC classification number: B24B23/03 ,  B24B23/04 ,  B24B41/04 ,  B24B47/10 ,  B24B47/12 ,  B24B49/00

Abstract: A power tool includes a grinder, sander or a polisher, which has two working modes. According to an embodiment a dual power tool includes a motor operable in two operational directions, where an operational mode of the dual mode power tool is changeable by changing operational direction of the motor.