公开(公告)号：US20240363514A1

公开(公告)日：2024-10-31

申请号：US18646659

申请日：2024-04-25

申请人： QUALCOMM Incorporated

发明人： Aniket PATIL ,  Hong Bok WE ,  Joan Rey Villarba BUOT

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L24/17 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/81815

摘要： A package comprising a package substrate and a first integrated device coupled to the package substrate through a first plurality of solder interconnects. The package substrate comprises an encapsulated portion, a first metallization portion coupled to a first surface of the encapsulated portion, and a second metallization portion coupled to a second surface of the encapsulated portion. The encapsulated portion comprises a first interconnection portion block, a second interconnection portion block, a plurality of pillar interconnects, and an encapsulation layer at least partially encapsulating the first interconnection portion block, the second interconnection portion block, and the plurality of pillar interconnects. The plurality of pillar interconnects comprises a first plurality of pillar interconnects coupled to the first interconnection portion block and a second plurality of pillar interconnects coupled to the second interconnection portion block.

公开(公告)号：US20240363365A1

公开(公告)日：2024-10-31

申请号：US18769434

申请日：2024-07-11

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Li-Hui Cheng ,  Szu-Wei Lu ,  Ping-Yin Hsieh ,  Chih-Hao Chen

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L21/486 ,  H01L21/561 ,  H01L24/24 ,  H01L24/25 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/24175 ,  H01L2224/25171 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

摘要： A package structure and the manufacturing method thereof are provided. The package structure includes a semiconductor die, conductive through vias, an insulating encapsulant, and a redistribution structure. The conductive through vias are electrically coupled to the semiconductor die. The insulating encapsulant laterally encapsulates the semiconductor die and the conductive through vias, wherein the insulating encapsulant has a recess ring surrounding the semiconductor die, the conductive through vias are located under the recess ring, and a vertical projection of each of the conductive through vias overlaps with a vertical projection of the recess ring. The redistribution structure is electrically connected to the semiconductor die and the conductive through vias.

公开(公告)号：US12133365B2

公开(公告)日：2024-10-29

申请号：US17808995

申请日：2022-06-25

申请人： EvansWerks, Inc.

发明人： Shuaib Badat ,  Justin Eugene Evans ,  Cody Hubman

IPC分类号： H05K7/20 ,  B23P15/26 ,  H01L21/48

CPC分类号： H05K7/20418 ,  B23P15/26 ,  H01L21/4871 ,  H01L21/4878 ,  H01L21/4882 ,  H05K7/20327 ,  H05K7/20336

摘要： Disclosed are systems and methods for cooling electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open, fluid channels on a first core side; providing a cover configured to cover the channels, and the cover further configured to couple to the core to form a leak proof seal. In some embodiments, a leak proof seal can be obtained through an interference fit. In certain embodiments, a leak proof seal can be obtained through a thermal fitting. In one embodiment, the core is shrank through cooling and then placed inside the cover. In some embodiments, the cover is expanded through heating and the core is placed inside the cover. In certain embodiments, the core is a metal core printed circuit board. In one embodiment, an electro-osmotic pump, a gas accumulator, and a heat exchanger can be operationally coupled to the channels.

公开(公告)号：US12132074B2

公开(公告)日：2024-10-29

申请号：US18306222

申请日：2023-04-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Shiang Liao ,  Chih-Hang Tung

IPC分类号： H01L23/495 ,  H01F27/24 ,  H01F27/28 ,  H01F41/04 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L49/02

CPC分类号： H01L28/10 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/041 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01F2027/2809 ,  H01L2224/211 ,  H01L2224/221 ,  H01L2224/95001 ,  H01L2924/1427 ,  H01L2924/19042

摘要： A package includes a first redistribution structure, a second redistribution structure, an inductor, a permalloy core, and a die. The second redistribution structure is over the first redistribution structure. The inductor includes a first portion, a second portion, and a third portion. The first portion is embedded in the first redistribution structure, the third portion is embedded in the second redistribution structure, and the second portion connects the first and third portions of the inductor. The permalloy core is located between the first and third portions of the inductor. The die is disposed adjacent to the second portion of the inductor.

公开(公告)号：US20240355794A1

公开(公告)日：2024-10-24

申请号：US18497039

申请日：2023-10-30

申请人： Samsung Electronics Co., Ltd.

发明人： Choongbin Yim ,  Jongkook Kim ,  Chengtar Wu

IPC分类号： H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H10B80/00

CPC分类号： H01L25/105 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/3738 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L24/83 ,  H01L2224/08145 ,  H01L2224/08235 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83862 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1436 ,  H01L2924/15153 ,  H01L2924/3511

摘要： A semiconductor package may include: a redistribution layer structure; a semiconductor structure on the redistribution layer structure; a printed circuit board on the redistribution layer structure and extending around a side surface of the semiconductor structure; a molding material extending around the semiconductor structure on the redistribution layer structure; and a silicon interposer on the printed circuit board and the molding material.

公开(公告)号：US20240355699A1

公开(公告)日：2024-10-24

申请号：US18137187

申请日：2023-04-20

申请人： CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION

发明人： Hyoung Soon LEE ,  Dae Young KONG

IPC分类号： H01L23/367 ,  H01L21/48

CPC分类号： H01L23/367 ,  H01L21/4882

摘要： A semiconductor device thermal management module includes a thermal diffusion plate stacked on a semiconductor device for thermal diffusion of the semiconductor device and a heat spreader provided on the thermal diffusion plate, molded by a three-dimensional (3D) printing method, and having a channel through which a cooling fluid flows.

公开(公告)号：US20240355697A1

公开(公告)日：2024-10-24

申请号：US18762478

申请日：2024-07-02

申请人： Intel Corporation

发明人： Lizabeth Keser ,  Thomas Ort ,  Thomas Wagner ,  Bernd Waidhas

IPC分类号： H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L23/3192 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L23/3128 ,  H01L2224/18 ,  H01L2224/214 ,  H01L2224/95001

摘要： A semiconductor device and method is disclosed. Devices shown include a die coupled to an integrated routing layer, wherein the integrated routing layer includes a first width that is wider than the die. Devices shown further included a molded routing layer coupled to the integrated routing layer.

公开(公告)号：US20240355692A1

公开(公告)日：2024-10-24

申请号：US18761835

申请日：2024-07-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Po-Hao TSAI ,  Wei-Hung LIN ,  Ming-Da CHENG ,  Mirng-Ji LII

IPC分类号： H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L25/18

CPC分类号： H01L23/3121 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/18

摘要： A semiconductor package structure includes first via structures formed through a core substrate. The structure also includes an interposer embedded in the core substrate between the first via structures. The interposer includes second via structures formed through a silicon interposer substrate. The structure also includes a first redistribution layer structure formed over the core substrate. The structure also includes a second redistribution layer structure formed under the core substrate. A coefficient of thermal expansion of the silicon interposer substrate is lower than a coefficient of thermal expansion of the core substrate.

公开(公告)号：US20240355640A1

公开(公告)日：2024-10-24

申请号：US18436934

申请日：2024-02-08

申请人： Samsung Electronics Co., Ltd.

发明人： Youngja Kim ,  Minwoo Jeon

IPC分类号： H01L21/48 ,  B23K1/012 ,  B23K101/40 ,  H01L21/67

CPC分类号： H01L21/4853 ,  B23K1/012 ,  H01L21/4867 ,  H01L21/67109 ,  B23K2101/40

摘要： In a method of manufacturing an electronic device, a substrate including a plurality of bonding pads on a first surface thereof is provided. Solder members are attached on the plurality of bonding pads respectively. An airflow control cover is positioned on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes that allows air to flow toward the solder members. The substrate on which the airflow control cover is positioned is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to place the heat transfer fluid in a vapor state within the chamber. The solder members are soldered by supplying the heat transfer fluid in the vapor state to surfaces of the solder members through the vapor passage holes of the airflow control cover.

公开(公告)号：US12125807B2

公开(公告)日：2024-10-22

申请号：US18377193

申请日：2023-10-05

申请人： James Curtis

发明人： James Curtis

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H01L23/552

CPC分类号： H01L23/564 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552

摘要： A gift card system and method for purchasing both physical and digital gift cards at a kiosk, both physical and virtual, is disclosed. The system/method includes a gift card distribution kiosk located at a retail establishment or online that provides a user with access to a multitude of different forms of gift cards that may be purchased and printed onto a customizable card with a personalized message. The kiosk includes a kiosk processor interface, a gift card dispenser, a card reader and gift card management server connected to a network. The gift card management server, through the kiosk processor interface, provides vendor options to users to select and pay via the card reader. The kiosk may be used to redeem unused user gift cards for a reduced value user selected gift card, reduced cash value, full value store card, rewards points, bank debit, and/or electronic code user towards online purchases.