公开(公告)号：US20230056560A1

公开(公告)日：2023-02-23

申请号：US17890823

申请日：2022-08-18

申请人： KNAUF INSULATION SPRL ,  KNAUF INSULATION, INC.

发明人： Carl Hampson ,  Gareth JONES

IPC分类号： C08B37/00 ,  C08K3/20 ,  B01F23/231

摘要： The present invention relates to a water-soluble binder composition comprising at least one carbohydrate component and at least one carbon dioxide reaction product comprising at least the reaction product(s) of carbon dioxide with at least one nitrogen-containing compound. It further relates to a method of its manufacture, its use, a method of manufacturing a collection of matter bound by said polymeric binder, as well as a binder solution or dispersion comprising said binder composition.

公开(公告)号：US20230026615A1

公开(公告)日：2023-01-26

申请号：US17812354

申请日：2022-07-13

申请人： Duke University

发明人： Teng Su ,  Jennifer West ,  Neica Joseph

IPC分类号： C08F2/16 ,  C08F22/10 ,  C08J3/075 ,  C12P7/625 ,  C08K3/20 ,  C08K5/00 ,  C08K5/3417

摘要： The present disclosure describes, in part, an enzyme-mediated radical initiating system and methods of using the system to produce polymers, including polymeric hydrogels, at ambient conditions.

公开(公告)号：US20220306769A1

公开(公告)日：2022-09-29

申请号：US17721298

申请日：2022-04-14

申请人： KNAUF INSULATION SPRL

发明人： Carl Hampson ,  Ferdous KHAN

IPC分类号： C08B31/00 ,  C08J5/04 ,  C08L33/00 ,  C09J4/06 ,  C08L3/04 ,  B27N3/00 ,  C08J3/28 ,  C08K3/20 ,  C08K3/30 ,  C08K5/23 ,  C08L33/02 ,  C08L33/08 ,  C08L33/26

摘要： The present invention relates to new aqueous curable binder compositions comprising a carbohydrate compound, a first cross linker and a second cross linker different from the first capable of undergoing radical polymerization and possibly a free radical initiator.

公开(公告)号：US20220098335A1

公开(公告)日：2022-03-31

申请号：US17549862

申请日：2021-12-13

申请人： Mighty Buildings, Inc.

发明人： Vasily Korshikov ,  Anna Trushina ,  Dmitry Starodubtsev ,  Slava Solonitsyn ,  Igor Kovalev ,  Aleksei Dubov ,  Anna Ivanova

IPC分类号： C08F20/32 ,  C08F2/50 ,  C08K3/38 ,  C08K5/5397 ,  C08K5/14 ,  C08K3/20

摘要： A formulation for a photopolymer composite material for a 3D printing system includes an acrylate monomer or an acrylate oligomer, an inorganic hydrate, a reinforcing filler, a co-initiator, a thermal initiator, and an ultraviolet (UV) initiator. In the formulation the acrylate monomer or the acrylate oligomer may be between about 10.0-30.0 w % of the formulation. The thermal initiator may be between about 0.001-0.05 w %, the co-initiator may be between about 0.001-0.05 w %, and the UV initiator may be between about 0.001-0.2 w % of the formulation. A method of generating a formulation of a photopolymer composite material for use in a 3D printing system includes using an acrylate monomer or an acrylate oligomer, an inorganic hydrate, a reinforcing filler, a co-initiator, a thermal initiator, and an ultraviolet (UV) initiator.

公开(公告)号：US11236259B2

公开(公告)日：2022-02-01

申请号：US16768193

申请日：2018-12-03

申请人： SEKISUI POLYMATECH CO., LTD.

发明人： Gaku Kitada ,  Keita Ishida

IPC分类号： C09K5/14 ,  C08K3/08 ,  C08K3/22 ,  C08L83/00 ,  C08K3/10 ,  C08K3/14 ,  C08K3/18 ,  C08K3/20 ,  C08K3/34 ,  C08K13/00

摘要： The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.

公开(公告)号：US20220017783A1

公开(公告)日：2022-01-20

申请号：US17490431

申请日：2021-09-30

申请人： Showa Denko Materials Co., Ltd.

发明人： Tomohiro IWANO ,  Takaaki MATSUMOTO ,  Tomoyasu HASEGAWA

IPC分类号： C09G1/02 ,  C08K3/20 ,  C08K5/09 ,  C08K5/17 ,  C08L71/02 ,  H01L21/304 ,  H01L21/3105 ,  C09K13/00 ,  H01L21/306

摘要： A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.

公开(公告)号：US20210371660A1

公开(公告)日：2021-12-02

申请号：US17290382

申请日：2019-11-05

申请人： SEKISUI POLYMATECH CO., LTD.

发明人： Keita ISHIDA ,  Gaku KITADA

IPC分类号： C08L83/04 ,  C09K5/14 ,  C08K3/20

摘要： There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.

公开(公告)号：US11155720B2

公开(公告)日：2021-10-26

申请号：US16491177

申请日：2018-03-06

申请人： Wisespray International Ltd

发明人： Ilkka Parviainen

IPC分类号： C09K3/30 ,  C09D5/02 ,  B65D83/14 ,  C08K3/20 ,  C09D167/08 ,  C09D133/00 ,  C09D175/06 ,  C08K3/22

摘要： The invention relates to a water based paint composition to be used in a pressurized and sealed aerosol can and which composition contains A) up to 24% w/w of propellant gas which is dimethyl ether (DME); B) up to 76% w/w of coating material, consisting nonvolatile content in the range of 65-95% w/w and volatile content in the range of 5-35% w/w; —which volatile content contains water up to 0-100% w/w and additives, co-solvents and dispersing agents which comprise altogether of 0-9% w/w of volatile liquids, having 0-10% w/w preferably less than 5% w/w of volatile organic compounds (VOC) provided that the aggregate amount of dimethyl ether (DME) and the volatile organic compounds (VOC) in volatile liquids is such that VOC concentration is below 186 g/l (responding about 24% w/w, calculated as DME). In the present invention the nonvolatile content comprises color pigments and possible fillers in the range of 0-30% w/w, polyurethane modified alkyd resin or alkyd resin in the range of 25-99% w/w preferably in the range of 35-90% w/w and additives up to 9% w/w, which resin is present as an emulsified dispersion in water miscible solvent comprising water and dimethyl ether (DME).

公开(公告)号：US11154054B2

公开(公告)日：2021-10-26

申请号：US16335239

申请日：2017-09-19

申请人： AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

发明人： Yugen Zhang ,  Guangshun Yi

IPC分类号： A01N25/26 ,  A01N59/16 ,  C09D5/14 ,  C09D7/61 ,  A01N59/20 ,  C09D7/40 ,  C09D7/62 ,  B82Y30/00 ,  C08K3/22 ,  C08K3/20

摘要： The present disclosure relates to an antimicrobial coating on a surface, a method for preparing and uses of the same. In particular it relates to a process for preparing an antimicrobial coating on a surface, the process comprising the steps of: a) providing a surface; b) coating a metal oxide or a metal hydroxide on the surface in the presence of a solvent in a hydrothermal synthesis step to form a coated surface having a plurality of nanostructures; c) optionally drying the coated surface, wherein said nanostructure is preferably in nanopillar structure. The coating of the present application exhibits excellent antimicrobial activity against different types of microorganism, such as bacteria and yeast. The nanostructures are able to exert stress to the microorganism, and therefore controlling or killing them.

公开(公告)号：US20210130561A1

公开(公告)日：2021-05-06

申请号：US16480851

申请日：2018-01-16

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Akihiro ENDO ,  Yasuhisa ISHIHARA ,  Hisaharu YAMAGUCHI ,  Masahiro MOTEKI

IPC分类号： C08J7/04 ,  B29C35/02 ,  C08J7/044 ,  C08K3/20 ,  H01L23/373

摘要： A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.