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公开(公告)号:US20240360347A1
公开(公告)日:2024-10-31
申请号:US18574302
申请日:2022-06-16
发明人: Akira IWATA , Daijiro CHIBA
IPC分类号: C09J11/08 , C08F220/14 , C09J135/04
CPC分类号: C09J11/08 , C08F220/14 , C09J135/04 , C08F2800/20
摘要: An object of the present disclosure is to provide a thickener that can be suitably used as a thickener for adhesives and is excellent in long-term stability when it is used in the application of a thickener for adhesives, particularly when used in cyanoacrylate-based adhesives. A thickener contains a methacrylic resin having an Mw of 85,000 to 1,500,000, wherein η1 and η2 satisfy 1.0≤η2/η1≤5.0, where η1 is a viscosity (Pa·s) of a solution of the methacrylic resin in ethyl cyanoacrylate at 25° C., and η2 is the viscosity (Pa·s) of the solution at 25° C. after cooling when the solution is allowed to stand at 60° C. for 48 hours to cool to 25° C. (where the concentration of the methacrylic resin in the solution is 20 mass %, 10 mass %, or 7 mass %, depending on the Mw of the methacrylic resin).
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公开(公告)号:US20240360344A1
公开(公告)日:2024-10-31
申请号:US18645170
申请日:2024-04-24
申请人: tesa SE
IPC分类号: C09J7/38 , C09J133/14
CPC分类号: C09J7/385 , C09J133/14 , C09J2301/302 , C09J2433/00 , C09J2475/00
摘要: A chemical-resistant, reactive pressure-sensitive adhesive tape having a reactive adhesive including a radically polymerizable monomer or oligomer, an initiator system for curing the at least one radically polymerizable monomer or oligomer, and a poly(meth)acrylate which contains a fraction of at least 15 percent by weight of monomers with aromatic radicals.
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公开(公告)号:US20240360343A1
公开(公告)日:2024-10-31
申请号:US18643234
申请日:2024-04-23
申请人: tesa SE
发明人: Stefan Kramp , Michael Egger
IPC分类号: C09J7/38 , C09J7/26 , C09J11/08 , C09J133/10
CPC分类号: C09J7/385 , C09J7/26 , C09J11/08 , C09J133/10 , C09J2301/1242 , C09J2301/302 , C09J2301/312 , C09J2301/416 , C09J2301/50 , C09J2423/00 , C09J2433/00
摘要: A reactive pressure-sensitive adhesive element that includes: i) a carrier layer; ii) a first adhesive layer arranged on a first surface of the carrier layer that comprises a first UV-curable pressure-sensitive adhesive; and iii) a second adhesive layer arranged on a second surface of the carrier layer facing away from the first surface, wherein the second adhesive layer comprises a second UV-curable pressure-sensitive adhesive. Each of the first and second UV-curable pressure-sensitive adhesives, based on a mass of the respective pressure-sensitive adhesive, comprises: x) one or more poly (meth) acrylate compounds in a combined mass fraction from 35% to 85%; y) one or more polymerizable epoxy compounds in a combined mass fraction from 10% to 50%; and z) one or more photoinitiators in a combined mass fraction from 0.1% to 5%. Further, the carrier layer comprises a foam carrier, the foam carrier comprising one or more polyolefins.
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4.
公开(公告)号:US20240360342A1
公开(公告)日:2024-10-31
申请号:US18768724
申请日:2024-07-10
CPC分类号: C09J7/30 , C09J7/29 , C09J7/40 , C09J2301/122 , C09J2301/124 , C09J2301/30 , C09J2433/00 , C09J2483/00
摘要: Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.
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公开(公告)号:US12129407B2
公开(公告)日:2024-10-29
申请号:US17413087
申请日:2019-12-05
IPC分类号: B32B41/00 , C09J7/29 , C09J7/38 , C09J183/06
CPC分类号: C09J183/06 , C09J7/29 , C09J7/38 , C09J2203/326 , C09J2301/302
摘要: Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use. The adhesive composition comprises: (A) a chain-like organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups only at the terminals of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain; (C) a resinous organopolysiloxane; and (D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the ends of the molecular chain, and having three or more aliphatic unsaturated carbon-carbon bond groups in the molecule.
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公开(公告)号:US12129102B1
公开(公告)日:2024-10-29
申请号:US18604575
申请日:2024-03-14
发明人: Deran Lyu , Haijiang Lan , Chao Xu , Long Xie , Wenxiu Wang
CPC分类号: B65D81/3897 , B32B7/12 , B32B29/02 , B65D81/022 , C09J11/00 , C09J175/04 , B32B2250/03 , B32B2250/40 , B32B2255/12 , B32B2255/26 , B32B2307/7265 , B32B2553/02
摘要: A high-strength packaging bag with effects of heat preservation and watertightness is made of a composite paper. The composite paper includes an outer waterproof layer, an outer paper layer, a first adhesive layer, a heat-insulation and cushioning layer, a second adhesive layer, an inner paper layer and an inner waterproof layer arranged in sequence; and the first adhesive layer and the second adhesive layer are both elastic adhesive layers.
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公开(公告)号:US12128801B2
公开(公告)日:2024-10-29
申请号:US18186770
申请日:2023-03-20
发明人: Hye Rin Choi , Jun Ho Song , Jae Hong Woo , Seung Keon Woo
IPC分类号: B60N2/58 , A44B18/00 , B32B5/02 , B32B5/18 , B32B5/24 , B32B5/26 , B32B37/06 , B32B37/08 , B32B37/10 , B32B37/12 , B60N2/70 , B60N2/72 , C09J5/06 , C09J7/10 , C09J7/30 , C09J7/35 , C08K3/34
CPC分类号: B60N2/5891 , A44B18/0073 , B32B5/022 , B32B5/18 , B32B5/245 , B32B5/265 , B32B37/06 , B32B37/08 , B32B37/10 , B32B37/1207 , B60N2/5833 , B60N2/5875 , B60N2/7017 , B60N2/72 , C09J5/06 , C09J7/10 , C09J7/30 , C09J7/35 , A44B18/00 , B32B2037/1215 , B32B2250/02 , B32B2255/26 , B32B2262/0284 , B32B2305/18 , B32B2307/748 , B32B2309/02 , B32B2605/003 , B32B2605/08 , C08K3/346 , C09J2203/358 , C09J2301/408 , C09J2400/10 , C09J2467/00 , C09J2475/00
摘要: Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.
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8.
公开(公告)号:US12128458B1
公开(公告)日:2024-10-29
申请号:US17960333
申请日:2022-10-05
IPC分类号: B08B7/00 , B08B6/00 , B08B7/04 , C09J9/02 , C09J11/04 , C09J133/02 , C09J143/04 , C09J165/00 , C09J179/02
CPC分类号: B08B7/0028 , B08B6/00 , B08B7/04 , C09J9/02 , C09J11/04 , C09J133/02 , C09J143/04 , C09J165/00 , C09J179/02 , C09J2400/10
摘要: A method for the removal of paint from a surface using a molecular adhesive comprising: applying an anionic coating to the paint to be removed; placing a pulling medium in contact with said anionic coating; said pulling medium comprising a substrate having a surface comprising a conductive polymer nanotube array; applying an electric potential across said pulling medium and said anionic coating to facilitate ionic bonding between said conductive polymer nanotube array and said anionic coating; and applying force to said pulling medium to pull away said pulling medium from said surface and thereby removing the paint which is bonded to said anionic coating which is bonded to said conductive polymer nanotube array.
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9.
公开(公告)号:US20240352295A1
公开(公告)日:2024-10-24
申请号:US18635583
申请日:2024-04-15
IPC分类号: C09J181/04 , A61L24/04 , C08G75/14 , C08G75/26
CPC分类号: C09J181/04 , A61L24/046 , C08G75/14 , C08G75/26
摘要: Adhesive compositions for medical and non-medical uses are provided. The adhesive compositions can include cyclic disulfide monomers, oligomers of reactions between the cyclic disulfides, polymers of the cyclic disulfides, solid articles formed from the polymers, and any combination thereof. Methods of making, using, and recycling the adhesive compositions are provided, including use of the adhesive compositions on a variety of substrates that include biological tissue; biomaterials, including synthetics and natural such as bone, wood, and cellulosics; metals and alloys; polymers, plastics, and rubbers; ceramics; composites; and, any combination of these materials. The adhesives can adhere to substrates in a variety of environmental conditions that include ambient atmospheric conditions, wet conditions that include adhering materials underwater, and in a wide variety of temperatures and pressures, such as those temperatures and pressures found in medical environments, including in living tissue, as well as many residential, commercial, industrial, and manufacturing environments.
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公开(公告)号:US20240352289A1
公开(公告)日:2024-10-24
申请号:US18756411
申请日:2024-06-27
发明人: Minoru MORITA , Shunya OHBUCHI
IPC分类号: C09J163/00 , C09J5/06 , C09J11/04 , C09J11/06 , H01L21/683
CPC分类号: C09J163/00 , C09J5/06 , C09J11/04 , C09J11/06 , H01L21/6836
摘要: A thermally conductive film adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), a polyhedral alumina filler (D), and a silane coupling agent (E), wherein a percentage of the polyhedral alumina filler (D) to a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C), the polyhedral alumina filler (D), and the silane coupling agent (E) is from 20 to 70 vol %, and wherein a blending multiple of the silane coupling agent is from 1.0 to 10;
a film adhesive using the composition;
a semiconductor package; and
a producing method thereof.
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