CONDUCTIVE FILM, ELECTRODE, AND METHOD FOR PRODUCING CONDUCTIVE FILM

    公开(公告)号:US20240321475A1

    公开(公告)日:2024-09-26

    申请号:US18736757

    申请日:2024-06-07

    IPC分类号: H01B1/08 H01B5/00

    CPC分类号: H01B1/08 H01B5/00

    摘要: A conductive film including: a film including particles of a layered material including one or plural layers; and a titanium oxide. The one or plural layers includes a layer body represented by: MmXn, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, and contains Ti, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less, and a modifier or terminal T existing on a surface of the layer body, wherein T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom, and a proportion of tetravalent titanium to divalent, trivalent, and tetravalent titanium in the conductive film, as determined by X-ray photoelectron spectroscopy, is more than 2% by mol and 57% by mol or less.

    Bus bars
    4.
    发明授权
    Bus bars 有权

    公开(公告)号:US11881332B2

    公开(公告)日:2024-01-23

    申请号:US17423355

    申请日:2020-01-16

    IPC分类号: H01B5/00 H01B5/06 H02G5/08

    CPC分类号: H01B5/06 H02G5/08

    摘要: A bus bar including a main tubular body extending along a longitudinal axis between a first end and a second end, the main tubular body being made of a first electrically conducting material for carrying an electrical current therealong, and the bus bar further including a hollow connection body longitudinally projecting from the first end of the main tubular body and provided with a mounting surface for receiving an electrical connector thereto, the hollow connection body being made a second electrically conducting material for carrying the electrical current between the electrical connector and the main tubular body.

    CONTACT SYSTEM HAVING RELIABLE INSULATION
    6.
    发明公开

    公开(公告)号:US20230335316A1

    公开(公告)日:2023-10-19

    申请号:US18019973

    申请日:2021-07-14

    摘要: A contact system includes a support body, a heat sink configured to contact the support body in an electrically insulated and/or heat-conducting manner, and an electrically insulating layer arranged between the heat sink and the support body. The heat sink has a first surface which is embodied substantially as a flat area and formed with a recess in a region intended for contacting a periphery of a contact area of the support body. The recess forms an unbroken track on the first surface of the heat sink. The contact area of the support body is located on the heat sink in such a way that the recess extends completely along the periphery of the contact area. The insulating layer between the heat sink and the support body is configured to cover the recess in such a way that a dosed channel is formed by the recess and the insulating layer.

    CONDUCTIVE BONDING MATERIAL, BONDING MEMBER INCLUDING THE CONDUCTIVE BONDING MATERIAL, AND BONDING METHOD

    公开(公告)号:US20230053435A1

    公开(公告)日:2023-02-23

    申请号:US17796846

    申请日:2020-09-28

    IPC分类号: H01L21/52 H01B1/02 H01B5/00

    摘要: A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 µm to 1.0 µm, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.