Systems and methods for logging data in harsh environments

    公开(公告)号:US11598674B2

    公开(公告)日:2023-03-07

    申请号:US15778121

    申请日:2016-11-14

    摘要: Systems and methods of the present invention allow to determine ambient gas temperature in harsh environments such as in a steam autoclave chamber during a sterilization process. In certain embodiments of the invention, temperature data is gathered using a sensor that is placed in an enclosed electronics-based temperature logging device. A capsule seals the temperature logging device except for a through hole that, during regular operation, allows gas to directly contact a surface of the temperature logging device in order to reduce a time lag between the data logging device and an ambient gas. As a result, the data logging device accurately can track temperature variations when placed, for example, inside a chamber.

    Temperature control device
    3.
    发明授权

    公开(公告)号:US11577251B2

    公开(公告)日:2023-02-14

    申请号:US16461913

    申请日:2017-11-02

    申请人: EVONETIX LTD

    摘要: A temperature control device (2) comprises a number of active thermal sites (6) disposed at respective locations on a substrate (10), each comprising a heating element (13) for applying a variable amount of heat to a corresponding site of a medium and a thermal insulation layer (16) disposed between the heating element and the substrate. At least one passive thermal region (8) is disposed between the active thermal sites (6) on the substrate (10), each passive thermal region (8) comprising a thermal conduction layer (18) for conducting heat from a corresponding portion of the medium to the substrate (10). The thermal conduction layer (18) has a lower thermal resistance in a direction perpendicular to a plane of the substrate (10) than the thermal insulation layer (16). This enables precise control over both heating and cooling of individual sites in a flowing fluid, for example.

    On-chip temperature sensor circuits

    公开(公告)号:US11530954B2

    公开(公告)日:2022-12-20

    申请号:US16528230

    申请日:2019-07-31

    发明人: Lui Lam

    IPC分类号: G01K7/01 G01K15/00

    摘要: A diode voltage from a diode circuit can be combined with a proportional to absolute temperature (PTAT) voltage generated by a PTAT circuit to determine a temperature sensor voltage. This temperature sensor voltage may correspond to a temperature of a circuit or a localized temperature. By determining the temperature sensor voltage using a combination of a PTAT voltage and diode voltage, it is possible to remove or a PTAT circuit used to generate a bandgap voltage, which may shrink the temperature sensor and increase the accuracy of the temperature sensor circuit.

    Apparatus for Producing an Electrical Signal That is Indicative of a Temperature

    公开(公告)号:US20220326091A1

    公开(公告)日:2022-10-13

    申请号:US17639239

    申请日:2020-08-27

    IPC分类号: G01K7/01

    摘要: Apparatus for producing an electrical signal that is indicative of a temperature is disclosed, the apparatus comprising: a first thin-film transistor TFT comprising a first source, a first gate and a first drain, the first drain being configured to receive a reference current; and a second TFT comprising a second source, a second gate and a second drain, the first and second gates both being configured to receive the same gate voltage, wherein the first and second TFTs are configured such that a temperature dependence of the first TFT differs from a temperature dependence of the second TFT, such that an output current at the second TFT and the second drain is dependent on temperature. The temperature dependence of the output current can be controlled by selecting suitable design parameters for the first and second TFTs. A method of designing the apparatus to produce an output current with a target temperature dependence is also disclosed.

    Temperature sensing device and temperature sensing method

    公开(公告)号:US11448556B2

    公开(公告)日:2022-09-20

    申请号:US16996908

    申请日:2020-08-19

    摘要: A temperature sensing device and a temperature sensing method are provided. The temperature sensing device includes a sensor and an analog-to-digital converter. The sensor generates a first sensing result corresponding to an ambient temperature based on a first condition and generates a second sensing result corresponding to the ambient temperature based on a second condition. The second sensing result is different from the first sensing result. The analog-to-digital divides the first sensing result and the second sensing result to obtain a quotient value and generates an output digital code value corresponding to the ambient temperature according to the quotient value.

    METHODS AND APPARATUS FOR MEASURING EDGE RING TEMPERATURE

    公开(公告)号:US20220246453A1

    公开(公告)日:2022-08-04

    申请号:US17728461

    申请日:2022-04-25

    IPC分类号: H01L21/67 G01K7/01

    摘要: An apparatus for measuring a temperature of an assembly that is internal to a process chamber. The apparatus may include a light pipe positioned between a lamp radiation filtering window and the assembly, the light pipe has a first end with a bevel configured to redirect infrared radiation emitted from the assembly through the light pipe and has a second end distal to the first end, an optical assembly configured to collimate, filter, and focus infrared radiation from the second end of the light pipe, an optical detector configured to receive an output from the optical assembly and generate at least one signal representative of the infrared radiation, a temperature circuit that transforms the at least one signal into a temperature value, and a controller that is configured to receive the temperature value and to make adjustments to other process parameters of process chamber based on the temperature value.

    CALIBRATION AND TEMPERATURE SENSING ON INTEGRATED CHRCUIT CHIP

    公开(公告)号:US20220236119A1

    公开(公告)日:2022-07-28

    申请号:US17159956

    申请日:2021-01-27

    申请人: NXP B.V.

    IPC分类号: G01K15/00 G01K7/01

    摘要: An integrated circuit (IC) chip includes a first temperature sensor of a first type and a second temperature sensor of a second type that differs from the first type. A method implemented in the IC chip entails calibrating the second temperature sensor utilizing the first temperature sensor and following the calibrating operation, sensing a temperature of the IC chip utilizing the second temperature sensor. The first temperature sensor may be a bipolar junction transistor-based temperature sensor configured to undergo a voltage calibration. Alternatively, the first temperature sensor may be a thermal-diffusivity-based temperature sensor. The second temperature sensor may be a low power consumption sensor relative to the first temperature sensor, and the first temperature sensor may be powered off following calibration of the second temperature sensor.