公开(公告)号：US20240352289A1

公开(公告)日：2024-10-24

申请号：US18756411

申请日：2024-06-27

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Minoru MORITA ,  Shunya OHBUCHI

IPC分类号： C09J163/00 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  H01L21/683

CPC分类号： C09J163/00 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  H01L21/6836

摘要： A thermally conductive film adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), a polyhedral alumina filler (D), and a silane coupling agent (E), wherein a percentage of the polyhedral alumina filler (D) to a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C), the polyhedral alumina filler (D), and the silane coupling agent (E) is from 20 to 70 vol %, and wherein a blending multiple of the silane coupling agent is from 1.0 to 10;



a film adhesive using the composition;
a semiconductor package; and
a producing method thereof.

公开(公告)号：US20240343952A1

公开(公告)日：2024-10-17

申请号：US18579545

申请日：2022-08-19

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Adam O. Moughton ,  Kathleen S. Shafer ,  Andrew Satrijo ,  Michael J. Maher ,  Deborah K. Schneiderman

IPC分类号： C09J133/08 ,  C08L33/08 ,  C08L63/00 ,  C09J163/00

CPC分类号： C09J133/08 ,  C08L33/08 ,  C08L63/00 ,  C09J163/00

摘要： Curable and cured compositions as well as articles that contain the curable or cured compositions are provided. The curable composition comprises (a) a (meth)acrylic-based multiblock copolymer, (b) a random (meth)acylate copolymer comprising a monomeric unit having a pendant poly(alkylene oxide) group, wherein the monomeric unit having the pendant poly(alkylene oxide) group has a number average molecular weight of at least 300 Daltons, (c) an epoxy resin, and (d) a cationic photoinitiator. Articles containing the curable composition can be die-cut and can retain their dimensions with minimal oozing when stored under ambient conditions.

公开(公告)号：US20240336051A1

公开(公告)日：2024-10-10

申请号：US18745644

申请日：2024-06-17

申请人： Rapiscan Systems, Inc.

发明人： Evgeniy Kuksin ,  Neal Hartsough ,  William C. Barber

IPC分类号： B32B37/12 ,  B32B3/26 ,  B32B7/14 ,  B32B37/18 ,  C09J5/06 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J183/04 ,  H01L23/00 ,  H01L27/146

CPC分类号： B32B37/1292 ,  B32B3/266 ,  B32B7/14 ,  B32B37/1207 ,  B32B37/18 ,  C09J5/06 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J183/04 ,  H01L24/29 ,  H01L24/83 ,  H01L27/1463 ,  H01L27/14683 ,  B32B2305/72 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2309/025 ,  B32B2457/14 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2483/00 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/83862

摘要： A method of attaching a detector onto a substrate that has an array of electrically conducting pads is provided, together with the resulting detector assembly. The method includes pouring a non-conductive adhesive material over a substrate surface, allowing the adhesive to settle between the conducting pads to form dams around the conducting pads, applying a conductive adhesive material onto the conducting pads of the substrate, and placing a surface of the detector on the substrate surface over the conducting and non-conducting adhesives to thereby attach the surface of the detector to the surface of the substrate.

公开(公告)号：US20240327688A1

公开(公告)日：2024-10-03

申请号：US18617769

申请日：2024-03-27

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Naoyuki KUSHIHARA ,  Kazuaki SUMITA ,  Akira YAJIMA

IPC分类号： C09J163/00 ,  C08K3/36 ,  C08K5/00 ,  C08K5/3492 ,  C08K9/10 ,  C08L63/00

CPC分类号： C09J163/00 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/3492 ,  C08K9/10 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/05 ,  C08L2312/04 ,  C09J2463/00

摘要： One of the objects of the present invention is to provide an epoxy resin composition that has excellent curability and storage stability, and that gives a cured product with excellent adhesive strength. The present invention provides an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin in a form of liquid at 25° C., having, per molecule, one or more functional groups having an aliphatic carbon-carbon double bond, (C) a microcapsule-type curing accelerator, (D) an imidazole compound having a triazine ring, and (E) an inorganic filler.

公开(公告)号：US12098653B1

公开(公告)日：2024-09-24

申请号：US18299478

申请日：2023-04-12

申请人： RTX CORPORATION

发明人： Xiaomei Fang ,  John Harner ,  David J. Mathiau, Jr. ,  William R. Graves ,  James O. Hansen

IPC分类号： F01D5/28 ,  C09J163/00 ,  C09J175/04

CPC分类号： F01D5/288 ,  C09J163/00 ,  C09J175/04 ,  F05B2230/23 ,  F05B2230/90 ,  F05B2280/6011

摘要： Disclosed herein is a blade for a turbine comprising a blade cover; a blade body; and a layer of adhesive disposed between the blade cover and the blade body; where the layer of adhesive comprises a first adhesive region and a second adhesive region; where the first adhesive region comprises an adhesive that is chemically different from an adhesive used in the second adhesive region.

公开(公告)号：US12098306B2

公开(公告)日：2024-09-24

申请号：US17262431

申请日：2019-07-25

申请人： LG Chem, Ltd.

发明人： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC分类号： C09J163/00 ,  B32B27/38 ,  B32B27/40 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/48 ,  C08G18/67 ,  C08G18/75 ,  C08G59/24 ,  C08G59/40 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J163/04 ,  C09J175/08

CPC分类号： C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/4825 ,  C08G18/6715 ,  C08G18/755 ,  C08G59/245 ,  C08G59/4021 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2205/18 ,  C08L2207/53 ,  C09J2301/30 ,  C09J2301/414 ,  C09J2451/00 ,  C09J2463/00 ,  C09J2475/00

摘要： An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US20240301176A1

公开(公告)日：2024-09-12

申请号：US18268741

申请日：2021-12-14

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Kenzo ONIZUKA ,  Naoya KAMIMURA ,  Masanori YOSHIDA

IPC分类号： C08K9/10 ,  C08K3/013 ,  C08K5/05 ,  C09J163/00 ,  H01L23/498 ,  H05K3/46

CPC分类号： C08K9/10 ,  C08K3/013 ,  C08K5/05 ,  C09J163/00 ,  C08K2201/003 ,  C08K2201/006 ,  H01L23/49894 ,  H05K3/4661 ,  H05K2203/068 ,  H05K2203/107 ,  H05K2203/1461

摘要： An epoxy resin composition comprising an epoxy resin (A) and a latent curing agent (B), wherein the latent curing agent (B) is solid at 25° C.

公开(公告)号：US20240294812A1

公开(公告)日：2024-09-05

申请号：US18571940

申请日：2022-04-28

申请人： SIKA JAPAN LTD. ,  NIPPON STEEL CORPORATION

发明人： Kazunori ISHIKAWA ,  Tsubasa ITO ,  Takashi ARAMAKI ,  Hiroshi OISHI

IPC分类号： C09J163/00 ,  C09J11/06 ,  C09J11/08

CPC分类号： C09J163/00 ,  C09J11/06 ,  C09J11/08

摘要： An adhesive composition is provided for laminating an electromagnetic steel sheet, including an epoxy resin (AA) containing an epoxy resin (A) having equal to or more than 3 epoxy groups in one molecule, a phenoxy resin (B) having a glass transition temperature exceeding 120° C. in an uncured state in differential scanning calorimetry, and an amine-based latent curing agent (C), wherein the epoxy resin (A) contains an epoxy resin having a softening temperature equal to or higher than 60° C., a content of the phenoxy resin (B) is 20 to 80 parts by mass based on 100 parts by mass of the epoxy resin (AA), and a glass transition temperature of the resulting adhesive cured product in differential scanning calorimetry exceeds 160° C.

公开(公告)号：US20240287360A1

公开(公告)日：2024-08-29

申请号：US18649929

申请日：2024-04-29

申请人： AJINOMOTO CO., INC.

发明人： Kenji KAWAI

IPC分类号： C09J163/00 ,  B32B5/02 ,  B32B15/09 ,  B32B27/12 ,  B32B27/36 ,  C08L63/00 ,  C09J7/25 ,  C09J7/29 ,  C09J7/35 ,  H05K1/03

CPC分类号： C09J163/00 ,  B32B5/02 ,  B32B15/09 ,  B32B27/12 ,  B32B27/36 ,  C08L63/00 ,  C09J7/255 ,  C09J7/29 ,  C09J7/35 ,  H05K1/0326 ,  H05K1/0366 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2457/08 ,  C08L2203/20 ,  C09J2400/163 ,  C09J2463/00 ,  C09J2467/006

摘要： Resin compositions including: (A) a naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and (B) a curing agent, in which (B) the curing agent includes an active ester type curing agent are useful for preparing cured products, sheet lamination materials, resin sheets, printed wiring boards, and semiconductor devices, and for methods for producing printed wiring boards or semiconductor devices.

公开(公告)号：US12049574B2

公开(公告)日：2024-07-30

申请号：US17697745

申请日：2022-03-17

申请人： PPG Industries Ohio, Inc.

发明人： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa G. Ragunathan

IPC分类号： C09J163/00 ,  B32B27/38 ,  B82Y30/00 ,  C08G59/06 ,  C08G59/18 ,  C08G59/20 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/56 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C08K3/04

CPC分类号： C09J163/00 ,  B82Y30/00 ,  C08G59/066 ,  C08G59/182 ,  C08G59/184 ,  C08G59/4276 ,  C08G59/5006 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C08K3/04 ,  C08L2205/02 ,  C09J2463/00 ,  C08L63/00 ,  C08L21/00 ,  C08L63/00

摘要： Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.