公开(公告)号：US20250060348A1

公开(公告)日：2025-02-20

申请号：US18770626

申请日：2024-07-11

Applicant: X-wave Innovations, Inc.

Inventor： Dan Xiang ,  DHEERAJ VELICHETI ,  Adam HARWOOD

IPC: G01K7/34 ,  G01L9/10 ,  G01L9/12

Abstract: The embodiments disclose an LC-resonance sensor system for monitoring internal conditions of an enclosure. The system includes an LC temperature sensor, an LC pressure sensor, and an LC gas species sensor that each have an inductor and capacitor. The system uses a transmitting coil that transmits a wireless signal to each of the LC sensors, and receiving coils for each of the sensors that receive wireless signals from the LC sensors.

公开(公告)号：US12085423B2

公开(公告)日：2024-09-10

申请号：US17313554

申请日：2021-05-06

Applicant: NXP USA, Inc.

Inventor： Keith L. Kraver ,  Pascal Kamel Abouda

IPC: G01D5/24 ,  G01L9/12 ,  G01R27/26

CPC classification number: G01D5/24 ,  G01L9/125 ,  G01R27/2605

Abstract: A sensor interface circuit includes a continuous-time capacitance-to-voltage (C/V) converter having C/V input and output ends, the C/V input end being configured for electrical connection with first and second sense nodes of a capacitive sensor. A filter circuit is electrically coupled to the C/V output ends. The filter circuit has first and second resistors at corresponding first and second filter input ends of the filter circuit, a capacitor connected between first and second filter output ends of the filter circuit, and a chopper circuit interposed between the first and second filter input ends and the first and second filter output ends. A buffer circuit is electrically coupled with the first and second filter output ends of the filter circuit. The filter circuit applies low pass filtering of sense signals from the capacitive sensor before sampling and demodulation operations to reduce high-frequency interference in the sense signals.

公开(公告)号：US12071342B2

公开(公告)日：2024-08-27

申请号：US17971781

申请日：2022-10-24

Applicant: Stathera IP Holdings Inc.

Inventor： Vamsy Chodavarapu ,  George Xereas

IPC: B81C1/00 ,  B81B7/00 ,  G01L9/00 ,  G01L9/12 ,  H03H3/007 ,  H03H9/05 ,  H03H9/10 ,  H03H9/24

CPC classification number: B81C1/00182 ,  B81B7/007 ,  B81C1/00269 ,  B81C1/00301 ,  G01L9/0042 ,  G01L9/0073 ,  G01L9/12 ,  H03H3/0072 ,  H03H3/0073 ,  H03H9/0561 ,  H03H9/1057 ,  H03H9/2405 ,  H03H9/2426 ,  H03H9/2431 ,  H03H9/2436 ,  B81B2203/0307 ,  H03H2009/2442 ,  H03H9/2452 ,  H03H9/2463 ,  H03H9/2473 ,  H03H9/2478

Abstract: MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

公开(公告)号：US20240192071A1

公开(公告)日：2024-06-13

申请号：US18529598

申请日：2023-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine PARK ,  Jihwan Park ,  Kuntack Lee

IPC: G01L9/12

CPC classification number: G01L9/12 ,  H01L21/67051

Abstract: A baffle inspection apparatus is provided and includes: a baffle including a spray surface configured to receive and spray fluid; an upper vessel coupled to the baffle such that the spray surface of the baffle faces downwards; an upper plate above the upper vessel and supporting the upper vessel; a lower vessel below the upper vessel and apart from the upper vessel and the upper plate; a pressure measurement sensor on an upper surface of the lower vessel; a lower plate on a lower surface of the lower vessel and supporting the lower vessel; and a support that supports the upper plate and the lower plate. The upper vessel includes a flow path pipe that is configured to supply the fluid to the baffle so that the fluid is sprayed from the spray surface of the baffle.

公开(公告)号：US20240120894A1

公开(公告)日：2024-04-11

申请号：US18258762

申请日：2021-12-13

Applicant: Robert Bosch GmbH

Inventor： Domenico Tangredi ,  Filippo David ,  Gabriele Cazzaniga ,  Manuel Salvatore Santoro ,  Massimiliano Musazzi

IPC: H03F3/45 ,  G01L9/12

CPC classification number: H03F3/45475 ,  G01L9/12 ,  H03F2200/294

Abstract: An analog front-end architecture for a capacitive pressure sensor with a low-noise amplifier unit for amplification of sensor signals from the sensor. The amplifier unit includes first and second integrator units for integrating charges injected into input terminals of the amplifier unit and for outputting integrated charges to output terminals of the amplifier unit, a feedback unit, and a startup unit. The feedback unit reinjects integrated charges from the integrator unit into the input terminals of the amplifier unit. The startup unit is switchable between first and second switching states and is configured, in the first switching state, to route the charges injected into the input terminals past the first integrator unit into the second integrator unit and from the second integrator unit into the feedback unit, and, in the second switching state, to route charges injected into the input terminals directly into the first integrator unit.

公开(公告)号：US11953399B2

公开(公告)日：2024-04-09

申请号：US18132331

申请日：2023-04-07

Applicant: THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH

Inventor： Siegmar Schmidt ,  William A. Dai ,  Boon Khai Ng

IPC: G01L1/14 ,  G01L7/08 ,  G01L9/00 ,  G01L9/12 ,  G01L19/04 ,  G01L19/06 ,  G01L19/14

CPC classification number: G01L9/0075 ,  G01L1/142 ,  G01L7/082 ,  G01L9/0016 ,  G01L9/0042 ,  G01L9/0044 ,  G01L9/0047 ,  G01L9/0048 ,  G01L9/0072 ,  G01L9/0073 ,  G01L9/12 ,  G01L19/04 ,  G01L19/0618 ,  G01L19/14 ,  G01L19/147

Abstract: Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

公开(公告)号：US11940345B2

公开(公告)日：2024-03-26

申请号：US16721333

申请日：2019-12-19

Applicant: Robert Bosch GmbH

Inventor： Thomas Friedrich ,  Christoph Hermes ,  Hans Artmann ,  Heribert Weber ,  Peter Schmollngruber ,  Volkmar Senz

IPC: G01L9/00 ,  B81B3/00 ,  G01L1/14 ,  G01L9/12

CPC classification number: G01L9/0073 ,  B81B3/0018 ,  G01L1/148 ,  G01L9/12 ,  B81B2201/0264

Abstract: A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.

公开(公告)号：US11927645B2

公开(公告)日：2024-03-12

申请号：US17463753

申请日：2021-09-01

Applicant: Infineon Technologies AG

Inventor： Dan-Ioan-Dumitru Stoica ,  Cesare Buffa ,  Alessandro Caspani ,  Constantin Crisu ,  Victor Popescu-Stroe ,  Bernhard Winkler

IPC: G01R31/64 ,  G01H11/06 ,  G01L9/12 ,  G01R27/26 ,  G01R35/00

CPC classification number: G01R31/64 ,  G01R27/2605 ,  G01R35/00 ,  G01H11/06 ,  G01L9/12

Abstract: A capacitive sensor includes a first electrode structure; a second electrode structure that is counter to the first electrode structure, wherein the second electrode structure is movable relative to the first electrode structure and is capacitively coupled to the first electrode structure to form a capacitor having a capacitance that changes with a change in a distance between the first electrode structure and second electrode structure; a signal generator configured to apply an electrical signal at an input or at an output of the capacitor to induce a voltage transient response at the output of capacitor; and a diagnostic circuit configured to detect a fault in the capacitive sensor by measuring a time constant of the first voltage transient response and detecting the fault based on the time constant and based on whether the first electrical signal is the pull-in signal or the non-pull-in signal.

公开(公告)号：US11765830B2

公开(公告)日：2023-09-19

申请号：US17435158

申请日：2020-12-25

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Lianbin Liu ,  Hengzhen Liang ,  Xu Lu ,  Xiaolong Zhu ,  Qing Gong ,  Hui Wen ,  Ting Qin

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  H05K1/03 ,  G01L9/08 ,  G01L9/02 ,  G01L9/12

CPC classification number: H05K1/144 ,  G01L9/02 ,  G01L9/08 ,  G01L9/12 ,  H05K1/028 ,  H05K1/0218 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A flexible printed circuit and a display device are provided. The flexible printed circuit includes: a plurality of sub-circuit boards arranged in a stack, wherein the plurality of sub-circuit boards include at least a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a cover layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the cover layer away from the substrate film, wherein at least a part of the conductive film is formed as an electrode of the pressure sensor.

公开(公告)号：US20230258521A1

公开(公告)日：2023-08-17

申请号：US18109357

申请日：2023-02-14

Applicant: Langfang Zhichi Power Technology Ltd. ,  Beihang University

Inventor： Tiantong Xu ,  Haiwang Li ,  Zhi Tao ,  Xiaoda Cao ,  Yanxin Zhai ,  Chunhui Yang ,  Haonan Lu ,  Di An ,  Zhiyang Wang ,  Hengyi Wang ,  Kaiyun Zhu ,  Weidong Fang ,  Wenbin Wang ,  Kaibo Lei ,  Wensong Xiao ,  Murun Li ,  Xiao Zhang ,  Yang Feng

IPC: G01L9/12 ,  G01L9/00

CPC classification number: G01L9/12 ,  G01L9/0048

Abstract: Provided are a pressure difference sensor, and a manufacturing method and an application thereof. A manner of bonding three layers of wafers is adopted, and the sensor includes an upper structure, an intermediate structure and a lower structure. Each of the upper structure and the intermediate structure is manufactured by a silicon-on-insulator (SOI) wafer, the lower structure is manufactured by patterned doped intrinsic silicon; and a lead pad of each of the upper electrode, and the intermediate electrode and the lower electrode is located on a corresponding one of three-stepped steps at a side of the pressure difference sensor. Annular through holes are formed around the upper electrode and the lower electrode. A constant capacitance of a capacitance signal outputted by an upper capacitor of the sensor by extending an electric field line path of the constant capacitor part.