公开(公告)号：US12237448B2

公开(公告)日：2025-02-25

申请号：US18358435

申请日：2023-07-25

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Jong Min Lee ,  Bang Hyun Kim ,  Jae Ho Lee

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

Abstract: A light emitting module including a substrate, a first light emitter and a second light emitter disposed on the substrate and spaced apart from each other, an isolation layer disposed between the first and second light emitters, and a light diffusion layer and a wavelength converter disposed on the first and second light emitters, in which the first and second light emitters include first and second light emitting regions spaced apart from each other, respectively, the wavelength converter includes a first wavelength conversion layer covering the second light emitting region, and a second wavelength conversion layer covering the first light emitting region, the light diffusion layer covers an upper surface of the first and second wavelength conversion layers, and a region between the first and second wavelength conversion layers has an area vertically overlapped with the isolation layer.

公开(公告)号：US20250056938A1

公开(公告)日：2025-02-13

申请号：US18795517

申请日：2024-08-06

Applicant: NIKKISO CO., LTD.

Inventor： Izumi KIDA ,  Naoki SHIBATA ,  Tetsuhiko INAZU

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62

Abstract: A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element flip-chip bonded on the package substrate; and a sealing member that covers the semiconductor light-emitting element on the package substrate and has translucency at an emission wavelength of the semiconductor light-emitting element. The semiconductor light-emitting element includes an anode electrode and a cathode electrode bonded to the package substrate, a semiconductor layer on the anode electrode and the cathode electrode, and a translucent substrate on the semiconductor layer. The translucent substrate has an upper surface in contact with the sealing member and a side surface in contact with the sealing member between the upper surface and the semiconductor layer, and an area of the side surface is equal to or less than an area of the upper surface.

公开(公告)号：US20250046772A1

公开(公告)日：2025-02-06

申请号：US18717799

申请日：2022-12-08

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Younho HEO ,  Hooyoung SONG

IPC: H01L25/13 ,  H01L33/48 ,  H01L33/62

Abstract: The substrate structure for transferring the pixel semiconductor light emitting device according to the embodiment may include a substrate having a plurality of assembly wiring; a partition wall disposed on the substrate and having an assembly hole into which a predetermined semiconductor light emitting device is assembled; and the partition wall may include a porous structure.

公开(公告)号：US12218296B2

公开(公告)日：2025-02-04

申请号：US17564527

申请日：2021-12-29

Applicant: Henan Fuchi Technology Co., Ltd. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Hsi-Che Chang ,  Jin-Lu Li ,  Bo Chen

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/38 ,  H01L33/48

Abstract: A display screen allowing higher pixel density and thus better screen resolution by virtue of the structures connecting to LED chip light sources includes a substrate, a number of pad structures, the LED chips, and a number of carrier boards. Each pad structure includes a positive electrode pad and three negative electrode pads. Each LED chip package includes a red light chip, a green light chip, and a blue light chip arranged on the three negative electrode pads. Each carrier board includes a positive electrode connection terminal and a negative electrode connection terminal, the positive electrode connection terminal is electrically connected to the positive electrode pad, the negative electrode connection terminal is electrically connected to one red light chip, one green light chip, or one blue light chip. The disclosure also provides a displaying device having the display screen.

公开(公告)号：US20250040312A1

公开(公告)日：2025-01-30

申请号：US18785083

申请日：2024-07-26

Applicant: EPISTAR CORPORATION

Inventor： Tai-Ni CHU ,  Wei-Shan HU ,  Ching-Tai CHENG

IPC: H01L33/48 ,  H01L25/075

Abstract: A semiconductor device arrangement structure includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive part, and a second adhesive part. The first semiconductor device and the second semiconductor device are located on the carrier and separated from each other. The first adhesive part and the second adhesive part are separated from each other. The first adhesive part is located between the first semiconductor device and the carrier, and the second adhesive part is located between the second semiconductor device and the carrier. In a top view, the first adhesive part has a first outer contour surrounding the first semiconductor device. The first outer contour has at least one round corner.

公开(公告)号：US12211959B2

公开(公告)日：2025-01-28

申请号：US17371943

申请日：2021-07-09

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H01L23/495 ,  H01L33/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

Abstract: A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.

公开(公告)号：US12206060B2

公开(公告)日：2025-01-21

申请号：US17828567

申请日：2022-05-31

Applicant: CHANG WAH TECHNOLOGY CO., LTD.

Inventor： Chia-Neng Huang

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L33/38 ,  H01L33/54

Abstract: Disclosed herein is a lead frame assembly including a frame and lead frame units each including a chip holder having first and second electrode pads; and a pin unit having a first pin, a second pin and third pins each extending from the chip holder. The pin unit extending from one of the lead frame units is connected to the pin unit of the adjacent one of the lead frame units. For the lead frame units disposed adjacent to the frame, the pin units extending towards the frame are connected to the frame such that the lead frame units are fixedly positioned within the frame. A chip packaging device including a lead frame body and a packaging structure is also disclosed.

公开(公告)号：US12206046B2

公开(公告)日：2025-01-21

申请号：US18439652

申请日：2024-02-12

Applicant: Micron Technology, Inc.

Inventor： Vladimir Odnoblyudov ,  Martin F. Schubert

IPC: H01L21/00 ,  H01L21/02 ,  H01L33/00 ,  H01L33/08 ,  H01L33/12 ,  H01L33/20 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62

Abstract: Various embodiments of SST dies and solid state lighting (“SSL”) devices with SST dies, assemblies, and methods of manufacturing are described herein. In one embodiment, a SST die includes a substrate material, a first semiconductor material and a second semiconductor material on the substrate material, an active region between the first semiconductor material and the second semiconductor material, and a support structure defined by the substrate material. In some embodiments, the support structure has an opening that is vertically aligned with the active region.

公开(公告)号：US12199224B2

公开(公告)日：2025-01-14

申请号：US17421950

申请日：2020-01-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Jens Eberhard

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

Abstract: In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.

公开(公告)号：US12191427B2

公开(公告)日：2025-01-07

申请号：US16960695

申请日：2019-02-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Jung Hun Oh ,  Ki Cheol Kim ,  Kwang Ki Choi

IPC: H01L23/34 ,  H01L33/58 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60

Abstract: An embodiment provides a semiconductor device package and a light emitting device comprising same, the semiconductor device package comprising: a body including a first cavity; and a semiconductor device disposed within the first cavity, wherein: the first cavity includes a first surface inclined such that the area of the cavity gradually increases as going away from the semiconductor device, and a plurality of second surfaces perpendicular to the upper surface of the semiconductor device; the body includes a first outer surface and a third outer surface that are opposite to each other, a second outer surface and a fourth surface that are opposite to each other, a first corner portion disposed in a region where the first and second outer surfaces meet each other, a second corner portion disposed in a region where the second and third outer surfaces meet each other, a third corner portion disposed in a region where the third and fourth outer surfaces meet each other, and a fourth corner portion disposed in a region where the fourth and first outer surfaces meet each other; and the plurality of second surfaces are disposed between the first and second corner portions, between the second and third corner portions, between the third and fourth corner portions, and between the fourth and first corner portions, respectively.