PHOTOCURABLE COMPOSITION WITH HIGH SILICON CONTENT

    公开(公告)号:US20240199816A1

    公开(公告)日:2024-06-20

    申请号:US18062374

    申请日:2022-12-06

    发明人: Fen WAN Weijun Liu

    摘要: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1)




    with R1, R2: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R3, R4: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R5: C1-C5-alkyl, aryl, alkylaryl; R6: -R5-X, or X, or —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt % based on the total weight of the photocurable composition.

    ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER, AND USE OF SAME

    公开(公告)号:US20210284888A1

    公开(公告)日:2021-09-16

    申请号:US17267351

    申请日:2019-08-13

    摘要: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

    MOISTURE-CURING RTV SILICONE COMPOSITION WITH HOMOGENEOUS DEEP-CURE

    公开(公告)号:US20210179904A1

    公开(公告)日:2021-06-17

    申请号:US17270792

    申请日:2019-08-23

    摘要: A moisture-curing, condensation-crosslinking silicone composition that can be used as elastic adhesives and sealants. The silicone composition shows homogeneous depth curing, such that it cures through even under movement without forming cracks. The silicone composition contains at least one polyorganosiloxane having Si(OR3)3 end groups, at least one condensation catalyst and at least one crosslinker having hydrolyzable radicals, characterized in that the polymer end groups Si(OR3) have a reaction rate in the crosslinking reaction that is at least equal to and preferably higher than the hydrolyzable radicals of the at least one crosslinker.