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1.发明公开公开(公告)号：US20240364293A1
公开(公告)日：2024-10-31
申请号：US18643015
申请日：2024-04-23
发明人： Vadim OSIPOV , Eun Do KIM , Sung Won KANG
CPC分类号： H03H7/383 , H01F27/085 , H01J37/321 , H01J37/32183
摘要： Disclosed is a mass spectrometer includes a sample introduction part, an ionization part connected to the sample introduction part, and including a plasma coil that ionizes a sample introduced from the sample introduction part, an RF power supply part electrically connected to the ionization part, and that supplies RF power to the ionization part, an ion lens part including an extraction lens being adjacent to the ionization part and a guide lens that guides an ion beam extracted from the extraction lens, and a detection part that detects the ion beam. The RF power supply part include an impedance matching circuit that controls a voltage due to an inductance component of the plasma coil.
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公开(公告)号：US20240363405A1
公开(公告)日：2024-10-31
申请号：US18634671
申请日：2024-04-12
发明人： Masato SAKAMOTO , Tadahiro ISHIZAKA
IPC分类号： H01L21/768 , C23C16/02 , C23C16/06 , C23C16/52 , H01J37/32
CPC分类号： H01L21/76862 , C23C16/0227 , C23C16/06 , C23C16/52 , H01J37/32137 , H01J37/32449 , H01J37/32568 , H01L21/7685 , H01L21/76867 , H01L21/76877 , H01J2237/335
摘要： Provided is a substrate processing method for processing a substrate including a metal layer, the method comprising: supplying a halogen-containing gas to the substrate and reducing a metal oxide film formed on a surface of the metal layer; and supplying a reducing gas to the substrate and decreasing a residue remaining on the metal layer by supplying the halogen-containing gas.
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公开(公告)号：US20240363383A1
公开(公告)日：2024-10-31
申请号：US18621553
申请日：2024-03-29
发明人： Junhyung KIM , Hyunjoo JEON
IPC分类号： H01L21/683 , H01J37/32
CPC分类号： H01L21/6833 , H01J37/32715 , H01J2237/2007 , H01J2237/334
摘要： An electrostatic chuck comprising; an electrostatic chuck body configured to have a step protruding from a lower end thereof in a radial direction, an adhesive layer on an upper surface of the electrostatic chuck body, a ceramic puck configured to be adhered to the adhesive layer and configured to have an edge protruding from the upper surface of the electrostatic chuck body, and a sealing member on a lower portion of an edge of the ceramic puck. The electrostatic chuck body is provided with an installation portion configured to have an inclined surface, and the sealing member is configured to be in contact with the inclined surface.
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公开(公告)号：US20240363316A1
公开(公告)日：2024-10-31
申请号：US18766571
申请日：2024-07-08
发明人： Jin Ho BAE , Min Jae KIM , Geon Bo SIM , Tae Wook YOO
IPC分类号： H01J37/32
CPC分类号： H01J37/32844 , H01J37/321 , H01J37/32807
摘要： A plasma reactor for inductively coupled plasma includes: a ferrite core assembly including a ferrite core stacked body including a plurality of ferrite cores stacked and a first passage portion and a second passage portion arranged in parallel, and a ferrite core accommodating structure; a first chamber body including a first base portion configured to provide a first internal space therein, a first A-extension pipe extending from the first base portion, communicating with the first internal space and accommodated in the first passage portion, and a second A-extension pipe extending from the first base portion; and a second chamber body including a second base portion configured to provide a second internal space therein, a first B-extension pipe extending from the second base portion, and a second B-extension pipe extending from the second base portion.
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公开(公告)号：US20240363315A1
公开(公告)日：2024-10-31
申请号：US18307931
申请日：2023-04-27
发明人： Andrew NGUYEN , Lu LIU , Toan Q. TRAN , Daniel NGUYEN
IPC分类号： H01J37/32 , H01L21/683
CPC分类号： H01J37/32697 , H01J37/32724 , H01L21/6833 , H01J2237/2007 , H01J2237/20235 , H01J2237/24564 , H01J2237/24585 , H01J2237/3321 , H01J2237/3327
摘要： Aspects of the present disclosure generally relate to apparatus and methods for an adjustable de-chucking voltage associated with an electrostatically charged substrate in a processing chamber. An example method of de-chucking a substrate disposed in a process chamber includes processing a substrate in a chamber body, the substrate being coupled to a substrate support comprising a chucking electrode. The method further includes monitoring a property associated with a lift pin assembly movable relative to the chucking electrode via an actuator. The method further includes adjusting a first voltage level applied to the chucking electrode in response to the property associated with the lift pin assembly satisfying one or more criteria.
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公开(公告)号：US20240363313A1
公开(公告)日：2024-10-31
申请号：US18141231
申请日：2023-04-28
CPC分类号： H01J37/32522 , C23C16/4411 , C23C16/52 , H01J2237/002
摘要： An apparatus for controlling the temperature in a processing chamber for semiconductor processing is disclosed herein. In one embodiment, a baffle assembly is configured to direct air flow from a center of a lid of the processing chamber to an outer edge of the lid. The baffle assembly has a baffle center having a side surface and a bottom surface, wherein the bottom surface is ring shaped with a central opening. The baffle assembly has a middle baffle extending outward from the side surface of the baffle center. The baffle assembly has a conical baffle extending inward from the side surface of the baffle center, and a top baffle extending upward from the side surface of the baffle center.
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公开(公告)号：US12133320B2
公开(公告)日：2024-10-29
申请号：US17781298
申请日：2020-12-03
申请人： Plasma Flow, LLC
发明人： Garrett Hill , Andrew Murray
CPC分类号： H05H1/4652 , H01F27/30 , H01F38/14 , H01J37/321
摘要： An induction feed through system for treating a flow of material is disclosed, including a high voltage energy source energizing a low-turn coil wrapped about an outer wall of a reaction chamber. The flow of electricity through the low-turn coil in turn energizes a high-turn coil wrapped about an inner wall disposed within the outer wall of the reaction chamber. An electrode assembly disposed within the reaction chamber is electrically coupled to and energized by the high-turn coil, in turn generating plasma in the reaction chamber. The plasma is used to excite a flow of material through the induction feed through system. The electromagnetic properties of the plasma further provide direct feedback to the low-turn and high-turn coils.
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公开(公告)号：US12132454B2
公开(公告)日：2024-10-29
申请号：US17415546
申请日：2019-12-12
申请人： COMET AG
发明人： Daniel Gruner , Andreas Hartmann , Philippe Dennler , Markus Reiff , André Grede , Anton Labanc
CPC分类号： H03F3/245 , H01J37/32183 , H03F3/195 , H03F1/523 , H03F2200/444 , H03F2200/451 , H03F2200/541
摘要： A radiofrequency, RF, power amplifier, including at least one field-effect transistor, FET, wherein a source terminal of the at least one FET is connected to ground. At least one diode is included, wherein a cathode of the at least one diode is connected to a drain terminal of the at least one FET and an anode of the at least one diode is connected to ground. An output network is connected to the drain terminal of the at least one FET. An input network is connected to a gate terminal of the at least one FET.
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公开(公告)号：US12131937B2
公开(公告)日：2024-10-29
申请号：US17680296
申请日：2022-02-25
IPC分类号： B25J11/00 , B25J9/16 , B25J13/08 , H01J37/32 , H01L21/68 , H01L21/687 , B25J15/00 , H01L21/67
CPC分类号： H01L21/681 , B25J9/1697 , B25J11/0095 , B25J13/08 , H01J37/32642 , H01J37/32807 , H01L21/68707 , B25J15/0014 , G05B2219/36433 , G05B2219/39001 , H01L21/67173
摘要： According to an aspect of the present disclosure, there is provided a transfer system comprising a transfer robot configured to transfer a transfer target object by an end effector based on an operation instruction, and a controller configured to output the operation instruction to the transfer robot, wherein at least any one of the end effector and the transfer target object has at least any one of a sensor and a camera, the controller calculates a relative position between the end effector and the transfer target object based on at least any one of a detected result of the sensor and a captured result of the camera, and the controller determines a teaching position of the end effector with respect to the transfer target object based on the relative position, and outputs the operation instruction to the transfer robot such that the end effector is disposed at the teaching position.
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公开(公告)号：US12131936B2
公开(公告)日：2024-10-29
申请号：US17394359
申请日：2021-08-04
发明人： Keisuke Yoshino , Tatsuyuki Urata
IPC分类号： H01L21/68 , H01J37/32 , H01L21/67 , H01L21/687
CPC分类号： H01L21/681 , H01J37/32642 , H01J37/32733 , H01L21/67259 , H01L21/68707 , H01L21/6875 , H01J2237/334 , H01L21/68
摘要： An alignment apparatus includes a rotational support configured to rotate around a central axis, a rotation actuator, an edge sensor, and control circuitry. The rotational support includes substrate supports configured to concurrently support a substrate, and ring supports configured to concurrently support a focus ring. The rotation actuator is configured to rotate the rotational support around the central axis. The edge sensor is configured to generate an edge signal that changes in accordance with each of an edge position of the substrate and an edge position of the focus ring. The control circuitry is configured to control the rotation actuator to adjust a posture of the substrate to a first target posture based on the edge signal, and to control the rotation actuator to adjust a posture of the focus ring to a second target posture based on the edge signal.
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