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    Measuring apparatus and method of wafer geometry
    3.
    发明授权
    Measuring apparatus and method of wafer geometry 有权

    公开(公告)号：US12072176B2

    公开(公告)日：2024-08-27

    申请号：US17561902

    申请日：2021-12-24

    申请人： Nanjing ZhongAn Semiconductor Equipment Ltd

    发明人： An Andrew Zeng

    IPC分类号： G01B11/24 ,  G01B11/06 ,  G01B11/30

    CPC分类号： G01B11/2441 ,  G01B11/06 ,  G01B11/306 ,  G01B2210/56

    摘要： Embodiments of the present application provide a measuring apparatus and method of a wafer geometry. The measuring apparatus of the wafer geometry includes: an air-bearing chuck, configured to generate an air cushion to keep a wafer to be measured floating up on a top surface of the air-bearing chuck; and an interferometer, disposed on one side, away from the air-bearing chuck, of the wafer, and configured to obtain an interference fringe image of a front surface of the wafer to measure a geometry of the wafer based on the interference fringe image. An air cushion is generated by utilizing an air-bearing chuck to keep a wafer to be measured floating up on a top surface of the air-bearing chuck, thereby avoiding damage of the original shape of the wafer or contamination of the wafer by a clamping tool, and further reducing errors during measurement.

    METHOD OF INSPECTING FLATNESS OF SUBSTRATE
    4.
    发明公开
    METHOD OF INSPECTING FLATNESS OF SUBSTRATE 审中-公开

    公开(公告)号：US20240230323A1

    公开(公告)日：2024-07-11

    申请号：US18615126

    申请日：2024-03-25

    申请人： Darwin Precisions Corporation

    发明人： Chin-Wang HSU ,  Wen-Yi LIN

    IPC分类号： G01B11/30 ,  G01B11/00

    CPC分类号： G01B11/30 ,  G01B11/002

    摘要： A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (Xi,Yi,Zi). By using a formula









    “
    D

    =



    ∑



    i
    =
    1


    N
    -
    1


    ⁢




    (


    X

    i
    +
    1


    -

    X
    i


    )

    2

    +


    (


    Y

    i
    +
    1


    -

    Y
    i


    )

    2

    +


    (


    Z

    i
    +
    1


    -

    Z
    i


    )

    2



    ”


    ,





    a first measurement length D is calculated. By using a formula “F=(D−S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

    Method for creating wafer shape data
    7.
    发明授权
    Method for creating wafer shape data 有权

    公开(公告)号：US11928178B2

    公开(公告)日：2024-03-12

    申请号：US17268326

    申请日：2019-08-01

    申请人： SHIN-ETSU HANDOTAI CO., LTD.

    发明人： Masato Ohnishi

    IPC分类号： G06F17/17 ,  G01B11/06 ,  G01B11/30 ,  G01B21/30 ,  G06F17/18

    CPC分类号： G06F17/17 ,  G01B11/06 ,  G01B21/30 ,  G06F17/18

    摘要： A wafer is prepared, and a thickness shape of the prepared wafer at each position in a radial direction is measured for each of a predetermined number of angles into which 360 degrees of a circumference around the center of the wafer are divided. The thickness shape obtained by a measuring machine for each angle is approximated with a sixth or higher order polynomial, and a function of the wafer thickness at the position in the radial direction is created. The thickness shape outputted by the measuring machine and a thickness shape outputted by the function are compared with each other, and an error on the entire surface of the wafer is confirmed to be not greater than a predetermined error. After the confirmation, information of the function for each angle is attached to the wafer as data representing the wafer shape and supplied to a user.

    OPTICAL TEST DEVICE
    8.
    发明公开
    OPTICAL TEST DEVICE 审中-公开

    公开(公告)号：US20240053144A1

    公开(公告)日：2024-02-15

    申请号：US18449609

    申请日：2023-08-14

    申请人： JENOPTIK Industrial Metrology Germany GmbH

    发明人： Otto BOUCKY

    IPC分类号： G01B11/30

    CPC分类号： G01B11/303

    摘要： An optical test device for testing flat test objects comprises a holder for the test object and two optical sensors for detecting the three-dimensional surface topography of the test object. According to the invention, the holder is formed at least in sections as a test standard and is disposed with respect to the sensors in such a way that the sensors scan the test object from opposite sides and also detect the holder as a test standard at least in sections during the detecting of the test object.