公开(公告)号：US11525018B2

公开(公告)日：2022-12-13

申请号：US16994624

申请日：2020-08-16

申请人： SWIMC LLC

发明人： Jeffrey Niederst ,  Robert M. O'Brien ,  Kevin Romagnoli ,  Mark S. Von Maier ,  Lan Deng ,  Richard H Evans ,  David J. Santure ,  Benoit Prouvost

IPC分类号： C08F4/04 ,  C08L71/00 ,  C09D171/00 ,  C08F220/18 ,  B65D1/12 ,  B65D25/14 ,  C08F283/10 ,  C08G59/06 ,  C08G59/24 ,  C08G59/62 ,  C08G59/68 ,  C09D5/08 ,  C09D163/00

摘要： This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

公开(公告)号：US20220145019A1

公开(公告)日：2022-05-12

申请号：US17441921

申请日：2020-03-16

申请人： Carbon, Inc.

发明人： Ikpreet S. Grover ,  Matthew S. Menyo

IPC分类号： C08J3/24 ,  C08F283/10 ,  C08G59/24 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/124 ,  B29C64/35 ,  B33Y40/20

摘要： Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

公开(公告)号：US20210171694A1

公开(公告)日：2021-06-10

申请号：US17153027

申请日：2021-01-20

申请人： Henkel AG & Co. KGaA

发明人： AiFu Che ,  Chunfu Chen ,  Bin Li ,  Chao Wang

IPC分类号： C08F283/10

摘要： This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

公开(公告)号：US10472548B2

公开(公告)日：2019-11-12

申请号：US15795501

申请日：2017-10-27

申请人： Henkel IP & Holding GmbH

发明人： Timothy M. Champagne ,  Laxmisha M. Sridhar ,  Jonathan B. Israel ,  Philip T. Klemarczyk ,  XianMan Zhang ,  Benny E. Jordan

IPC分类号： C09J163/00 ,  C08L63/00 ,  H01L23/29 ,  H01L21/56 ,  C08K5/092 ,  C08F283/10 ,  C07C33/12 ,  C07C69/54 ,  C07C69/753 ,  C07D303/16 ,  C07D303/28 ,  C09J163/04 ,  H01L23/31 ,  H01L23/498 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08L53/02 ,  C08L79/08

摘要： Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

公开(公告)号：US10253206B2

公开(公告)日：2019-04-09

申请号：US15030929

申请日：2014-10-23

申请人： Allnex Austria GmbH ,  Allnex Belgium S.A.

发明人： Willibald Paar ,  Michel Tielemans ,  Stephan Peeters

IPC分类号： C08G18/62 ,  C08G18/64 ,  C09D5/44 ,  C08F283/10 ,  C09D175/14 ,  C25D13/18 ,  C09D163/00 ,  C25D13/22 ,  C08G18/67 ,  C08G18/79 ,  C09D175/16 ,  C08G59/17 ,  C08G59/14 ,  C08G59/18 ,  C09D163/10

摘要： The present invention relates to waterborne curing compositions for electrodeposition and radiation curing and processes to obtain such compositions. The compositions are characterized in that an ethylenically unsaturated compound (b), is dispersed in an aqueous solution by an at least partially neutralized (meth)acrylic modified amine epoxy adduct. The compositions of the invention are particularly suitable for coating metallic materials and temperature sensitive materials such as electrically conductive plastic materials.

公开(公告)号：US10113027B2

公开(公告)日：2018-10-30

申请号：US15290765

申请日：2016-10-11

申请人： SWIMC LLC

发明人： Jeffrey Niederst ,  Robert M. O'Brien ,  Kevin Romagnoli ,  Mark S. Von Maier ,  Lan Deng ,  Richard H Evans ,  David J. Santure ,  Benoit Prouvost

IPC分类号： C08G61/02 ,  C08G59/06 ,  C08G59/24 ,  C08G59/62 ,  C08G59/68 ,  C09D5/08 ,  C09D163/00 ,  C08F283/10 ,  B65D25/14 ,  B65D1/12

摘要： This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

公开(公告)号：US10067421B2

公开(公告)日：2018-09-04

申请号：US15154105

申请日：2016-05-13

申请人： ASAHI GLASS COMPANY, LIMITED

发明人： Kotaro Yamada ,  Keigo Matsuura

IPC分类号： C08F2/46 ,  C08G61/04 ,  G03F7/038 ,  G03F7/027 ,  H01L51/00 ,  G03F7/004 ,  G03F7/075 ,  C08F283/10 ,  C09D151/08

摘要： A negative photosensitive resin composition comprising an alkali-soluble resin or alkali-soluble monomer which has a photo-curability, a photopolymerization initiator, and an ink repellent agent which has a fluorine atom content of from 1 to 45 mass % and which is a partially hydrolyzed condensate of a hydrolyzable silane compound mixture containing a hydrolyzable silane compound having a hydrolyzable group and an organic group having a polyfluoroalkyl group which has an etheric oxygen atom; a cured resin film and partition walls formed by using the negative photosensitive resin composition; and an optical element having the partition walls located between a plurality of dots and their adjacent dots on a substrate surface.

公开(公告)号：US09862857B2

公开(公告)日：2018-01-09

申请号：US15254006

申请日：2016-09-01

申请人： Mercene Labs AB

发明人： Carl Fredrik Carlborg ,  Tommy Haraldsson

IPC分类号： B32B3/00 ,  C09D163/04 ,  C08F283/10 ,  C08G59/40 ,  C09D163/00 ,  C09D4/00 ,  B05D3/06 ,  B05D7/00 ,  H05K3/00 ,  B05D1/02 ,  B05D1/28 ,  B05D1/30 ,  G03F7/027 ,  C08F222/10 ,  G03F7/038

CPC分类号： C09D163/04 ,  B05D1/02 ,  B05D1/28 ,  B05D1/305 ,  B05D3/06 ,  B05D3/067 ,  B05D7/50 ,  B05D7/58 ,  C08F222/1006 ,  C08F283/105 ,  C08G59/4064 ,  C09D4/00 ,  C09D163/00 ,  G03F7/0275 ,  G03F7/038 ,  H05K3/0091 ,  Y10T428/24851 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31522

摘要： An object with a coating comprising: a) covalent bonds formed by reaction of a thiol group and a carbon-carbon double bond, b) covalent bonds formed by reaction of a thiol group and epoxide group, c) covalent bonds formed by a reaction of a carbon-carbon double bond and an epoxide group, said coating comprising a first primer coating and a second coating, said coating comprising covalent bonds between said first and second coatings, said first primer coating comprising covalent cross links between compounds, in the first coating the fraction (r3=ta/tc) of unreacted thiol groups (ta) to thiol groups which have reacted to form a covalent bond (tc) does not exceed 0.11, wherein the half height peak width of tan delta does not exceed 30° C. Advantages of the dual cure composition is that excellent strength is obtained and that the second curing is slow compared to the first initial curing.

公开(公告)号：US09644062B2

公开(公告)日：2017-05-09

申请号：US14426410

申请日：2013-10-17

申请人： Dow Global Technologies LLC

发明人： Rui Xie ,  Jeanette K. Nunley

IPC分类号： C08L9/00 ,  C08L51/04 ,  C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  C08L67/02 ,  C08L67/04 ,  C08L71/02 ,  C08F283/10 ,  C08J5/24 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50

CPC分类号： C08F283/10 ,  C08G59/245 ,  C08G59/4238 ,  C08G59/5026 ,  C08J5/24 ,  C08J2363/00 ,  C08L9/00 ,  C08L51/04 ,  C08L63/00 ,  C08L63/04 ,  C08L67/02 ,  C08L67/04 ,  C08L71/02 ,  C08L2205/05 ,  C08L2207/53

摘要： A toughener composition comprising: a) a polyol component selected from the group consisting of a polyether polyol, a polyester polyol, a polycaprolactone polyol, a hydroxyl-terminated polybutadiene, and mixtures or copolymers thereof; and b) a core shell rubber comprising a rubber particle core and a shell layer wherein said core shell rubber has a particle size of from 0.01 μm to 0.5 μm is disclosed. The toughener can be used in epoxy resin compositions for composite applications.

公开(公告)号：US09040630B2

公开(公告)日：2015-05-26

申请号：US13811665

申请日：2011-07-29

申请人： Derek James McPhee

发明人： Derek James McPhee

IPC分类号： C08G63/02 ,  C08F293/00 ,  C08C19/28 ,  C08F279/02 ,  C08G81/02 ,  C08F36/22 ,  C08F283/00 ,  C08F283/02 ,  C08F283/10 ,  C08F287/00 ,  C08G64/00

CPC分类号： C08F293/00 ,  C08C19/28 ,  C08F36/22 ,  C08F279/02 ,  C08F283/00 ,  C08F283/02 ,  C08F283/10 ,  C08F287/00 ,  C08G81/02 ,  C08F222/06 ,  C08F220/08 ,  C08F220/32

摘要： Provided herein are graft copolymers of polyfarnesenes with condensation polymers; and methods of making and using the graft copolymers disclosed herein. In certain embodiments, the condensation polymers include polyesters, polycarbonates, polyamides, polyethers, phenol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins and combinations thereof. In some embodiments, the polyfarnesenes include farnesene homopolymers derived from a farnesene, and farnesene interpolymers derived from a farnesene and at least a vinyl monomer. In certain embodiments, the farnesene is prepared from a sugar by using a microorganism.

摘要翻译： 本文提供聚法呢烯与缩聚物的接枝共聚物; 以及制备和使用本文公开的接枝共聚物的方法。 在某些实施方案中，缩聚物包括聚酯，聚碳酸酯，聚酰胺，聚醚，酚醛树脂，脲甲醛树脂，三聚氰胺 - 甲醛树脂及其组合。 在一些实施方案中，聚法呢烯包括衍生自法呢烯的法呢烯均聚物和衍生自法呢烯和至少乙烯基单体的法呢烯互聚物。 在某些实施方案中，通过使用微生物从糖制备法呢烯。