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公开(公告)号：US11602076B2
公开(公告)日：2023-03-07
申请号：US16775395
申请日：2020-01-29
发明人： Tung-Yang Shieh
摘要： The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.
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2.发明授权公开(公告)号：US11291139B2
公开(公告)日：2022-03-29
申请号：US17010440
申请日：2020-09-02
申请人： Carbice Corporation
发明人： Baratunde Cola , Leonardo Prinzi , Craig Green
摘要： Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).
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公开(公告)号：US11022379B2
公开(公告)日：2021-06-01
申请号：US16372292
申请日：2019-04-01
申请人： Thermal Corp.
发明人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
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公开(公告)号：US10976115B2
公开(公告)日：2021-04-13
申请号：US16098672
申请日：2017-05-17
申请人： WIELAND-WERKE AG
发明人： Achim Gotterbarm , Ronald Lutz , Jean El Hajal , Manfred Knab
摘要： The invention relates to heat exchanger tube having a longitudinal tube axis; axially parallel or helically circumferential continuous fins are formed from the tube wall on the outer tube face and/or inner tube face, and continuous primary grooves are formed between adjacent fins; the fins have at least one structured zone on the outer tube face and/or inner tube face, said structured zone being provided with a plurality of projections which project from the surface an have a height such that the projections are separated by notches. According to the invention, the projections are arranged in groups which are periodically repeated along the extension of the fin. Furthermore, at least two notches between the projections within the group have a varying notch depth in a fin.
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公开(公告)号：US10808951B2
公开(公告)日：2020-10-20
申请号：US16083280
申请日：2017-02-14
摘要： Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a pre-cooler upstream and a recovery coil downstream of the evaporative cooler. Outdoor or scavenger air can be conditioned in the evaporative cooler such that the conditioned scavenger air can provide cooling to a cooling fluid circulating through the recovery coil. The reduced-temperature cooling fluid can provide liquid cooling or air cooling for an enclosed space (for example, a data center) or for one or more devices that are enclosed or open to the atmosphere. Given the design and arrangement of the pre-cooler, evaporative cooler and recovery coil in the plenum, the system can operate in multiple modes. The pre-cooler can be configured to circulate a cooling fluid to condition the scavenger air. The pre-cooler fluid circuit can be coupled or de-coupled from a process cooling fluid circuit.
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6.发明授权公开(公告)号：US10763191B1
公开(公告)日：2020-09-01
申请号：US16438271
申请日：2019-06-11
发明人： John Franz , Harvey Lunsman , Steven Dean
摘要： Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.
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公开(公告)号：US10746479B2
公开(公告)日：2020-08-18
申请号：US16034050
申请日：2018-07-12
IPC分类号： F28F7/00 , F28D15/04 , B33Y80/00 , B64G1/50 , H01L23/427 , B23K26/342 , B33Y10/00 , F28D21/00
摘要： A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
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公开(公告)号：US10684077B2
公开(公告)日：2020-06-16
申请号：US15568847
申请日：2016-04-21
申请人： HEXSOL ITALY SRL
发明人： Luca Zanardi , Fabiano Foglieni
摘要： A heat exchanger includes a pressurized shell and a tube bundle with exchanging tubes between flexible tubesheets. The flexible tubesheets are reciprocally interconnected by tie rods in a central zone of the flexible tubesheets which is devoid of exchanging tubes. The exchanging tubes in the tube bundle are arranged around the tie rods. The heat exchanger may further include conveying diaphragms arranged along the tube bundle. The conveying diaphragms may be shaped, alternately, as discs and rings.
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公开(公告)号：US10514214B2
公开(公告)日：2019-12-24
申请号：US15509910
申请日：2014-09-10
发明人： Graham John Baldwin
IPC分类号： F28F7/00 , F28F13/00 , H01L23/373 , H01L23/467
摘要： A heat transfer assembly for transferring heat from a heat generating electrical element and having a porous element having a portion configured to contact the heat generating element and a moveable diaphragm having a portion adjacent the porous element and where the diaphragm is moveable between an extended position towards the porous element and a retracted position away from the porous element.
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公开(公告)号：US10415895B2
公开(公告)日：2019-09-17
申请号：US15357794
申请日：2016-11-21
申请人： ABL IP Holding LLC
摘要： A heat sink comprising pin fins extending from a base plate of the heatsink. Some of the pin fins are angled outwardly towards an outer edge of the base plate such that the tips of some of the pin fins may extend beyond the outer edge of the base plate. The distance the outer pin fins extend beyond the outer edge of the base plate can correspond to a maximum diameter of the heatsink. The maximum diameter of the heatsink can be greater than the diameter of the base plate of the heatsink.
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