PIEZOELECTRIC ACTUATING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240365670A1

    公开(公告)日:2024-10-31

    申请号:US18641417

    申请日:2024-04-21

    摘要: A piezoelectric actuating apparatus includes a frame having an opening, a rotatable element, first and second actuating elements, a sensing element, transmission elements, a sensing electrode, and a driving electrode. The rotatable element is in the opening, connected to the frame via a rotating shaft structure, and reciprocatingly swings relative to the frame around an axis of the rotating shaft structure as a center. The first actuating element is connected to the rotatable element. The transmission elements are between the first and second actuating elements, and between the first actuating element and the sensing element. The second actuating element and the sensing element are coupled to the rotatable element via the transmission elements. The sensing electrode is on a part of the transmission elements and the sensing element. The driving electrode is on another part of the transmission elements and the first and second actuating elements.

    MICROELECTROMECHANICAL ACOUSTIC COMPONENT
    5.
    发明公开

    公开(公告)号:US20240343552A1

    公开(公告)日:2024-10-17

    申请号:US18615358

    申请日:2024-03-25

    申请人: Robert Bosch GmbH

    IPC分类号: B81B3/00 H04R7/06 H04R19/04

    摘要: A microelectromechanical component for interacting with a pressure gradient of a fluid. The component has a substrate with a through-cavity, a microelectromechanical transducer including a middle support layer and two diaphragm elements spaced apart from the middle support layer. The middle support layer has at least one center electrode. The diaphragm elements each have a separately contactable outer electrode. The diaphragm elements together with the middle support layer form one or more cavities on both sides of the middle support layer. The microelectromechanical transducer spans the through-cavity at least partially and is deformable along a vertical movement direction. The microelectromechanical transducer has a bending region. A deformation of the microelectromechanical transducer in the vertical movement direction results in a bending of the bending region. Spacers are arranged between the middle support layer and the diaphragm elements. At least one of the spacers is arranged in the bending region.

    Controlling one or more electrostatic comb structures of a micro-electro-mechanical system device

    公开(公告)号:US12116267B2

    公开(公告)日:2024-10-15

    申请号:US17538784

    申请日:2021-11-30

    IPC分类号: B81B3/00 G02B26/08

    摘要: A micro-electro-mechanical system (MEMS) device includes a mirror; at least one hinge; an electrostatic comb structure; and a control device. The control device causes, for a period of time, a voltage to be supplied to the electrostatic comb structure to cause the electrostatic comb structure to tilt the mirror about the at least one hinge in a particular direction. The control device causes, after the period of time and at an instant of time, the voltage to cease being supplied to the electrostatic comb structure. A tilt angle of the mirror, at the first instant of time, is less than a maximum tilt angle of the mirror in the particular direction. An angular momentum of the mirror, at the instant of time, is greater than zero kilogram meters squared per second in the particular direction.

    LOCKING MECHANISMS FOR PRECISION OFFSET/DEPLOYMENT OF MEMS STRUCTURES

    公开(公告)号:US20240327200A1

    公开(公告)日:2024-10-03

    申请号:US18328624

    申请日:2023-06-02

    申请人: Omnitron Sensors

    发明人: Trent Huang

    IPC分类号: B81B3/00 G02B26/08

    摘要: A system and method for precisely positioning a moveable structure in a micro-electromechanical system (MEMS). The system includes a substrate and a moveable device structure supported on the substrate. The device structure is moveable from an initial position to a deployment position at a predetermined offset angle to the substrate. A moveable anchor structure is supported on the substrate in proximity to the device structure. The anchor structure is locked to the device structure when the device structure is moved to the deployment position.