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公开(公告)号：US11591709B2
公开(公告)日：2023-02-28
申请号：US16903615
申请日：2020-06-17
申请人： EBARA CORPORATION
发明人： Naoto Takahashi
摘要： There is provided an apparatus for plating a substrate as an object to be plated. The apparatus comprises an anode and a thief tunnel arranged to be located between the substrate and the anode when the substrate is placed to be opposed to the anode. The thief tunnel comprises a body placed away from the substrate and provided with an opening; a plurality of auxiliary electrodes provided in or to the body; and an ion exchange membrane configured to protect the auxiliary electrodes from a plating solution. The plurality of auxiliary electrodes are arranged along a circumference of the opening. At least one of the auxiliary electrodes is configured such that a voltage to be applied to the at least one of the auxiliary electrodes is controlled independently of a voltage to be applied to one or more auxiliary electrodes other than the at least one of the auxiliary electrodes.
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公开(公告)号：US20230055027A1
公开(公告)日：2023-02-23
申请号：US17737332
申请日：2022-05-05
申请人： Prerna Goradia
发明人： Prerna Goradia
摘要： The present disclosure provides a method and system for producing antimicrobial compositions comprising transition metal ions which are generated electrolytically in aqueous solution; chelating agent and excipients; wherein the said ionic species thereby impart stability and longer shelf life and long-term efficacy. Owing to the neutral pH, colorless, odorless, tasteless, non-caustic, non-corrosive nature, the composition of example embodiments shall be used as surface disinfectant and food contact sanitizer and provides an unparalleled combination of high efficacy and low toxicity with instant kill and long-term efficacy. The specific combination of certain metals provides the ability to be extremely broad spectrum and thus works against virus, bacteria, fungi, mold, mildew and antibiotic resistant species as well.
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公开(公告)号：US11466378B2
公开(公告)日：2022-10-11
申请号：US16732099
申请日：2019-12-31
申请人： LG Display Co., Ltd.
发明人： Gotae Kim , ByeongSun Yoo , ByungChul Ahn , WooChan Kim , JuYoung Jeong , SangCheol Moon , Wook Kim , Changjun Choi
摘要： Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.
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公开(公告)号：US20220307153A1
公开(公告)日：2022-09-29
申请号：US17616811
申请日：2020-05-28
申请人： EBARA CORPORATION
发明人： Hiroyuki Kanda , Hironari Ikeda , Masaaki Kimura , Mizuki Nagai
摘要： Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.
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公开(公告)号：US11414772B2
公开(公告)日：2022-08-16
申请号：US17251870
申请日：2019-06-14
申请人： Alberto Todescan
发明人： Alberto Todescan
IPC分类号： C25D3/38 , C25D5/36 , C25D5/00 , C25D5/10 , C25D5/12 , C25D5/18 , C25D3/12 , C25D7/06 , C25D17/10 , C25D21/12
摘要： Described is a cathodic treatment for the electrodeposition of a metal layer securely adherent to the surface of stainless steel objects in an electrolytic bath comprising one or more metals belonging exclusively to the groups from 3 to 12 of the periodic table, excluding the elements nickel, cobalt, cadmium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and rhenium, and methanesulfonic acid with a concentration of between 100 and 400 g/l.
An object of the invention is also a process for applying a metal layer securely adherent to the surface of stainless steel objects, comprising a cathodic treatment as described above.
Moreover, the invention further relates to an object comprising stainless steel equipped with a covering obtained by means of a process of the type described.-
公开(公告)号：US20220235481A1
公开(公告)日：2022-07-28
申请号：US17158962
申请日：2021-01-26
摘要： The slow speed of conventional selective electroplating and L-PED (and further requirement of a series of masks in the case of selective electroplating) necessary to generate a metallic three-dimensional object makes conventional selective electroplating and L-PED not viable for mass manufacturing metallic three-dimensional objects. The presently disclosed technology generally utilizes electroplating and L-PED technologies with a screen electroplating process. The screen electroplating process disclosed herein is capable of achieving a faster throughput and a lower workpiece temperature than traditional 3D printing processes can provide, particularly traditional metal 3D printing processes. As a result, the presently disclosed screen electroplating process is able to achieve much faster results in printing a complex three-dimensional metallic structure using electroplating.
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公开(公告)号：US20220205122A1
公开(公告)日：2022-06-30
申请号：US17260090
申请日：2019-08-20
发明人： Sascha Berger , Klaus Bronder , Mario Tomazzoni , Uwe Manz
IPC分类号： C25D3/46 , C25D21/12 , C25D17/10 , C07D233/74 , C25D3/64
摘要： The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.
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公开(公告)号：US20220190562A1
公开(公告)日：2022-06-16
申请号：US17442430
申请日：2020-03-18
申请人： Robert Bosch GmbH
IPC分类号： H01T21/02 , C25F1/06 , C23G1/19 , C23G1/08 , C25D5/36 , C25D7/00 , C25D7/04 , C25D17/08 , C25D17/10
摘要： A pretreatment method for pretreating components, which are each formed of at least two different materials, prior to a coating process. The pretreatment method includes the steps: alkaline degreasing; chemical pickling in a first pickling medium; anodic pickling in a second pickling medium; and cathodic degreasing.
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公开(公告)号：US20220162764A1
公开(公告)日：2022-05-26
申请号：US17437056
申请日：2020-08-03
申请人： CHANGZHOU UNIVERSITY
发明人： Wei WEI , Feilong JIA , Fuqiang CHU , Kunxia WEI , Qingbo DU , Jing HU
摘要： A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.
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公开(公告)号：US20220154362A1
公开(公告)日：2022-05-19
申请号：US17523591
申请日：2021-11-10
发明人： Akira KATO , Haruki KONDOH , Soma HIGASHIKOZONO
摘要： A film formation apparatus for forming a metal film includes an anode, a solid electrolyte membrane disposed between the anode and a substrate that serves as a cathode, a power supply device that applies a voltage between the anode and the cathode, a solution container that contains a solution between the anode and the solid electrolyte membrane, the solution containing metal ions, and a pressure device that pressurizes the solid electrolyte membrane to the cathode side with a fluid pressure of the solution. The film formation apparatus includes an auxiliary cathode disposed in a peripheral area of the film formation region when the surface of the substrate is viewed in plain view, the auxiliary cathode having an electric potential lower than an electric potential of the anode.
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