Light generator including debris shielding assembly, photolithographic apparatus including the light generator

    公开(公告)号:US11615956B2

    公开(公告)日:2023-03-28

    申请号:US17365112

    申请日:2021-07-01

    发明人: Byeong-hwan Jeon

    摘要: A method of manufacturing an integrated circuit (IC) device includes forming a photoresist layer on a substrate, and exposing the photoresist layer to light by using a photolithographic apparatus including a light generator. The light generator includes a chamber having a plasma generation space, an optical element in the chamber, and a debris shielding assembly between the optical element and the plasma generation space in the chamber, and the debris shielding assembly includes a protective film facing the optical element and being spaced apart from the optical element with a protective space therebetween, the protective space including an optical path, and a protective frame to support the protective film and to shield the protective space from the plasma generation space.

    METHOD FOR OPERATING AN EUV LITHOGRAPHTY APPARATUS, AND EUV LITHOGRAPHY APPARATUS

    公开(公告)号:US20230041588A1

    公开(公告)日:2023-02-09

    申请号:US17970850

    申请日:2022-10-21

    IPC分类号: G03F7/20 G02B5/08 G21K1/06

    摘要: A method for operating an EUV lithography apparatus (1) with at least one vacuum housing (27) for at least one reflective optical element (12) includes operating the EUV lithography apparatus in an exposure operating mode (B), in which EUV radiation (5) is radiated into the vacuum housing, wherein a reducing plasma is generated at a surface (12a) of the reflective optical element in response to an interaction of the EUV radiation with a residual gas present in the vacuum housing. After an exposure pause, in which no EUV radiation is radiated into the vacuum housing, and before renewed operation of the EUV lithography apparatus in the exposure operating mode (B), the EUV lithography apparatus is operated in a recovery operating mode, in which oxidized contaminants at the surface of the reflective optical element are reduced in order to recover a transmission of the EUV lithography apparatus before the exposure pause.

    COUNTERFLOW GAS NOZZLE FOR CONTAMINATION MITIGATION IN EXTREME ULTRAVIOLET INSPECTION SYSTEMS

    公开(公告)号:US20220382046A1

    公开(公告)日:2022-12-01

    申请号:US17333717

    申请日:2021-05-28

    申请人: KLA Corporation

    IPC分类号: G02B27/00 G21K1/06

    摘要: Systems and methods for mitigating and reducing contamination of one or more components of overlay inspection systems are disclosed. Specifically, embodiments of the present disclosure may utilize a counterflow of purge gas through a counterflow nozzle to reduce the presence of contaminants within one or more portions of an inspection system. The system may include a source chamber, one or more vacuum chambers, an intermediate focus housing having an aperture, an illumination source configured to generate and direct illumination through the aperture in an illumination direction, and a counterflow nozzle configured to direct a counterflow of purge gas into the source chamber in a direction opposite the illumination direction.

    X-RAY OPTICAL ARRANGEMENT
    7.
    发明申请

    公开(公告)号:US20220351874A1

    公开(公告)日:2022-11-03

    申请号:US17762477

    申请日:2020-09-23

    IPC分类号: G21K1/06 B23H7/02 B23H9/00

    摘要: A method of manufacturing burr-edged reflecting tile elements for a mosaic X-ray lens configured for forming an X-ray beam comprises steps of: (a) providing a single crystal having first and second faces thereof being parallel therebetween; single crystal having crystallographic planes thereof being parallel to first and second faces of the single crystal; the first face dedicated for reflecting an X-ray beam to be incident thereto; (b) cutting the single crystal by means of a wire electrical discharging machine normally to the main faces. The step of cutting the single crystal comprises moving a wire within a cut in direction from the second face to the first face; such that burrs configured for reflecting the X-ray beam to be incident thereto are formed on edges of the cut.