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公开(公告)号：US11618186B2
公开(公告)日：2023-04-04
申请号：US17371214
申请日：2021-07-09
申请人： Condalign AS
IPC分类号： B29C41/00 , C09J9/02 , H01B1/22 , H01B1/16 , H01B1/24 , H01B1/18 , C09J7/24 , B29C41/02 , B29C41/50 , H01B13/00 , H01F1/28 , H05K3/10 , B29K29/00 , B29K105/16 , B29K505/14 , B29K507/04 , B29L31/34 , C09J201/00
摘要： The invention relates to a method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed. The method comprises arranging the particles by applying an electric field and/or a magnetic field at an interface between a water soluble or a non-water soluble matrix and a matrix comprising a viscous material and particles. After fixating the viscous material, the termination is exposed by dissolving the water soluble or non-water soluble matrix. The invention also relates to articles obtainable by said method, and to the use of said method in various applications.
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公开(公告)号：US20220418104A1
公开(公告)日：2022-12-29
申请号：US17900309
申请日：2022-08-31
申请人： XEROX CORPORATION
发明人： Naveen CHOPRA , Barkev KEOSHKERIAN , Chad Steven SMITHSON , Kurt I. HALFYARD , Michelle N. CHRETIEN
IPC分类号： H05K1/09 , C09D11/52 , C09D11/30 , C09D11/03 , H01L23/00 , H01L23/498 , H01B1/22 , C09D11/037 , H01B1/16 , H01B1/02 , H05K3/34
摘要： The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.
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公开(公告)号：US11510314B2
公开(公告)日：2022-11-22
申请号：US16573590
申请日：2019-09-17
申请人： XEROX CORPORATION
发明人： Naveen Chopra , Barkev Keoshkerian , Chad Steven Smithson , Kurt I. Halfyard , Michelle N. Chretien
IPC分类号： H05K1/05 , H05K3/34 , C09D11/02 , C09D11/03 , C09D11/037 , C09D11/30 , C09D11/38 , C09D11/52 , C09D11/322 , H01B1/02 , H01B1/16 , H01B1/22 , H05K1/09 , H01L23/00 , H01L23/498
摘要： The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.
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公开(公告)号：US20220352396A1
公开(公告)日：2022-11-03
申请号：US17864886
申请日：2022-07-14
发明人： Ryo MITTA , Takenori WATABE , Hiroyuki OHTSUKA
IPC分类号： H01L31/0224 , H01B1/02 , H01B1/16 , H01B1/22 , H01L31/0216 , H01L31/068 , H01L31/18
摘要： An object of the present invention is to provide, at a low cost, a system and a method for manufacturing a solar cell having high conversion efficiency. A solar cell according to the present invention is characterized by including a passivation film that protects a semiconductor substrate, a first finger electrode connected to the semiconductor substrate on a main surface of the semiconductor substrate, a first bus bar electrode that intersects the first finger electrode, and an intermediate layer provided in an intersecting position of the first finger electrode and the first bus bar electrode . The solar cell is characterized in that the first finger electrode and the first bus bar electrode are electrically connected to each other via the intermediate layer.
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公开(公告)号：US11316054B2
公开(公告)日：2022-04-26
申请号：US16322124
申请日：2017-08-03
IPC分类号： H01L31/0216 , H01L31/18 , H01L31/068 , H01L31/0224 , H01B1/02 , H01B1/16
摘要： Solar cell and method of manufacturing a solar cell. The solar cell has a silicon substrate (2) and a layer (4) disposed on a substrate side (2a) of the silicon substrate (2). It further has a contact structure (6) extending through the layer (4) from a cell side (1a) of the solar cell (1) to the silicon substrate (2). The layer (4) is composed of a polycrystalline silicon layer (8) and a tunnel oxide layer (10) interposed between the polycrystalline silicon layer (8) and the silicon substrate (2).
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公开(公告)号：US11254826B2
公开(公告)日：2022-02-22
申请号：US16749220
申请日：2020-01-22
发明人： Wei-Chen Chang , Tsung-Huan Sheng
IPC分类号： C09D5/24 , C09D7/40 , C09D7/61 , C09D7/65 , C09D7/20 , C09D101/26 , C09D161/06 , C09D163/00 , C09D11/52 , C09D11/037 , C09D11/033 , C09D11/14 , C09D11/103 , C09D11/102 , C09D11/322 , C09D11/36 , H01B1/16 , H01B1/22 , H01L31/0224 , H05K1/09
摘要： The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.
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公开(公告)号：US11250972B1
公开(公告)日：2022-02-15
申请号：US16191603
申请日：2018-11-15
摘要： A hybrid cable may include a central strength member and a plurality of buffer tubes helically wrapped around the central member. Each of the plurality of buffer tubes may house at least one optical fiber, and an outer jacket may surround the plurality of buffer tubes and the central strength member. Additionally, the central strength member may include one or more carbon nanotubes capable of transmitting a power signal.
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公开(公告)号：US11211504B2
公开(公告)日：2021-12-28
申请号：US15889950
申请日：2018-02-06
申请人： LG ELECTRONICS INC.
发明人： Haejong Cho , Donghae Oh , Juhwa Cheong , Junyong Ahn
IPC分类号： H01L31/0224 , H01B1/16 , C03C8/18 , C03C4/14 , C03C8/10 , H01L31/0216 , H01L31/0368 , H01L31/068 , H01L31/0236 , H01L31/18
摘要： A solar cell is disclosed. The solar cell includes a first conductive region positioned at a front surface of a semiconductor substrate and containing impurities of a first conductivity type or a second conductivity type, a second conductive region positioned at a back surface of the semiconductor substrate and containing impurities of a conductivity type opposite a conductivity type of impurities of the first conductive region, a first electrode positioned on the front surface of the semiconductor substrate and connected to the first conductive region, and a second electrode positioned on the back surface of the semiconductor substrate and connected to the second conductive region. Each of the first and second electrodes includes metal particles and a glass frit.
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公开(公告)号：US10822511B2
公开(公告)日：2020-11-03
申请号：US15770995
申请日：2016-10-20
发明人： Su Yeon Lee , Young Min Choi , Sun Ho Jeong , Beyong Hwan Ryu , Tae Gon Kim , Sang Jin Oh , Eun Jung Lee , Ye Jin Jo
摘要： An ink composition for photonic sintering and a method or producing the ink composition, the ink composition includes: metal nanoparticles comprising a first metal satisfying interaction formula 1; an organic non-aqueous binder; and a non-aqueous solvent. Interaction formula 1 is A1/A2≤0.2, where A1/A2 is a ratio, in the x-ray photoelectron spectrum on the surface of the first metal, in which first metal 2p3/2 peak area of the oxide of the first metal (A1) is divided by first metal 2p3/2 peak area of the first metal (A2).
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公开(公告)号：US10671907B2
公开(公告)日：2020-06-02
申请号：US16587959
申请日：2019-09-30
发明人： Heinz Schmid , Bernd Gotsmann
IPC分类号： H01L23/532 , G06N3/02 , H01L23/528 , H01B1/16 , H01L43/02 , H01L23/522
摘要： An electrical junction comprising a first pair of leads and a second pair of leads. The first pair of leads and the second pair of leads comprise a Weyl semimetal. The junction comprises an electrical crossing arranged between the leads of the first pair and the leads of the second pair and is configured to provide an electrical connection between the leads of the first pair and the leads of the second pair. A related electrical device and a related neural network may be also presented.
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