公开(公告)号：US20230124794A1

公开(公告)日：2023-04-20

申请号：US17964463

申请日：2022-10-12

申请人： Lumileds LLC

发明人： Nicola Bettina Pfeffer ,  Arjen Gerben Van der Sijde ,  Antonio Lopez Julia

IPC分类号： H01L33/54 ,  H01L33/20 ,  H01L33/32 ,  H01L33/46

摘要： A structure and method of micro-LEDs are described. The micro-LEDs have a GaN semiconductor structure containing a multi-quantum well active region configured to emit light of a visible wavelength range and a structure to increase specular reflection of ambient light by proving scattering at one or more interfaces of the micro-LEDs. The interfaces include the air-encapsulant interface, semiconductor-encapsulant interface, or semiconductor-contact interface.

公开(公告)号：US11631791B2

公开(公告)日：2023-04-18

申请号：US17214992

申请日：2021-03-29

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Mi Jeong Yun ,  Jong Sup Song

IPC分类号： H01L33/50 ,  H01L27/15 ,  H01L33/56 ,  H01L33/54 ,  H01L33/60 ,  H01L33/58

摘要： A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.

公开(公告)号：US20230114578A1

公开(公告)日：2023-04-13

申请号：US18080747

申请日：2022-12-14

申请人： Innolux Corporation

发明人： Jia-Yuan Chen ,  Tsung-Han Tsai ,  Kuan-Feng Lee ,  Yuan-Lin Wu

IPC分类号： H01L33/54 ,  H01L33/48

摘要： An electronic device including a substrate and at least one light emitting unit is provided. The at least one light emitting unit is disposed on the substrate. The at least one light emitting unit includes a light emitting diode and a protective layer. The protective layer includes a portion overlapped with the light emitting diode, and the portion has a concave part adjacent to an edge of the light emitting diode in a top view of the electronic device.

公开(公告)号：US20230113565A1

公开(公告)日：2023-04-13

申请号：US17905192

申请日：2021-02-01

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： SHUNSUKE FURUSE ,  HIROTAKA YOSHIOKA

IPC分类号： H01L33/54 ,  H01L33/58 ,  H01L33/62

摘要： Provided is a light-emitting device and a method for manufacturing the same which allow the filling performance of the film that fills the space around light-emitting elements to be improved. The light-emitting device according to the disclosure includes a substrate, a plurality of light-emitting elements and a plurality of electrodes sequentially provided on a first surface of the substrate, and a film provided on the first surface of the substrate to surround the light-emitting elements, and when the first surface is a bottom surface of the substrate, the lowermost part of a bottom surface of the film is provided in a higher position than a bottom surface of the electrode. In this way, for example, the film is formed before the substrate is provided on another substrate, so that the filling performance of the film that fills the space around the light-emitting elements can be improved.

公开(公告)号：US11626543B2

公开(公告)日：2023-04-11

申请号：US16920243

申请日：2020-07-02

申请人： NICHIA CORPORATION

发明人： Tomonori Miyoshi ,  Kenji Ozeki ,  Tomoaki Tsuruha

IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L33/48 ,  H01L33/58 ,  H01L33/56 ,  H01L33/60 ,  H01L33/64 ,  H01L25/16 ,  H01L27/15

摘要： A light emitting apparatus includes: an electrically insulating base member that has first and second sides extending in a width direction, and third and fourth sides extending in a length direction, wherein the third and fourth sides are longer than the first and second sides; a plurality of electrically conductive pattern portions; a plurality of light emitting devices mounted on the electrically conductive pattern portions, the light emitting devices being arrayed in the length direction; a protection element that is flip chip mounted on the electrically conductive pattern portions and located, in the plan view, between the light emitting devices and the third side of the base member in the width direction; a first resin part that has a frame shape; a second resin part that is located in the first resin part; and at least one transparent member located on the light emitting devices.

公开(公告)号：US11605654B2

公开(公告)日：2023-03-14

申请号：US17162915

申请日：2021-01-29

申请人： LG DISPLAY CO., LTD.

发明人： HanSaem Kang ,  HyeonHo Son

IPC分类号： H01L27/12 ,  H01L25/075 ,  H01L25/16 ,  H01L33/08 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/52 ,  H01L33/62

摘要： A display device includes a pixel on a substrate. The pixel includes a gate line and a data line on the substrate; a pixel circuit configured to be electrically connected to the gate line and the data line; a light emitting device configured to be electrically connected to the pixel circuit; and a planarization layer configured on the pixel circuit to cover the light emitting device, wherein the light emitting device is surrounded by the planarization layer.

公开(公告)号：US11605617B2

公开(公告)日：2023-03-14

申请号：US17039044

申请日：2020-09-30

申请人： NICHIA CORPORATION

发明人： Takuya Nakabayashi ,  Yukiko Yokote

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L33/48 ,  H01L33/64

摘要： A light emitting device includes: a substrate including a base member including an upper surface, a lower surface and one or more lateral surfaces, and defining a recess that is opened at the upper surface and the lateral surfaces and surrounds an outer perimeter of the upper surface; a first light emitting element; a second light emitting element; a light guide member covering the first and the second light emitting elements and the upper surface of the base member; and a first reflective member having a closed-ring shape surrounding the upper surface of the base member and the light guide member, a portion of the first reflective member being located in the recess. At least one of the lateral surfaces of the base member and corresponding at least one of one or more outer lateral surfaces of the first reflective member are in the same plane.

公开(公告)号：US20230068464A1

公开(公告)日：2023-03-02

申请号：US17983995

申请日：2022-11-09

申请人： NICHIA CORPORATION

发明人： Toru HASHIMOTO

IPC分类号： H01L33/56 ,  H01L33/00 ,  H01L33/64 ,  H01L33/54

摘要： A method for manufacturing a light-emitting device includes providing a transparent member having a protrusion formed at an upper surface of the transparent member. A first resin portion is placed on the protrusion in which the first resin portion has a solid form and is made from a first resin material of which the viscosity decreases when heated. A light-emitting element is placed on the first resin portion, the light-emitting element is caused to be self-aligned with respect to the protrusion by reducing a viscosity of the first resin portion by heating to a first temperature. The first resin portion is solidified by cooling.

公开(公告)号：US20230067018A1

公开(公告)日：2023-03-02

申请号：US17974666

申请日：2022-10-27

申请人： NICHIA CORPORATION

发明人： Motokazu YAMADA ,  Yuichi YAMADA

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  G02F1/13357 ,  H01L33/46 ,  F21V7/00 ,  F21V9/08 ,  F21V23/00 ,  H01L33/58

摘要： A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.

公开(公告)号：US11581458B2

公开(公告)日：2023-02-14

申请号：US17162913

申请日：2021-01-29

申请人： NICHIA CORPORATION

发明人： Kazuma Kozuru ,  Kiyoshi Enomoto

IPC分类号： H01L33/48 ,  H01L23/00 ,  H01L33/38 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64

摘要： A base member for a light emitting device includes a bottom part and a frame part. The frame part has an upper surface, a lower surface, and a step portion. The frame part has a bonding surface bonded to the bottom part, and defining a planar surface of the step portion at a lower surface side, first and second inner surfaces, a first planar surface defining a planar surface of the step portion at an upper surface side, and first and second electrode layers electrically connected to each other, the second electrode layer being disposed on the first planar surface while the first electrode layer being not disposed on the first planar surface. The step portion extends along an entire periphery of the frame part in a bottom view, and the step portion does not extend along the entire periphery of the frame part in a top view.