公开(公告)号：US20240336599A1

公开(公告)日：2024-10-10

申请号：US18611785

申请日：2024-03-21

申请人： PROMERUS, LLC

发明人： PRAMOD KANDANARACHCHI ,  LARRY F. RHODES

IPC分类号： C07D403/14 ,  C08G73/10 ,  C08K5/3442 ,  G03F7/004 ,  G03F7/038

CPC分类号： C07D403/14 ,  C08G73/105 ,  C08K5/3442 ,  G03F7/0045 ,  G03F7/0387

摘要： Embodiments in accordance with the present invention encompass a composition comprising a polyamic acid or an end capped polyamic acid and a diazirine, which are useful as photosensitive compositions for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

公开(公告)号：US20240327639A1

公开(公告)日：2024-10-03

申请号：US18743779

申请日：2024-06-14

申请人： UBE Corporation

发明人： Takeshige Nakayama ,  Kazutaka Narita ,  Shohei Inoue

IPC分类号： C08L79/08 ,  C08G73/10 ,  H01G11/28 ,  H01G11/38 ,  H01G11/56 ,  H01G11/68 ,  H01G11/86 ,  H01M4/04 ,  H01M4/139 ,  H01M4/36 ,  H01M4/62 ,  H01M10/0525

CPC分类号： C08L79/08 ,  C08G73/1067 ,  C08G73/1071 ,  H01G11/28 ,  H01G11/38 ,  H01G11/56 ,  H01G11/68 ,  H01G11/86 ,  H01M4/0404 ,  H01M4/0471 ,  H01M4/139 ,  H01M4/362 ,  H01M4/622 ,  H01M10/0525

摘要： A binder resin for electrodes consisting of a polyimide-based resin having a melting point of 300° C. or lower, an electrode mixture paste including the binder resin for electrodes, an electrode active material, and a solvent; and an electrode including an electrode mixture layer including the binder resin for electrodes and an electrode active material; and a method for producing the electrode.

公开(公告)号：US12098248B2

公开(公告)日：2024-09-24

申请号：US16676879

申请日：2019-11-07

申请人： SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

发明人： Jungha Chae ,  Kyeong-sik Ju

IPC分类号： C08G73/14 ,  C08G73/10 ,  G02F1/1333 ,  H10K77/10

CPC分类号： C08G73/14 ,  C08G73/1028 ,  G02F1/133305 ,  H10K77/111

摘要： A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4, a composition for preparing the poly(amide-imide copolymer, and an article including the copolymer, e.g., a film are provided:






wherein, in Chemical Formulae 1 to 4, Ra, L1, L2, n1, A, R3, X, R10, R12, R13, n7 and n8 are the same as defined in the specification.

公开(公告)号：US12091509B1

公开(公告)日：2024-09-17

申请号：US16752794

申请日：2020-01-27

申请人： Government of the United States, as represented by the Secretary of the Air Force

发明人： Loon-Seng Tan ,  David H. Wang ,  Zhenning Yu ,  Hilmar Koerner

IPC分类号： C08G73/10 ,  B33Y70/00 ,  C07D209/50 ,  B29C64/118 ,  B29C64/153 ,  B29K79/00 ,  B29K105/24 ,  B33Y10/00

CPC分类号： C08G73/1067 ,  B33Y70/00 ,  C07D209/50 ,  C08G73/1071 ,  B29C64/118 ,  B29C64/153 ,  B29K2079/08 ,  B29K2105/24 ,  B33Y10/00 ,  C08G2115/00

摘要： The invention relates to cross-linkable oligoimides, processes of making such cross-linkable oligoimides and products comprising such cross-linkable oligoimides. Such cross-linkable oligoimides provide articles made by an AM process with the desired process ability that permits filament formation, post cure increased strength, the desired in use temperature stability and the desired thermo-oxidative stability.

公开(公告)号：US12091507B2

公开(公告)日：2024-09-17

申请号：US17042493

申请日：2019-04-01

申请人： DUPONT ELECTRONICS, INC.

发明人： Michael Henry Howard, Jr. ,  Nora Sabina Radu ,  Greg A. Hostetler ,  Chai Kit Ngai ,  Brian C. Auman ,  John Donald Summers

IPC分类号： C08G73/10 ,  C08J5/18 ,  C09D179/08 ,  G02F1/1333

CPC分类号： C08G73/1042 ,  C08G73/1085 ,  C08J5/18 ,  C09D179/08 ,  G02F1/133305 ,  C08J2379/08 ,  C09K2323/06

摘要： Disclosed is a polyimide having a repeat unit structure of Formula III




In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II





In Formula II: R1 is H, halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R2 is halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R3 and R4 are the same or different and are alkyl, fluoroalkyl, or silyl; x and y are the same or different and are an integer from 0-2; and * indicates a point of attachment.

公开(公告)号：US20240294710A1

公开(公告)日：2024-09-05

申请号：US18044100

申请日：2022-05-17

申请人： LG CHEM, LTD.

发明人： Mi Eun KANG ,  Ye Ji HONG ,  Chan Hyo PARK ,  Hangah PARK ,  Min Wook LEE

IPC分类号： C08G73/10 ,  C08J5/18 ,  C08K5/523 ,  H10K77/10

CPC分类号： C08G73/1071 ,  C08G73/1032 ,  C08G73/1042 ,  C08G73/1067 ,  C08J5/18 ,  C08K5/523 ,  H10K77/111 ,  C08J2379/08

摘要： The present disclosure relates to a polyimide-based resin film in which a refractive index difference (Δn) obtained by Equation 1 is 0.0068 or less, and a yellow index at a thickness of 10 μm is 5.5 or less, and a substrate for display device, and an optical device using the same.

公开(公告)号：US20240288770A1

公开(公告)日：2024-08-29

申请号：US18609813

申请日：2024-03-19

申请人： PROMERUS, LLC

发明人： PRAMOD KANDANARACHCHI

IPC分类号： G03F7/038 ,  C08G73/10 ,  C08G73/12 ,  G03F7/004

CPC分类号： G03F7/0387 ,  C08G73/101 ,  C08G73/1025 ,  C08G73/1032 ,  C08G73/1085 ,  C08G73/122 ,  C08G73/124 ,  G03F7/0045

摘要： Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

公开(公告)号：US12071533B2

公开(公告)日：2024-08-27

申请号：US16606570

申请日：2018-04-13

申请人： Ares Materials Inc.

发明人： Radu Reit ,  Adrian Avendano-Bolivar ,  David Arreaga-Salas

IPC分类号： C08G73/10 ,  B05D3/06 ,  B05D3/12 ,  C08L101/12 ,  G02F1/1333 ,  G03F7/09 ,  H01L27/12

CPC分类号： C08L101/12 ,  B05D3/067 ,  B05D3/12 ,  G02F1/133305 ,  G03F7/09 ,  H01L27/1218 ,  H01L27/1262 ,  C08G73/1028 ,  C08L2203/20

摘要： Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.

公开(公告)号：US20240279398A1

公开(公告)日：2024-08-22

申请号：US18495751

申请日：2023-10-27

申请人： SK microworks Co., Ltd.

发明人： Han Jun KIM ,  Jin Yong LEE ,  Jin Woo LEE

IPC分类号： C08G73/10 ,  C08G73/14

CPC分类号： C08G73/1028 ,  C08G73/14

摘要： The embodiments aim to provide a polyamide-imide-based film that has a TGA weight loss area value (TDA) of 0.01%·min/° C. or less and is excellent in mechanical properties, optical properties, and the suitability for post-processing, a process for preparing the same, and a cover window and a display device comprising the same.

公开(公告)号：US20240254286A1

公开(公告)日：2024-08-01

申请号：US18534022

申请日：2023-12-08

申请人： NexFlex Co., Ltd.

发明人： Hyuk Jun KIM ,  Dae Nyoun KIM ,  Yun Jeong JO ,  Ki Hoon KIM ,  Ra Mi LEE

IPC分类号： C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/10

CPC分类号： C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/1067 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2307/204 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08

摘要： A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1:




In Chemical Formula 1, m and n are mole fractions, and “m+n=1” “0.2≤m≤0.8” and “0.2≤n≤0.8” are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R1, R2, and R4 to R6 each independently include at least one of —H, —F, —CH3, —OCH3, —CF3, and —OCF3. R3 is an ester group and includes —COO— or —OOC—.