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公开(公告)号：US12128522B2
公开(公告)日：2024-10-29
申请号：US17871259
申请日：2022-07-22
发明人： Shu-Bin Hsu , Ren-Guei Lin , Feng-Inn Wu , Sheng-Chen Wang , Jung-Yu Li
摘要： A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.
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公开(公告)号：US20240342854A1
公开(公告)日：2024-10-17
申请号：US18294730
申请日：2022-07-04
申请人： EBARA CORPORATION
发明人： Hiroki NAKAMURA , Yuta SUZUKI , Yusuke WATANABE , Michiaki MATSUDA , Koki YAMAMOTO , Taro TAKAHASHI
IPC分类号： B24B37/013 , B24B49/00 , B24B49/04
CPC分类号： B24B37/013 , B24B49/003 , B24B49/045
摘要： To accurately detect a polishing end point even if a change in a polishing frictional force is small. A polishing apparatus includes a polishing table for holding a polishing pad, a holder for holding a polishing target object such that the polishing target object faces the polishing pad, and an end point detector that detects, based on a signal indicating a state of polishing of the polishing target object by the polishing pad, a polishing end point indicating an end of the polishing. The end point detector is configured to remove noise of the signal, exponentiate the signal subjected to the noise removal with an exponent greater than 1, and detect the polishing end point based on the exponentiated signal.
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公开(公告)号：US20240326691A1
公开(公告)日：2024-10-03
申请号：US18738309
申请日：2024-06-10
IPC分类号： B60R1/04 , B24B9/02 , B24B9/08 , B24B13/00 , B24B49/00 , B24B51/00 , B60R1/08 , B60R1/12 , C03C17/06 , G02B5/04 , G02B5/08 , G02B7/182 , G02F1/1333 , G02F1/153 , G02F1/157 , G02F1/161 , G02F1/163
CPC分类号： B60R1/04 , B24B9/02 , B24B9/08 , B24B13/00 , B24B49/00 , B60R1/086 , B60R1/088 , B60R1/12 , C03C17/06 , G02B5/04 , G02B7/182 , G02F1/13338 , G02F1/153 , G02F1/157 , G02F1/161 , G02F1/163 , B24B51/00 , B60R1/1207 , B60R2001/1223 , C03C2217/25 , C03C2218/31 , G02B5/08
摘要： A vehicular interior rearview mirror assembly includes a mounting structure and a mirror head adjustable about the mounting structure. The mirror head accommodates a mirror reflective element comprising a glass substrate. With the vehicular interior rearview mirror assembly mounted at an interior portion of a vehicle, the mirror head is adjustable about the mounting structure by a driver of the vehicle to adjust the driver's rearward view. The glass substrate includes a periphery surface extending between a planar first surface and a planar second surface and spanning the thickness dimension of the glass substrate. The planar first surface faces the driver of the vehicle. No part of the mirror casing encroaches onto the planar first surface of the glass substrate. The mirror head accommodates a video device for internal cabin surveillance, and wherein the internal cabin surveillance includes detection of drowsiness of the driver of the vehicle.
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4.发明公开公开(公告)号：US20240286242A1
公开(公告)日：2024-08-29
申请号：US18652248
申请日：2024-05-01
申请人： Bruker Nano Inc.
发明人： Vladimir Gulkov , Nikolay Yeremin
CPC分类号： B24B37/013 , B24B37/042 , B24B37/046 , B24B37/107 , B24B37/30 , B24B49/006 , B24B49/10
摘要： Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.
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5.发明公开公开(公告)号：US20240217062A1
公开(公告)日：2024-07-04
申请号：US18395059
申请日：2023-12-22
申请人： EBARA CORPORATION
IPC分类号： B24B53/017 , B24B37/04 , B24B49/00
CPC分类号： B24B53/017 , B24B37/042 , B24B49/006
摘要： An object of the present disclosure is to more appropriately control the moving speed of a dresser. A substrate polishing apparatus includes a dresser that moves in a plurality of scan areas set on a polishing member, and a moving speed calculation unit that calculates a moving speed of the dresser in each of the scan areas based on an evaluation index including a deviation from a stay time of the dresser in each of the scan areas on a basis of a previous recipe.
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公开(公告)号：US20240217054A1
公开(公告)日：2024-07-04
申请号：US18610375
申请日：2024-03-20
发明人： Shang-Yu Wang , Chun-Hao Kung , Ching-Hsiang Tsai , Kei-Wei Chen , Hui-Chi Huang
IPC分类号： B24B37/10 , B24B37/04 , B24B49/00 , H01L21/306
CPC分类号： B24B37/107 , B24B37/042 , B24B49/00 , H01L21/30625
摘要： A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
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公开(公告)号：US11975419B2
公开(公告)日：2024-05-07
申请号：US16466050
申请日：2016-12-09
申请人： Mirka Ltd
发明人： Matias Nybacka , Caj Nordström
摘要： A power tool includes a grinder, sander or a polisher, which has two working modes. According to an embodiment a dual power tool includes a motor operable in two operational directions, where an operational mode of the dual mode power tool is changeable by changing operational direction of the motor.
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公开(公告)号：US11970110B2
公开(公告)日：2024-04-30
申请号：US18456572
申请日：2023-08-28
IPC分类号： B60R1/04 , B24B9/02 , B24B9/08 , B24B13/00 , B24B49/00 , B60R1/08 , B60R1/12 , C03C17/06 , G02B5/04 , G02B7/182 , G02F1/1333 , G02F1/153 , G02F1/157 , G02F1/161 , G02F1/163 , B24B51/00 , G02B5/08
CPC分类号： B60R1/04 , B24B9/02 , B24B9/08 , B24B13/00 , B24B49/00 , B60R1/086 , B60R1/088 , B60R1/12 , C03C17/06 , G02B5/04 , G02B7/182 , G02F1/13338 , G02F1/153 , G02F1/157 , G02F1/161 , G02F1/163 , B24B51/00 , B60R1/1207 , B60R2001/1223 , C03C2217/25 , C03C2218/31 , G02B5/08
摘要： A vehicular frameless interior rearview mirror assembly includes a mirror head and a mounting portion. The mirror head includes a mirror reflective element and a mirror casing. The mirror reflective element includes a glass substrate having a planar front side and a planar rear side. No portion of the mirror casing overlaps the planar front side of the glass substrate of the mirror reflective element. A camera is disposed within the mirror casing. With the mounting portion of the mirror assembly mounted at an in-cabin side of a windshield of a vehicle, the camera views a driver of the vehicle, and when the mirror head is moved by the driver of the vehicle to adjust the rearward view provided by the mirror reflective element to the driver, the camera moves in tandem with movement of the mirror head. The camera is part of a driver monitoring system of the vehicle.
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公开(公告)号：US11931853B2
公开(公告)日：2024-03-19
申请号：US17681677
申请日：2022-02-25
发明人： Eric Lau , Charles C. Garretson , Huanbo Zhang , Zhize Zhu , Benjamin Cherian , Brian J. Brown , Thomas H. Osterheld
IPC分类号： B24B37/005 , B24B49/00 , B24B49/12 , B24B49/16 , G05B13/04
CPC分类号： B24B37/005 , B24B49/006 , B24B49/12 , B24B49/16 , G05B13/041 , G05B13/047
摘要： Generating a recipe for controlling a polishing system includes receiving a target removal profile that includes a target thickness to remove for a plurality of locations on a substrate that are angularly distributed around the substrate, and storing a first function defining a polishing rate for a zone from a plurality of pressurizable zones of a carrier head that are angularly distributed around a the carrier head. The first function defines polishing rates as a function of pressures. For each particular zone of the plurality of zones a recipe defining a pressure for the particular zone over time is calculated by calculating an expected thickness profile after polishing using the first function, and minimizing a cost function that incorporates a first term representing a difference between the expected thickness profile and a target thickness profile.
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公开(公告)号：US11850695B2
公开(公告)日：2023-12-26
申请号：US17756446
申请日：2020-11-24
发明人： Aaron K. Nienaber , Mark W. Orlando , Nathan J. Herbst , Christie L. Vitale , Marc Eberwein , Brett R. Hemes , Jonathan B. Arthur , Thomas J. Strey
IPC分类号： B24B57/04 , B24B19/26 , B24B51/00 , B25J3/00 , B25J9/16 , B25J13/08 , B25J19/02 , B24B49/00 , B24B27/00 , B05D3/12 , B05D5/00 , B24D3/00 , B24D9/08 , B24D11/02 , B24B41/00 , B25J11/00
CPC分类号： B24B27/0038 , B05D3/12 , B05D5/005 , B24B19/26 , B24B41/005 , B24B51/00 , B24B57/04 , B24D3/002 , B24D9/085 , B24D11/02 , B25J3/00 , B25J9/16 , B25J11/0065 , B25J13/08
摘要： A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory computer-readable medium and executed by the processor.
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