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公开(公告)号：US20230127926A1
公开(公告)日：2023-04-27
申请号：US17936382
申请日：2022-09-28
发明人： Shang-Yu CHUANG , Kuang-Hao CHIANG
摘要： A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.
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公开(公告)号：US20230088920A1
公开(公告)日：2023-03-23
申请号：US18051548
申请日：2022-11-01
发明人： NAOKI TAMBO , MASAKI FUJIKANE , KUNIHIKO NAKAMURA , KOSEI OHURA , YASUYUKI NAITO
摘要： An infrared sensor is provided with an infrared light receiver, a signal pathway, and a first member. The infrared light receiver has a structure in which at least two materials having different coefficients of thermal expansion are layered. The signal pathway includes a first signal pathway allowing passage of a driving signal to be applied to the infrared light receiver. The driving signal has a current value equal to or greater than a prescribed magnitude, and the infrared light receiver deforms in response to the application of the driving signal to the infrared light receiver, thereby at least a portion of the infrared light receiver contacting the first member.
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公开(公告)号：US20230054724A1
公开(公告)日：2023-02-23
申请号：US17889958
申请日：2022-08-17
申请人： TDK CORPORATION
发明人： Shinji HARA , Naoki OHTA , Kazuya MAEKAWA , Susumu AOKI , Maiko SHIROKAWA
摘要： An electromagnetic wave sensor 1 has electromagnetic wave absorbers disposed side by side in first and second directions, temperature detection portions held by the respective electromagnetic wave absorbers and sets of two arm portions connected to each electromagnetic wave absorber at two connection portions. In a plan view, the arm portions have two first extending portions extending from the connection portions in directions of which components in the second direction are opposite to each other, and two second extending portions extending from the first extending portions in directions of which components in the first direction are opposite to each other. Four sides of a rectangle circumscribing each of the electromagnetic wave absorbers with a smallest area are inclined with respect to the first direction in directions in which each electromagnetic wave absorber is away from the second extending portions with the connection portions as fulcrums.
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公开(公告)号：US20230054197A1
公开(公告)日：2023-02-23
申请号：US17981337
申请日：2022-11-04
申请人： FLIR Systems AB
IPC分类号： G01J5/00 , G01J5/0806 , G01J5/20 , G06T7/33 , G06T7/00 , G06V10/764 , G06T7/70 , H04N5/247
摘要： Systems and methods include an infrared camera configured to capture an infrared image of a scene, a visible-light camera configured to capture a visible-light image of the scene, and a logic device configured to simultaneously capture a pair of images of the scene comprising the infrared image of the scene and the visible image of the scene, align the pair of images so that a pixel location in one of the pair of images has a corresponding pixel location in the other image, classify the visible image, annotate the infrared image based, at least in part, on the classification of the visible image, and add the annotated infrared image to a neural network training dataset for use in training a neural network for infrared image classification. A beamsplitter is arranged to reflect a first image of the scene towards the infrared camera and pass through a second image of the scene to the visible-light camera, and a first blackbody is attached thereto and positioned in a field of view of the infrared camera.
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公开(公告)号：US20230020236A1
公开(公告)日：2023-01-19
申请号：US17955854
申请日：2022-09-29
申请人： PIXART IMAGING INC.
发明人： YI-CHANG CHANG , YEN-HSIN CHEN , CHI-CHIH SHEN
IPC分类号： H01L31/0203 , H01L27/146 , H01L31/0236 , G01J5/00 , G01J5/04 , G01J5/20
摘要： An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.
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公开(公告)号：US11508777B2
公开(公告)日：2022-11-22
申请号：US16969830
申请日：2018-09-26
发明人： Akie Yutani
IPC分类号： H01L27/146 , H04N5/33 , G01J1/02 , G01J5/02 , G01J5/20
摘要： An infrared solid state imaging device includes: a first PN junction diode has a first shortest length that is a shortest length from a first junction surface to a second junction surface; a PN junction diode has a second shortest length that is a shortest length from the second junction surface to a third junction surface, the second shortest length being different from the first shortest length; an insulating film serving as an element isolation region which establishes electrical isolation between a first region of the first PN junction diode and a fourth region of the second PN junction diode, and so on; and a metal wire provided on a second region of the first PN junction diode and a third region of the second PN junction diode, wherein the first PN junction diode and the second PN junction diode are connected in series.
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公开(公告)号：US20220364931A1
公开(公告)日：2022-11-17
申请号：US17731784
申请日：2022-04-28
申请人： NEC Corporation
发明人： Mayumi KOSAKA
IPC分类号： G01J5/20 , C01B32/174
摘要： An object of the present invention is to provide a method for manufacturing a microscopic bolometer film and a bolometer using the same via a simple method.
The present invention relates to a bolometer manufacturing method including: forming an interlayer having a function that enhances binding between a substrate and a semiconducting carbon nanotube, in a predetermined pattern shape on the substrate; and providing a droplet of a semiconducting carbon nanotube dispersion liquid on the formed interlayer.-
公开(公告)号：US20220228922A1
公开(公告)日：2022-07-21
申请号：US17658567
申请日：2022-04-08
IPC分类号： G01J5/53 , H04N5/33 , H04N3/09 , H04N5/365 , G01J3/02 , G01J3/36 , G01J5/00 , G01J3/26 , G01J3/28 , G01J5/20 , G01J5/0806 , G01J5/0802 , G01J5/0804 , G01N21/3504 , G01J3/12
摘要： Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.
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公开(公告)号：US11371890B2
公开(公告)日：2022-06-28
申请号：US17066396
申请日：2020-10-08
申请人： CALUMINO PTY LTD
发明人： Gabrielle de Wit , Marek Steffanson
摘要： Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.
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公开(公告)号：US20220196479A1
公开(公告)日：2022-06-23
申请号：US17240077
申请日：2021-04-26
发明人： BOR-SHIUN LEE , MING-FA CHEN
摘要： A microelectromechanical infrared sensing device is provided, which includes a substrate, a sensing plate, a reflecting plate, a plurality of first supporting elements, a plurality of second supporting elements and a plurality of stoppers. The second supporting elements are connected to the sensing plate, such that the sensing plate is suspended above the substrate. The reflecting plate is disposed between the substrate and the sensing plate. The first supporting elements are connected to the reflecting plate, such that the reflecting plate is suspended between the substrate and the reflecting plate. When the reflecting plate moves toward the substrate and at least one of the stoppers contacts the substrate or the reflecting plate, the distance between the reflecting plate and the sensing plate increases.
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