Silicon wafer single-side polishing method

    公开(公告)号:US11628534B2

    公开(公告)日:2023-04-18

    申请号:US16069300

    申请日:2016-12-02

    申请人: SUMCO CORPORATION

    摘要: A silicon wafer single-side polishing method that can significantly improve the stepped minute defect occurrence rate is provided. The silicon wafer single-side polishing method comprises: a first polishing step of performing polishing on one side of a silicon wafer under a first polishing condition; and a second polishing step of performing polishing on the silicon wafer under a second polishing condition in which at least one of an applied pressure and a relative speed in the first polishing condition is changed, after the first polishing step, wherein a polishing rate ratio according to the first polishing condition is higher than a polishing rate ratio according to the second polishing condition.

    GRINDING APPARATUS
    3.
    发明申请

    公开(公告)号:US20230068840A1

    公开(公告)日:2023-03-02

    申请号:US17820836

    申请日:2022-08-18

    申请人: DISCO CORPORATION

    发明人: Yujiro SUDO

    IPC分类号: B24B51/00 B24B49/12 B24B41/06

    摘要: A grinding apparatus includes a chuck table, a grinding unit, a moving mechanism for moving the chuck table and the grinding unit relatively to each other in predetermined directions, a detector for emitting a web-shaped laser beam and detecting a reflected laser beam thereof, and a control unit. The control unit includes a storing section for storing a relative vertical position of a holding surface to a grinding wheel along the predetermined directions, a first distance calculating section for calculating a first distance in one of the predetermined directions from the detector to a lower surface of the at least one of grindstones, and a lower surface position calculating section for calculating the position of a lower surface of the at least one of grindstones to the holding surface on the basis of the relative vertical position stored in the storing section and the first distance calculated.

    Workpiece processing device and method

    公开(公告)号:US11571785B2

    公开(公告)日:2023-02-07

    申请号:US17334337

    申请日:2021-05-28

    摘要: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

    SUBSTRATE CLEANING APPARATUS, POLISHING APPARATUS, BUFFING APPARATUS, SUBSTRATE CLEANING METHOD, SUBSTRATE PROCESSING APPARATUS, AND MACHINE LEARNING APPARATUS

    公开(公告)号:US20220410343A1

    公开(公告)日:2022-12-29

    申请号:US17780923

    申请日:2020-12-07

    申请人: EBARA CORPORATION

    摘要: The present invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, which are improved in terms of both performance and throughput. The substrate cleaning apparatus (16) includes: a cleaning tool (77) configured to clean a substrate (W) held by a substrate holder (71, 72, 73, 74); a surface-property measuring device configured to obtain surface data of the cleaning tool (77); and a controller (30) configured to determine a replacement time of the cleaning tool (77) based on the surface data. The surface-property measuring device is configured to obtain surface data of the cleaning tool (77) at at least two measurement points (PA, PB) of the cleaning tool (77) each time a predetermined number of substrates (W) are scrubbed, and the controller (30) is configured to determine the replacement time of the cleaning tool (77) based on a difference in the surface data obtained.

    SYSTEM AND METHOD FOR AUTONOMOUSLY SCANNING AND PROCESSING A PART

    公开(公告)号:US20220388115A1

    公开(公告)日:2022-12-08

    申请号:US17826840

    申请日:2022-05-27

    摘要: One variation of a method S100 for autonomously scanning and processing a part includes: collecting a set of images depicting a part positioned within a work zone adjacent a robotic system; assembling the set of images into a part model representing the part. The method includes segmenting areas of the part model—delineated by local radii of curvature, edges, or color boundaries—into target zones for processing by the robotic system and exclusion zones avoided by the robotic system. The method includes: projecting a set of keypoints onto the target zone of part model defining positions, orientations, and target forces of a sanding head applied at locations on the part model; assembling the set of keypoints into a toolpath and projecting the toolpath onto the target zone of the part model; and transmitting the toolpath to a robotic system to execute the toolpath on the part within the work zone.

    Powered sharpener with user directed indicator mechanism

    公开(公告)号:US11491602B2

    公开(公告)日:2022-11-08

    申请号:US16161891

    申请日:2018-10-16

    申请人: Darex, LLC

    发明人: Daniel T. Dovel

    摘要: A tool sharpener has first and second guide surfaces to respectively support a cutting tool adjacent first and second abrasive surfaces. A drive assembly moves the first and second abrasive surfaces with respect to the first and second guide surfaces. A control circuit directs a user to place the cutting tool against the first abrasive surface using the first guide surface to sharpen a cutting edge of the tool during a first sharpening operation. The control circuit activates an indicator mechanism at a conclusion of the first sharpening operation to direct the user to perform a second sharpening operation in which the user presents the cutting tool against the second abrasive surface using the second guide surface to sharpen the cutting edge.

    Workpiece processing device and method

    公开(公告)号:US11472055B2

    公开(公告)日:2022-10-18

    申请号:US17187501

    申请日:2021-02-26

    摘要: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

    Process for automated sanding of a vehicle component surface

    公开(公告)号:US11383344B2

    公开(公告)日:2022-07-12

    申请号:US16464609

    申请日:2017-11-29

    摘要: A process for automated sanding of a vehicle component surface is provided and includes providing a sanding mechanism having a sanding head engaged with a housing, a rotary motor contained within the housing, the rotary motor having a drive shaft rotatable about an axis and extending outwardly therefrom, a radial plate attached to a first end of the drive shaft, and a sanding disk having an abrasive surface releasably attached to the radial plate; attaching the sanding head to a gimbal having a pressure sensor; powering the rotary motor driving rotation of the drive shaft, the radial plate and the sanding disk in at least one of a clockwise or counterclockwise direction; movably applying the sanding disk to the surface at a maintained constant pressure; and achieving a desired finish on the surface prepared to be primed and painted to a class A auto high sheen surface finish.

    METHOD FOR OPERATING A MACHINE
    10.
    发明申请

    公开(公告)号:US20220184775A1

    公开(公告)日:2022-06-16

    申请号:US17598202

    申请日:2020-03-25

    发明人: Thomas BETTERMANN

    IPC分类号: B24B51/00 B24B21/04 B24B7/28

    摘要: The invention relates to a method for operating a machine, in particular a grinding machine, comprising the steps of: detecting a workpiece to be machined and setting various setting values of the machine, performing machining of the workpiece, detecting a first actual value and a second actual value during or after performance of the machining, wherein the first actual value is assigned a higher prioritization than the second actual value, comparing the first actual value with a first set value range and the second actual value with a second set value range, and changing the setting values of the machine such that the actual values meet the assigned target value range according to the prioritization.