公开(公告)号：US20240363382A1

公开(公告)日：2024-10-31

申请号：US18140155

申请日：2023-04-27

申请人： Applied Materials, Inc.

发明人： Ulrich Oldendorf

IPC分类号： H01L21/677 ,  B65G54/02 ,  F16F15/00

CPC分类号： H01L21/67709 ,  B65G54/02 ,  F16F15/002

摘要： An electronic device manufacturing system including a substrate carrier configured to secure a substrate during processing and a controller, operatively coupled to the substrate carrier. The controller is configured to perform operations comprising receiving a set of input values associated with moving the substrate carrier from a first position to a second position along a magnetic levitation track. The operations further comprise determining, based on the set of input values, one or more corrective signals to apply to the substrate carrier during movement of the substrate carrier along the magnetic levitation track. The operations further comprise generating a magnetic field to move the substrate carrier on a direction along the magnetic levitation track and applying, to the substrate carrier, the one or more corrective signals to reduce vibrations that would be experienced by a substrate held by the substrate carrier due to a motion of the substrate carrier.

公开(公告)号：US20240363379A1

公开(公告)日：2024-10-31

申请号：US18768356

申请日：2024-07-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tzu-Chin Huang

IPC分类号： H01L21/673 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/67386 ,  H01L21/67775 ,  H01L21/681 ,  G05B2219/39024 ,  G05B2219/39527

摘要： A calibration pod for calibrating a robotic wafer pod handling apparatus includes a pod body configured for handling by the robotic pod handling apparatus, at least one laser disposed on a bottom of the pod body, and a power module disposed on or in the pod body and operatively connected to power the at least one laser. In a manufacturing method, the pod body comprises a wafer carrier for carrying a cassette of semiconductor wafers, which has a bottom with a plurality of holes for aligning placement of the wafer carrier in a load port of a semiconductor device fabrication facility. The at least one laser here includes a plurality of lasers corresponding to the plurality of holes in the bottom of the wafer carrier, and each laser is mounted in a respective hole of the bottom of the wafer carrier.

公开(公告)号：US20240355660A1

公开(公告)日：2024-10-24

申请号：US18761592

申请日：2024-07-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wei-Chih LIAO ,  Shih-Yu TSENG

IPC分类号： H01L21/677 ,  B65G47/90 ,  H01L21/687

CPC分类号： H01L21/67742 ,  B65G47/90 ,  H01L21/67706 ,  H01L21/67745 ,  H01L21/67778 ,  H01L21/68707

摘要： Air curtain devices can reduce defects on semiconductor wafers when implemented on a track equipped with robotic wafer transport. The air curtain devices can be added to one or more processing devices arranged along the track to prevent defects from landing on wafer surfaces. For example, the air curtain devices can prevent volatile organic solvent mist from drifting towards processing devices on the track and preventing contamination via a wafer transport system.

公开(公告)号：US20240355659A1

公开(公告)日：2024-10-24

申请号：US18758239

申请日：2024-06-28

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Wei-Chih CHEN ,  Shi-Chi CHEN ,  Ting-Wei WANG ,  Jen-Ti WANG ,  Kuo-Fong CHUANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67733 ,  H01L21/67259 ,  H01L21/67706

摘要： A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport device, reading data of a rail mark located on the transport rail; aligning an orientation of the wafer transport device according to the data of the rail mark; after aligning the orientation of the wafer transport device according to the data of the rail mark, aligning the wafer transport device with respect to a top surface of the load port; after aligning the wafer transport device with respect to the top surface of the load port, lowering the hoist unit.

公开(公告)号：US20240355614A1

公开(公告)日：2024-10-24

申请号：US18762434

申请日：2024-07-02

申请人： ACM RESEARCH (SHANGHAI), INC.

发明人： Hui Wang ,  Zhiyou Fang ,  Jun Wu ,  Guanzhong Lu ,  Fuping Chen ,  Jian Wang ,  Jun Wang ,  Deyun Wang

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/02052 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67781

摘要： An apparatus for cleaning semiconductor wafers includes a plurality of load ports; at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; and one or more single wafer cleaning modules. The apparatus further includes: a first turnover device, configured to rotate the one or more wafers from horizontal plane to vertical plane so that the one or more wafers can be vertically transferred to the at least one first tank; and a second turnover device, configured to rotate the one or more wafers from vertical plane to horizontal plane so that the one or more wafers can be horizontally transferred to the one or more single wafer cleaning modules.

公开(公告)号：US20240347363A1

公开(公告)日：2024-10-17

申请号：US18752315

申请日：2024-06-24

申请人： Taiwan Semiconductor Manufacturing Company, LTD.

发明人： Sung-Ju Huang ,  Kuang-Wei Cheng ,  Cheng-Lung Wu ,  Yi-Fam Shiu ,  Chyi-Tsong Ni

IPC分类号： H01L21/677 ,  H01L21/673

CPC分类号： H01L21/67742 ,  H01L21/67389 ,  H01L21/67766

摘要： The present disclosure relates to systems and methods for reducing the humidity within a FOUP (Front Opening Unified Pod) when loaded on an EFEM (Equipment Front End Module) for transfer of a semiconductor wafer substrate during fabrication processes. A deflector of specified structure is placed inside the EFEM above the load port of the FOUP. The deflector directs airflow in the EFEM away from the load port. The deflector includes a body with a plurality of apertures in the deflector body, and with a sloped front surface. Thus, the degree of penetration of high-humidity air from the EFEM into the FOUP is reduced.

公开(公告)号：US20240347345A1

公开(公告)日：2024-10-17

申请号：US18751423

申请日：2024-06-24

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Han-Yu Lin ,  Yi-Ruei Jhan ,  Fang-Wei Lee ,  Li-Te Lin ,  Pinyen Lin ,  Tze-Chung Lin

IPC分类号： H01L21/311 ,  C23C16/452 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/311 ,  C23C16/452 ,  H01L21/31116 ,  H01L21/67063 ,  H01L21/67069 ,  H01L21/67098 ,  H01L21/67103 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67225 ,  H01L21/67248 ,  H01L21/67748

摘要： A semiconductor fabrication apparatus includes a processing chamber for etching, a substrate stage integrated in the processing chamber and being configured to secure a semiconductor wafer, and a gas distribution plate integrated inside the processing chamber. The processing chamber includes a sidewall and a top surface. The semiconductor fabrication apparatus further includes a heating mechanism disposed on the sidewall of the processing chamber and is operable to perform a baking process to remove a by-product generated during the etching, and a reflective mirror configured inside the processing chamber to reflect thermal energy from the heating mechanism toward the semiconductor wafer, the reflective mirror being located on the top surface of the processing chamber. The gas distribution plate defines a portion of the top surface of the processing chamber. From a top view, a portion of the reflective mirror is disposed between the heating mechanism and the gas distribution plate.

公开(公告)号：US12119253B2

公开(公告)日：2024-10-15

申请号：US17620967

申请日：2020-05-08

申请人： Murata Machinery, Ltd.

发明人： Wataru Kitamura

IPC分类号： H01L21/677 ,  B65G1/04

CPC分类号： H01L21/67733 ,  B65G1/0457 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/6773 ,  B65G2201/0297

摘要： A transport vehicle includes: a traveler; a transferer that is mounted on the traveler and receives or delivers an article from or to a transfer destination; and an antenna that is provided so that at least the position or the posture thereof can be changed to follow the action of the transferer, and that performs wireless communication with another device.

公开(公告)号：US12119251B2

公开(公告)日：2024-10-15

申请号：US17647367

申请日：2022-01-07

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Yi-Fam Shiu ,  Yu-Chen Chen ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： H01L21/677 ,  B23Q15/00 ,  B23Q16/00 ,  G05D5/04 ,  H01L23/04

CPC分类号： H01L21/6773 ,  B23Q15/00 ,  B23Q16/00 ,  G05D5/04 ,  H01L21/67736 ,  H01L21/67778 ,  H01L23/04

摘要： A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

公开(公告)号：US12116021B2

公开(公告)日：2024-10-15

申请号：US17288938

申请日：2019-09-13

申请人： MURATA MACHINERY, LTD.

发明人： Haruki Ogo ,  Yasuhisa Ito

IPC分类号： B61B3/02 ,  B61B13/00 ,  B61B13/06 ,  B65G1/04 ,  B66C7/02 ,  B66C7/08 ,  B66C7/12 ,  B66C9/02 ,  B66C9/04 ,  B66C9/16 ,  H01L21/677 ,  B61B13/04

CPC分类号： B61B3/02 ,  B61B13/00 ,  B61B13/06 ,  B65G1/0457 ,  B65G1/0478 ,  B66C7/02 ,  B66C7/08 ,  B66C7/12 ,  B66C9/02 ,  B66C9/04 ,  B66C9/16 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67733 ,  B61B13/04 ,  B65G2201/0297 ,  H01L21/6773

摘要： A traveling vehicle system includes a track including a first gap, a partial track, and a second gap, a traveling vehicle including a drive wheel and first and second auxiliary wheels, a first auxiliary track on a near side of the first gap in a traveling direction and in contact with a lower end of the first auxiliary wheel while a lower end of the drive wheel passes through the first gap when the drive wheel enters the partial track, and a second auxiliary track on a far side of the second gap in the traveling direction and in contact with a lower end of the second auxiliary wheel while the lower end of the drive wheel passes through the second gap when the drive wheel leaves the partial track.