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公开(公告)号：US12132463B2
公开(公告)日：2024-10-29
申请号：US17427613
申请日：2021-02-09
发明人： Wei Cheng , Chengjie Zuo , Jun He
CPC分类号： H03H7/42 , H01F17/0013 , H01P5/10 , H03H7/09 , H03H2001/0085
摘要： Provided are balun circuit structure and balun device, the balun circuit structure comprises unbalanced terminal, first and second balanced terminals, grounded power terminal, first, second, third and fourth inductors. The first terminal of the first inductor is connected to the first terminal of the second inductor, the second terminal of the first inductor is connected to the unbalanced terminal, the second terminal of the second inductor is open-circuited, the first terminal of the third inductor and the first terminal of the fourth inductor are connected to the grounded power terminal, the second terminal of the third inductor is connected to the first balanced terminal, the second terminal of the fourth inductor is connected to the second balanced terminal, the first, second, third and fourth inductors are located in different planes, respectively, the first inductor is coupled to the third inductor, and the second inductor is coupled to the fourth inductor.
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公开(公告)号：US20240347253A1
公开(公告)日：2024-10-17
申请号：US18632985
申请日：2024-04-11
发明人： Kazunori ANNEN , Kenichi TANI
CPC分类号： H01F17/0013 , H01F2017/002 , H01F27/292
摘要： An inductor component includes a base body, a coil inside the base body and helically wound along the axis, and first and second outer electrodes in the base body and electrically connected to the coil. The base body includes first and second end surfaces opposite each other, first and second side surfaces opposite each other, a bottom surface connected between the first and second end surfaces and between the first and second side surfaces, and a top surface opposite the bottom surface. The first and second outer electrodes are at least on the bottom surface. The axis is parallel to the bottom surface and intersects with the first and second side surfaces. The coil includes coil wiring layers stacked along the axis, and a via wiring layer configured to connect adjacent ones of the coil wiring layers in an axial direction, which is a direction of the axis.
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公开(公告)号：US12119152B2
公开(公告)日：2024-10-15
申请号：US15990857
申请日：2018-05-29
发明人： Shingo Ito , Takumi Tanaka
CPC分类号： H01F17/0013 , H01F17/04 , H01F27/2804 , H01F2017/002 , H01F2017/0073 , H01F2017/048 , H01F2027/2809
摘要： A laminate of a laminated coil includes first and second sections in a stacking direction from a first surface toward a second surface. The number of windings of each of coil conductor patterns on insulation resin layers, respectively, in the first region is equal to or more than the number of windings of a coil conductor pattern on an insulation resin layer in the second section, and is more than the number of windings of the coil conductor pattern closest to the second surface in the second section. The number of main conductor portions per unit distance in the first section is more than the number of main conductor portions per unit distance in the second section. The outermost main conductor portion of the coil conductor pattern in the second section has a width more than a width of the main conductor portion of the coil conductor pattern in the first section.
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公开(公告)号：US12112873B2
公开(公告)日：2024-10-08
申请号：US17486196
申请日：2021-09-27
申请人： TDK Corporation
发明人： Hidenori Tsutsui , Kouji Kawamura , Hiromu Sakamoto , Kengo Osada , Takuro Tsuruta , Takeshi Okumura
CPC分类号： H01F17/0013 , H01F27/292 , H01F2017/0073 , H01F2017/0093
摘要： Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.
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公开(公告)号：US20240332170A1
公开(公告)日：2024-10-03
申请号：US18194193
申请日：2023-03-31
发明人： Chien Hung LIU , Harry-HakLay CHUANG , Kuo-Ching HUANG , Yu-Sheng CHEN , Yi Ching ONG , Yu-Jui WU
IPC分类号： H01L23/522 , H01F17/00 , H01F17/06
CPC分类号： H01L23/5227 , H01F17/0033 , H01F17/06 , H01L23/5226 , H01L28/10
摘要： Some implementations described herein provide an inductor device formed in a substrate of a semiconductor device including an integrated circuit device. The inductor device may use one or more conduction layers that are included in the substrate. Furthermore, the inductor device may be electrically coupled to the integrated circuit device. By forming the inductor device in the substrate of the semiconductor device, an electrical circuit including the inductor device and the integrated circuit device may be formed within a single semiconductor device.
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公开(公告)号：US20240331910A1
公开(公告)日：2024-10-03
申请号：US18404044
申请日：2024-01-04
申请人： TDK CORPORATION
发明人： Keito YASUDA , Yusuke Nagai , Makoto Yoshino , Shinichi Sato , Yuya Ishima , Youhei IIDA , Mitsuharu Koike , Takato Sasaki
CPC分类号： H01F17/0013 , H01F27/25
摘要： A coil component includes an element body having a mounting surface, and a terminal electrode disposed on the mounting surface, in which at least a part of the terminal electrode is embedded in the element body, the terminal electrode has an opening penetrating the terminal electrode in a direction orthogonal to the mounting surface, and a part of the element body is disposed in the opening.
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公开(公告)号：US20240304377A1
公开(公告)日：2024-09-12
申请号：US18595764
申请日：2024-03-05
CPC分类号： H01F27/292 , H01F17/0013 , H01F27/323
摘要： An inductor component includes a rectangular parallelepiped element body containing a magnetic material and having a planar main surface, an inductor wiring, and a plurality of columnar wirings. The main surface has a straight side. The inductor wiring includes a pair of pad portions and a wiring main body. The wiring main body has a parallel part extending parallel to the straight side and adjacent to the side without interposing other parts of the inductor wiring therebetween. A dimension in a direction orthogonal to a center line of the wiring main body and parallel to the main surface in the wiring main body is a width dimension, and a shortest distance from the side to the parallel part when viewed through in a direction orthogonal to the main surface is defined as a specific distance. The specific distance is less than the width dimension of the parallel part.
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公开(公告)号：US12084735B2
公开(公告)日：2024-09-10
申请号：US17131605
申请日：2020-12-22
发明人： Gota Shinohara
CPC分类号： C21D8/1211 , C22C45/02 , H01F3/04 , H01F17/04 , H01F27/06 , H01F27/42 , C22C2202/02 , H01F2017/0093
摘要： A metal strip contains a metal magnetic material as a main component, and is formed such that a surface roughness of one main surface is higher than a surface roughness of an other main surface. The other main surface is formed in a smooth surface having a high surface smoothness, and the one main surface is subjected to surface treatment such that a striped pattern composed of a recessed portion and a protruding portion is continuously formed. After a continuous strip is made by a single-roll liquid quenching method, the striped pattern is formed by subjecting one main surface of the continuous strip to surface treatment. A magnetic core is obtained by winding the metal strip in an annular shape, and a coil component, such as a common mode choke coil, is obtained by using the magnetic core. Thus, the metal strip has sufficient toughness and good mechanical strength.
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公开(公告)号：US20240266283A1
公开(公告)日：2024-08-08
申请号：US18185500
申请日：2023-03-17
申请人： VIA LABS, INC.
发明人： Sheng-Yuan LEE
IPC分类号： H01L23/522 , H01F17/00 , H01L23/528
CPC分类号： H01L23/5227 , H01F17/0013 , H01L23/5226 , H01L23/5283 , H01F2017/0073
摘要： A multilayer-type on-chip inductor structure includes an inter-metal dielectric (IMD) layer having an inductor central region, a first metal winding portion disposed in the IMD layer, and a second metal winding portion disposed in the IMD layer and electrically connected to the overlying first metal winding portion. The first metal winding portion includes a first spiral-type coil surrounding the inductor central region and a first open ring-type coil surrounding the first spiral-type coil. The second metal winding portion includes a second spiral-type coil vertically overlapping the first spiral-type coil and the first open ring-type coil, so that the outermost-turn coil of the second spiral-type coil corresponds to the first open ring-type coil.
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公开(公告)号：US12057468B2
公开(公告)日：2024-08-06
申请号：US17144121
申请日：2021-01-07
CPC分类号： H01L28/10 , H01F17/0013 , H01F17/0033 , H01F17/04 , H01F41/046 , H01F2017/0086
摘要： An inductor includes a core and a conductive spiral wound around the core. The core includes a buffer layer, an etch stop layer, and a core material layer sequentially stacked. The core material layer includes a ferromagnetic material. A total area of a vertical projection of the core material layer is smaller than an area occupied by the etch stop layer. The vertical projection of the core material layer falls entirely on the etch stop layer. The etch stop layer horizontally protrudes with respect to the core material layer.
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